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SN55HVD233-SEP
SLLSF98 – DECEMBER 2018
SN55HVD233-SEP 3.3-V Radiation Hardened CAN Transceiver in Space Enhanced Plastic
1 Features
•
•
1
2 Applications
•
•
•
•
Supports Low Earth Orbit Space Applications
Space Data Bus Communication and Control
Satellite Telemetry and Telecommand for On-
board Data Handling
CAN Bus Standards Such as CANopen,
DeviceNet, CAN Kingdom, ISO 11783, NMEA
2000, SAE J1939
•
•
•
•
•
•
•
•
•
•
•
•
•
•
VID V62/18617
Radiation Hardened
– Single Event Latch-up (SEL) Immune to 43
MeV-cm
2
/mg at 125°C
– ELDRS Free to 30 krad(Si)
– Total Ionizing Dose (TID) RLAT for Every
Wafer Lot up to 20 krad(Si)
Space Enhanced Plastic
– Controlled Baseline
– Gold Wire
– NiPdAu Lead Finish
– One Assembly and Test Site
– One Fabrication Site
– Available in Military (–55°C to 125°C)
Temperature Range
– Extended Product Life Cycle
– Extended Product-Change Notification
– Product Traceability
– Enhanced Mold Compound for Low
Outgassing
Compatible With ISO 11898-2
Bus Pins Fault Protection Exceeds ±16 V
Bus Pins ESD Protection Exceeds ±14-kV HBM
Data Rates up to 1 Mbps
Extended –7-V to 12-V Common Mode Range
High-Input Impedance Allows for 120 Nodes
LVTTL I/Os are 5-V Tolerant
Adjustable Driver Transition Times for Improved
Signal Quality
Unpowered Node Does Not Disturb the Bus
Low-Current Standby Mode, 200-µA Typical
Loopback for Diagnostic Functions
Thermal Shutdown Protection
Power Up and Power Down With Glitch-Free Bus
Inputs and Outputs
– High-Input Impedance With Low V
CC
– Monolithic Output During Power Cycling
3 Description
The SN55HVD233-SEP is used in applications
employing the controller area network (CAN) serial
communication physical layer in accordance with the
ISO 11898 standard. As a CAN transceiver, the
device provides transmit and receive capability
between the differential CAN bus and a CAN
controller, with signaling rates up to 1 Mbps.
Designed for operation in especially harsh radiation
environments, the SN55HVD233-SEP features cross-
wire, overvoltage, loss of ground protection to ±16 V,
and overtemperature (thermal shutdown) protection.
This device operates over a wide –7-V to 12-V
common mode range. This transceiver is the interface
between the host CAN controller on the
microprocessor, FPGA, or ASIC, and the differential
CAN bus used in satellite applications.
Device Information
(1)
PART NUMBER
SN55HVD233MDPSEP
GRADE
PACKAGE
8-lead SOIC [D]
6.48 mm × 6.48 mm
20 krad(Si)
SN55HVD233MDTPSEP RLAT
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
V
CC
V
CC
V
CC
D
BIAS UNIT
V
CC
R
S
LBK / EN /AB
SLOPE CONTROL
and MODE
LOGIC
R
GND
Copyright © 2017, Texas Instruments Incorporated
V
CC
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN55HVD233-SEP
SLLSF98 – DECEMBER 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features
..................................................................
Applications
...........................................................
Description
.............................................................
Revision History.....................................................
Description (continued).........................................
Pin Configuration and Functions
.........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Driver Electrical Characteristics ................................
Receiver Electrical Characteristics ...........................
Driver Switching Characteristics ...............................
Receiver Switching Characteristics...........................
Device Switching Characteristics..............................
Typical Characteristics ............................................
1
1
1
2
3
4
5
5
5
5
6
7
7
8
8
8
9
9.1
9.2
9.3
9.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
15
15
15
18
10 Application and Implementation........................
19
10.1 Application Information..........................................
19
10.2 Typical Application ................................................
21
11 Power Supply Recommendations
.....................
23
12 Layout...................................................................
23
12.1 Layout Guidelines .................................................
23
12.2 Layout Example ....................................................
25
13 Device and Documentation Support
.................
26
13.1
13.2
13.3
13.4
13.5
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
26
26
26
26
26
8
9
Parameter Measurement Information
................
11
Detailed Description
............................................
15
14 Mechanical, Packaging, and Orderable
Information
...........................................................
27
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
December 2018
REVISION
*
NOTES
Initial release.
