Product
108-57197
Specification
24-MAR-2006 Rev B
AMPMODU, 2.0mm PITCH BOARD-TO-BOARD
CONNECTOR
1. SCOPE
1.1.
1.1. CONTENTS
This specification covers the performance, tests and quality requirements for the
AMPMODU, 2.0mm PITCH BOARD-TO-BOARD CONNECTOR.
1.2. 1.2. QUALIFICATION
When tests are performed on the subject product line, the procedures specified in
Tyco 109 series specifications shall be used. All inspections shall be performed
using the applicable inspection plan and product drawing.
2.
APPLICABLE DOCUMENTS AND SPECIFICATIONS
The following documents form a part of this specification to the extent specified
herein. In the event of conflict between the requirements of this specification and
the product drawing, the product drawing shall take precedence. In the event of
conflict between the requirements of this specification and the referenced
documents, this specification shall take precedence.
2.1. 2.1 TYCO SPECIFICATIONS
A.
B.
C.
D.
109-1: General Requirements for Test Specifications
109 series: Test Specification as indicated in figure 2 (Comply with MIL-STD-202)
Corporate Bulletin 401-76: Cross-reference between Tyco test Specifications and Military or
Commercial Documents.
501-57197: Test Report.
3.
REQUIREMENTS
3.1. DESIGN AND CONSTRUCTION
Product shall be of the design, construction and physical dimensions specified on the
applicable product drawing.
3.2. MATERIALS
A. Housing：Thermoplastic or Thermoplastic High Temp., UL94V-0.
B. Contact：Copper Alloy, Gold plating on contact area, Tin or Tin-Lead Plating on soldertail over
Nickel underplating overall.
DR
Oblic Hu
DATE
24-Mar-2006
CHK
Wei-Jer Ke
DATE
24-Mar-2006
TYCO Holdings (Bermuda) VII LTD.
Taiwan Branch
3F, No. 45, Dongsing Road,
Taipei,11070, Taiwan. ROC.
TEL : 886-2-8768-2788
. This specification is a controlled document.
1 of 5
LOC DW
108-57197
3.3. RATINGS
A. Voltage: 250 VAC rms.
B. Current: 1 A Max
C. Operating Temperature: -40° to + 105°
C
C
3.4. PERFOMANCE AND TEST DESCRIPTION
The product is designed to meet the electrical, mechanical and environmental
performance requirements specified in Table 2. All tests are performed at
ambient environmental conditions per AMP Specification 109-1 unless otherwise
specified.
3.5. TEST REQUIREMENTS AND PROCEDURES SUMMARY
NO.
3.5.1
TEST ITEMS
Examination of
Product
REQUIREMENTS
Meets requirements of product
drawing. No physical damage.
PROCEDURES
Visual inspection.
ELECTRICAL REQUIREMENTS
3.5.2.1
Termination
Resistance
Initial
Final
3.5.2.2
Insulation
Resistance
20m ohms max.
30m ohms max.
Subject mated contacts assembled in
housing to closed circuit current of 50mA
max at open circuit voltage of 50mV max.
(See Fig. 1)
Measure by applying test potential between
adjacent contacts, and between the
contacts and ground in the mated connector
assembly.
MIL-STD-202, Method 302, Condition B
Measure by applying test potential between
adjacent contacts, and between the
contacts and ground in the mated connector
assembly.
MIL-STD-202, Method 301
1000M ohms min. (Initial)
1000M ohms min (Final)
3.5.2.3
Dielectric Strength
Connector must withstand test
potential of 650VAC for 1 min.
Current leakage limit to 5.0mA
max.
MECHANICAL REQUIREMENTS
3.5.3.1
Individual Pin
Insertion/ Extraction
Force
Receptacle Contact
Retention Force
Post Retention
Force
Solder ability
Insertion Force
200 gf max
Extraction
Force
10gf min
Subject terminated contact and pin to mate
and unmate to measure the force required
to insert and extract by operating at a rate of
100mm a minute. (See Fig. 2)
Apply axial load to terminated contact at a
rate of 25mm a minute.
Apply axial pull-off load to post contact
mounted on housing and measure the force
required to dislodge post from housing.
Steam Aging Preconditioning：
(1) Tin、Tin-Cu Coating:
93+3/-5℃、100% HR、8hrs.
<J-STD-002 category 3 aging>
(2) Other Coating:
93+3/-5℃、100% HR、1hrs.
<J-STD-002 category 2 aging>
Solder pot temperature: 245±5℃, 5sec
2 of 5
3.5.3.2
3.5.3.3
250 gf min. per contact
0.5 kgf min. per contact
3.5.3.4
The inspected area of each lead
must have 95% solder coverage
minimum.
Rev
B
108-57197
NO.
