Approval sheet
MULTILAYER CERAMIC DIPLEXER
RFDIP Series – 2012(0805)- RoHS Compliance
Halogens Free Product
892 MHz & 1.94GHz Band Working Frequency
P/N: RFDIP2012090G3T
*Contents in this sheet are subject to change without prior notice.
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ASC_RFDIP2012090G3T_V01
Sep. 2012
Approval sheet
FEATURES
1.
2.
3.
Miniature footprint: 2.0 X 1.2 X 0.9 mm
Low Insertion loss
LTCC process
3
APPLICATIONS
1.
2.
824~960 and 1710~2170MHz band for diplexer applications
GSM, DCS, PCS related applications
CONSTRUCTION
P1
P2
P3
Pin
1
2
3
Connection
Low Band
GND
High Band
Pin
4
5
6
Connection
GND
ANT
GND
P6
P5
P4
DIMENSIONS
Figure
Symbol
L
W
T
A
B
C
D
E
Dimension (mm)
2.00 ± 0.10
1.25 ± 0.20
0.90 ± 0.15
0.20 ± 0.15
0.30 ± 0.15
0.35 ± 0.15
0.65 ± 0.15
0.20 ± 0.10
Page 2 of 7
ASC_RFDIP2012090G3T_V01
Sep. 2012
Approval sheet
ELECTRICAL CHARACTERISTICS
RFDIP2012090G3T
824-960 MHz
2.0 max
0.60 dB max ( 25 °
C)
Insertion Loss (dB)
0.65dB max(-40 ° ~ +85 °
C
C)
Attenuation (dB min.)
15 dB @1710~2170MHz
-40°C ~ +85°C
Operation Temperature Range
TYPICAL ELECTRICAL PERFORMANCE
S-Parameter
Specification
1710-2170 MHz
2.0 max
0.60 dB max ( 25 °
C)
0.65dB max(-40 ° ~ +85 °
C
C)
20 dB @824~960MHz
-40°C ~ +85°C
Frequency range
VSWR
SOLDER LAND PATTERN
Figure
Unit : mm
Line width to be designed to match 50
Ω
characteristic impedance, depending on PCB material and thickness.
Page 3 of 7
ASC_RFDIP2012090G3T_V01
Sep. 2012
Approval sheet
RELIABILITY TEST
Test item
Solderability
JIS C 0050-4.6
JESD22-B102D
Test condition / Test method
*Solder bath temperature：235
±
5°C
*Immersion time：2
±
0.5 sec
Solder：Sn3Ag0.5Cu for lead-free
Leaching
(Resistance to dissolution
of metallization)
IEC 60068-2-58
*Leaching immersion time：30
±
0.5 sec
Solder : SN63A
electrode shall not exceed 25%.
*Solder bath temperature：260
±
5°C
Loss of metallization on the edges of each
Specification
At least 95% of a surface of each terminal
electrode must be covered by fresh solder.
Resistance to soldering heat
JIS C 0050-5.4
*Preheating temperature：120~150
℃
,
1 minute.
*Solder temperature：270±5°C
*Immersion time：10±1 sec
Solder：Sn3Ag0.5Cu for lead-free
Measurement to be made after keeping at
room temperature for 24±2 hrs
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Loss of metallization on the edges of each
electrode shall not exceed 25%.
Drop Test
JIS C 0044
Customer’s specification.
*Height：75 cm
*Test Surface：Rigid surface of concrete
or steel.
*Times：6 surfaces for each units；2
times for each side.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Adhesive Strength
of Termination
JIS C 0051- 7.4.3
Bending test
JIS C 0051- 7.4.1
*Pressurizing force：
5N(≦0603)；10N(>0603)
*Test time：10±1 sec
The middle part of substrate shall be
pressurized by means of the pressurizing
rod at a rate of about 1 mm/s per second
until the deflection becomes 1mm/s and
then pressure shall be maintained for 5±1
sec.
Measurement to be made after keeping at
room temperature for 24±2 hours
No remarkable damage or removal of the
termination.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Page 4 of 7
ASC_RFDIP2012090G3T_V01
Sep. 2012
Approval sheet
Temperature cycle
JIS C 0025
1.
2.
3.
4.
30±3 minutes at -40°C±3°C,
10~15 minutes at room temperature,
30±3 minutes at +85°C±3°C,
10~15 minutes at room temperature,
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Total 100 continuous cycles
Measurement to be made after keeping at
room temperature for 24±2 hrs
Vibration
JIS C 0040
*Frequency：10Hz~55Hz~10Hz(1min)
*Total amplitude：1.5mm
*Test times：6hrs.(Two hrs each in three
mutually perpendicular directions)
High temperature
JIS C 0021
*Temperature：85°C±2°C
*Test duration：1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 24±2 hrs
Humidity
(steady conditions)
JIS C 0022
*Time：1000+24/-0 hrs.
Measurement to be made after keeping at
room temperature for 24±2 hrs
※
500hrs measuring the first data then
1000hrs data
Low temperature
JIS C 0020
*Temperature：-40°C±2°C
*Test duration：1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 24±2 hrs
No mechanical damage.
Samples shall satisfy electrical specification
after test.
*Humidity：90% to 95% R.H.
*Temperature：40±2°C
No mechanical damage.
Samples shall satisfy electrical specification
after test.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Page 5 of 7
ASC_RFDIP2012090G3T_V01
Sep. 2012
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