2
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Copyright © 2018, Texas Instruments Incorporated
SN55HVD233-SEP
www.ti.com
SLLSF98 – DECEMBER 2018
5 Description (continued)
Modes: The R
S
, pin 8 of the SN55HVD233-SEP, provides for three modes of operation: high-speed, slope
control, or low-power standby mode. The user selects the high-speed mode of operation by connecting pin 8
directly to ground, allowing the driver output transistors to switch on and off as fast as possible with no limitation
on the rise and fall slope. The user can adjust the rise and fall slope by connecting a resistor to ground at pin 8,
because the slope is proportional to the pin's output current. Slope control is implemented with a resistor value of
0
Ω
to achieve a single ended slew rate of approximately 38 V/µs, and up to a value of 50 kΩ to achieve
approximately 4-V/µs slew rate. For more information about slope control, refer to the
Application and
Implementation
section.
The SN55HVD233-SEP enters a low-current standby (listen-only) mode during which the driver is switched off
and the receiver remains active if a high logic level is applied to pin 8. The local protocol controller reverses this
low-current standby mode when it needs to transmit to the bus. For more information on the loopback mode,
refer to the
Application Information
section.
Loopback: A logic high on the loopback LBK pin 5 of the SN55HVD233-SEP places the bus output and bus input
in a high-impedance state. The remaining circuit remains active and available for driver-to-receiver loopback,
self-diagnostic node functions without disturbing the bus.
CAN bus states: The CAN bus has two states during powered operation of the device: dominant and recessive.
A dominant bus state is when the bus is driven differentially, corresponding to a logic low on the D and R pin. A
recessive bus state is when the bus is biased to V
CC
/ 2 through the high-resistance internal input resistors R
IN
of
the receiver, corresponding to a logic high on the D and R pins (see
Bus States (Physical Bit Representation)
and
Simplified Recessive Common Mode Bias and Receiver).
Copyright © 2018, Texas Instruments Incorporated
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SN55HVD233-SEP
SLLSF98 – DECEMBER 2018
www.ti.com
6 Pin Configuration and Functions
D Package
8-Pin SOIC
Top View
D
GND
V
CC
R
1
2
3
4
8
7
6
5
R
S
CANH
CANL
LBK
Pin Functions
PIN
NAME
D
GND
V
CC
R
LBK
CANL
CANH
RS
NO.
1
2
3
4
5
6
7
8
TYPE
I
GND
Supply
O
I
I/O
I/O
I
DESCRIPTION
CAN transmit data input (LOW for dominant and HIGH for recessive bus states), also called TXD, driver input.
Ground connection.
Transceiver 3.3-V supply voltage.
CAN receive data output (LOW for dominant and HIGH for recessive bus states), also called RXD, receiver
output.
Loopback mode input pin.
Low-level CAN bus line.
High-level CAN bus line.
Mode select pin:
Tie to GND = high-speed mode,
Strong pullup to V
CC
= low power mode,
0-Ω to 50-kΩ pulldown to GND = slope control mode.
4
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SN55HVD233-SEP
Copyright © 2018, Texas Instruments Incorporated
SN55HVD233-SEP
www.ti.com
SLLSF98 – DECEMBER 2018
7 Specifications
7.1 Absolute Maximum Ratings
over operating junction temperature unless otherwise noted
(1) (2)
MIN
V
CC
Supply voltage
Voltage at any bus pin (CANH or CANL)
Voltage input, transient pulse, CANH and CANL, through 100
Ω
(see
Figure 18)
V
I
V
O
I
O
T
J
T
stg
(1)
(2)
Input voltage, (D, RS, LBK)
Output voltage, (R)
Receiver output current
Operating junction temperature
Storage temperature
–65
–0.3
–16
–100
–0.5
–0.5
–10
MAX
7
16
100
7
7
10
150
150
UNIT
V
V
V
V
V
mA
°C
°C
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating
Conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground pin.
7.2 ESD Ratings
VALUE
V
(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
CANH, CANL, and GND
Other pins
(2)
UNIT
V
±14000
±4000
±500
Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins
(1)
(2)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
V
CC
V
IH
V
IL
V
ID
V
I(RS)
I
OH
I
OL
T
J
(1)
Supply voltage
Voltage at any bus pin (separately or common mode)
High-level input voltage
Low-level input voltage
Differential input voltage
Resistance from RS to ground for slope control
Input voltage at RS for standby
High-level output current
Low-level output current
Operating junction temperature
(1)
Driver
Receiver
Driver
Receiver
–55
D, LBK
D, LBK
3
–7
2
0
–6
0
0.75 V
CC
–50
–10
50
10
125
NOM
MAX
3.6
12
5.5
0.8
6
50
5.5
UNIT
V
V
V
V
V
kΩ
V
mA
mA
°C
Maximum junction temperature operation is allowed as long as the device maximum junction temperature is not exceeded.
Copyright © 2018, Texas Instruments Incorporated
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