TEST ITEMS
REQUIREMENTS
ENVIRONMENTAL REQUIREMENTS
3.5.4.1
Vibration
No electrical discontinuity greater
than 1 microsecond.
Termination resistance (low level)
shall be met.
Termination resistance 40m
ohms Max.
Insulation Resistance (Final)
500M ohms min.
Termination resistance (low level)
shall be met.
Termination resistance (low level)
shall be met.
Subject mated connectors to 10-55-10 Hz
traversed in 1minutes at 1.52mm amplitude 2
Hours each of 3 mutually perpendicular
planes.
MIL-STD-202, Method201, Condition A
Subject mated connector assemblies to
temperature life at 85°
C±2° for 96 hours.
C
PROCEDURES
3.5.4.2
Temperature Life
(Heat Aging)
3.5.4.3
Humidity, Steady
State
Subject mated connectors to steady state
humidity at 40°
C±2° and 90-95% R.H for 96
C
hrs.
Subject mated connector assemblies on 5
cycle –55 ° and +80° for 30 minutes each
C
C
duration at temperature extremes.
MIL-STD-202, Method 107, Condition A
Subject connector mounted on printed circuit
boards to solder bath at 260±5°C for 5±1
seconds (Flow soldering).
MIL-STD-202, Method 210, Condition C.
Subject connector assembly to 50 cycles of
repeated mating /unmating at a rate of 10
cycles a minute.
Exposing in a heat chamber at a temperature
of 35°
±2°
for 24 hours.
C C
EIA-364-26A, CONDIION A.
Solder Temp. : 240±5℃, 10±0.5sec.
Tyco spec. 109-202, Condition A
Solder Temp. : 265±5℃, 10±0.5sec.
Tyco spec. 109-202, Condition B
Solder Temp. : 260±5℃, 10±0.5sec.
Tyco spec. 109-202, Condition C
Pre-soak condition, 85℃/85﹪RH for 168
hours.
Pre Heat: 150~180℃, 90±30sec.
Heat: 230℃ Min., 30±10sec.
Peak Temp. : 245+0/-5℃, 10~30sec.
Duration: 3 cycles
Tyco spec. 109-201, Condition A
Pre-soak condition, 85℃/85﹪RH for 168
hours.
Pre Heat: 150~180℃, 90±30sec.
Heat: 230℃ Min., 30±10sec.
Peak Temp. : 260+0/-5℃, 20~40sec.
Duration: 3 cycles
Tyco spec. 109-201, Condition B
3.5.4.4
Thermal Shock
3.5.4.5
Resistance to
Soldering Heat
No Physical damage
3.5.4.6
Durability (Repeated
Mate /Unmating)
Salt Spray
Termination resistance (low level)
shall be met.
30mΩ Max. (Final)
3.5.4.7
Resistance to Wave
Soldering Heat
Resistance to Wave
Soldering Heat
Resistance to Wave
Soldering Heat
No physical damage shall occur.
No physical damage shall occur.
No physical damage shall occur.
3.4.5.8
Resistance to
Reflow Soldering
Heat
No physical damage shall occur.
Resistance to
Reflow Soldering
Heat
No physical damage shall occur.
Figure 1
Rev
B
3 of 5
108-57197
3.6. PRODUCT QUALIFICATION AND REQUALIFICATION TEST
Test Group
Para Ref
3.5.1
3.5.2.1
3.5.2.2
3.5.2.3
3.5.3.1
3.5.3.1
3.5.3.2
3.5.3.3
3.5.3.4
3.5.4.1
3.5.4.2
3.5.4.3
3.5.4.4
3.5.4.5
3.5.4.6
3.5.4.7
3.5.4.8
Test of Examination
Examination of Product
Termination Resistance
Insulation Resistance
Dielectric Withstanding Voltage
Individual Insert Force
Individual Extraction Force
Receptacle Contact Retention Force
Post Retention Force
Solderability
Vibration
Temperature Life
Humidity, Steady State
Thermal Shock
Resistance to Soldering Heat
Durability
Salt Spray
Resistance to Soldering Heat
A
1,5
2,4
B
1,9
8
C
1,6
2,5
3
D
1,5
2,4
E
1,5
2,4
F
1,4
G
1,3
H
1,3
I
1,5
2,4
J
1,3
Test Sequence (a)
2,5
3,6
2
2
2
3
3
4
3
3
4,7
3
2
Figure 2
(a) Numbers indicate sequence in which tests are performed.
(b)
Discontinuities shall not be measured.
Rev
B
4 of 5
108-57197
3.7. FIGURE 3. CONTACT RESISTANCE & RESISTANCE TO FLOW SOLDER
HEAT
Rev
B
5 of 5
PCB设计
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