电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

TMM-139-01-F-Q

产品描述Board Connector, 156 Contact(s), 4 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal, Locking, Black Insulator,
产品类别连接器    连接器   
文件大小944KB,共1页
制造商SAMTEC
官网地址http://www.samtec.com/
标准  
下载文档 详细参数 全文预览

TMM-139-01-F-Q概述

Board Connector, 156 Contact(s), 4 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal, Locking, Black Insulator,

TMM-139-01-F-Q规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1092223282
Reach Compliance Codecompliant
Factory Lead Time3 weeks
YTEOL8.7
其他特性LOW PROFILE
主体宽度0.315 inch
主体深度0.059 inch
主体长度3.081 inch
连接器类型BOARD CONNECTOR
联系完成配合GOLD FLASH (3)
联系完成终止Matte Tin (Sn) - with Nickel (Ni) barrier
触点性别MALE
触点材料PHOSPHOR BRONZE
触点模式RECTANGULAR
触点样式SQ PIN-SKT
DIN 符合性NO
滤波功能NO
IEC 符合性NO
绝缘体颜色BLACK
绝缘体材料LIQUID CRYSTAL POLYMER
JESD-609代码e3
MIL 符合性NO
插接触点节距0.079 inch
匹配触点行间距0.079 inch
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装选项1LOCKING
安装方式STRAIGHT
安装类型BOARD
连接器数ONE
PCB行数4
装载的行数4
最高工作温度125 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
PCB接触模式RECTANGULAR
PCB触点行间距2 mm
电镀厚度3u inch
极化密钥POLARIZED HOUSING
额定电流(信号)3.2 A
参考标准UL
可靠性COMMERCIAL
端子长度0.138 inch
端子节距2 mm
端接类型SOLDER
触点总数156

文档预览

下载PDF文档
F-215
TMM–116–02–F–S
TMM–108–01–T–D
TMM–108–03–F–Q
TM
(2,00 mm) .0787"
TMM–112–01–L–D–RA
TMM SERIES
LOW PROFILE THROUGH-HOLE HEADER
SPECIFICATIONS
For complete specifications
see www.samtec.com?TMM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over
50µ" (1,27 µm) Ni
Current Rating (SMM/TMM):
3.2 A per row
(1 pin powered per row)
Operating Temp Range:
-55°C to +105°C with Tin;
-55°C to +125°C with Gold
Voltage Rating:
500 VAC mated with SQW
450 VAC mated with SQT
RoHS Compliant:
Yes
Lead–Free Solderable:
Yes
Mates with:
CLT, SQT, SQW, ESQT,
TLE, SMM, MMS, TCSD
Single, double
and quad row
Ultra-low profile
(1,50 mm) .059"
APPLICATION
Choice
of five
lead styles
APPLICATIONS
SQT TMM
Retention Clip Option (–RC)
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
(2,00 mm)
.0787"
(2,00 mm)
.0787" pitch
HORIZONTAL
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
TMM
1
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
below.
LEAD
STYLE
– 01
PLATING
OPTION
ROW
OPTION
OTHER
OPTION
FILE NO: 090871_0_000
ALSO AVAILABLE
(MOQ Required)
• Other platings
Contact Samtec.
–F
= Gold flash
on post,
Matte Tin on tail
–S
= Single Row
01 thru 50
–RA &
–RE
= Right Angle
(Lead Style
–01 only)
(2 positions
minimum, –Q
row)
–D
= Double Row
–L
C
= 10µ" (0,25 µm)
Gold on post,
Matte Tin on tail
Other Solutions
Press Fit
See PTT Series.
50
02
No. of positions x
(2,00) .0787
(1,97)
.078
–Q
= Four Row
A
B
01
100
–02
– 03
(3,94)
.155
Elevated
See TW Series.
01
99
200
– 04
– 05
– 06
High
Density
See TMMH Series.
(6,00)
.236
04
(3,20) (3,50)
.126 .138
(
8,20) (3,70) (3,00)
.323 .146 .118
(4,00) (2,70)
.158 .106
(5,69) (1,91)
.224 .075 (2,29)
(5,43) (1,65) .090
.214 .065
(9,58) (3,20) (4,88)
.377 .126 .192
–S
= 30µ" (0,76 µm)
Gold on post,
Matte Tin on tail
–RC
(3,05)
.120
(3,20)
.126
(2,00)
.0787
(1,27)
.050
(2,00).0787
–Q –RA
(3,05) .120
(3,20)
.126
–T
= Matte Tin
= Retention Clip
(Mates with
TCSD)
(Double row only,
4 positions
minimum, only
available –06
lead style)
–“XXX”
= Polarized
Position
(Specify position
of omitted pin)
(8,00)
.315
Shrouded
Four Row
Vertical &
Right Angle
See TMMS Series.
Paste In Hole (PIH) processing.
Contact Samtec ASP Group for
part customization.
01
197
–RC
(1,50)
.059
(2,00) .0787
(0,50) .020 SQ
(3,05)
.120
B
A
C
OPTION
(2,00)
.0787
D
(1,27)
.050
(3,56)
.140
– RA
–RE
D
–D
–Q
–RA & –RE
(2,00) .0787
–S
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
DSP28335的_程序设计步骤
DSP的设计步骤,小编总结了一下,在这里给大家分享一下。 关于 DSP28335的初步应用:程序设计步骤: 对DSP进行开发时,需要对其底层的硬件及外设进行相应的配置,当配置完成后才可以将其 ......
Jacktang DSP 与 ARM 处理器
基于TI sensor tag的家用蓝牙组网
优惠购买了TI sensor tag后就开始动手准备了!后来买 了一块TI的CC debug(这个1.27间距的10pin下载线真难找呀) 整个系统分成三个模块: 服务模块(OMAP3530其实没必要用这么高性能的,只是手 ......
wuyanyanke 无线连接
TI estore板子能保修吗?
TI estore板子能保修吗?买回来第一个星期,不小心吃饭时候推了一下,掉地上裂了。 208342 ...
cl17726 嵌入式系统
evc上开发PDA
我想在EVC上开发Windows Mobile 5.0应用程序,想请教大家创建应用程序的步骤? 以前在EVC上开发WinCE应用程序时,主要步骤大致如下: (1)安装所用设备的SDK. (2)新建项目,选择工程类型(如WCE A ......
hjkl645 嵌入式系统
[KW41Z] OpenSDA蓝屏、刷死的解决办法
遇到杯具的事情了,OpenSDA在WIN10 64位下出现蓝屏,在NXP网站得到证实,具体信息看下面网页:http://www.nxp.com/products/software-and-tools/run-time-software/kinetis-software-and-tools/ ......
wm20031015 NXP MCU
拨开C语言中字符串的那些迷雾(持续更新)
《C和指针》大概很多人都看过吧!最近重新整理了一下笔记,发现可能有很多人跟我在一条起跑线上,为了让你们少走弯路 我决定慢慢的把我的体会和笔记挑一些和大家分享,希望能帮到一些人,如果 ......
yaoyong 编程基础

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 10  1971  229  2039  1317  1  40  5  42  27 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved