Agilent HSDL-3211 IrDA
®
Data Compliant Low Power
1.15 Mbit/s Infrared Transceiver
Data Sheet
Features
• Fully compliant to IrDA 1.4 physical
layer low power specification from from
9.6 kbit/s to 1.152 Mbit/s (MIR)
• Miniature package
– Height: 2.5 mm
– Width: 8.0 mm
– Depth: 3.0 mm
• No data rate switching required
• Typical link distance > 50 cm
Description
The HSDL-3211 is a new
generation low profile high speed
infrared transceiver module that
provides interface between logic
and IR signals for through-air,
serial, half-duplex IR data-link.
The module is fully compliant to
IrDA Physical Layer specification
version 1.4 low power from
9.6kbit/s to 1.152 Mbit/s (MIR)
and is IEC825-Class 1 Eye Safe.
The HSDL-3211 can be shutdown
completely to achieve very low
power consumption. In the
shutdown mode, the PIN diode
will be inactive and thus produc-
ing very little photocurrent even
under very bright ambient light.
It is also designed to interface to
input/output logic circuits as low
as 1.8V. These features are ideal
for mobile devices that require
low power consumption.
• Guaranteed temperature performance, -
25
o
to 85
o
C
– Critical parameters are guaranteed
over temperature and supply voltage
• Low power consumption
– Low shutdown current (1 nA typical)
– Complete shutdown of TXD, RXD,
and PIN diode
• Withstands >100 mV
p-p
power supply
ripple typically
• Excellent EMI performance
• Vcc supply 2.4 to 3.6 Volts
• Interfacing with I/O logic circuits as
low as 1.8 V
• Lead-free package
• LED stuck-high protection
• Designed to accommodate light loss
with cosmetic windows
• IEC 825-class 1 eye safe
V
CC
CX4
CX2
CX1
IOV
CC
(7)
V
CC
(6)
GND (8)
SD (5)
RECEIVER
RXD (4)
Applications
• Mobile telecom
– Mobile phones
– Smart phones
– Pagers
• Data communication
– Pocket PC handheld products
– Personal digital assistants
– Portable printers
• Digital imaging
– Digital cameras
– Photo-imaging printers
• Electronic wallet
• Small industrial & medical
instrumentation
– General data collection devices
– Patient & pharmaceutical data
collection devices
SHIELD
HSDL-3211
TXD (3)
LED C (2)
TRANSMITTER
R1
V
led
LED A (1)
CX3
Figure 1. Functional block diagram of HSDL-3211.
8
7
6
5
4
3
2
1
Figure 2. Rear view diagram with pinout.
Application Support Information
The Application Engineering
Group is available to assist you
with the application design
Order Information
Part Number
HSDL-3211-021
associated with the HSDL-3211
infrared transceiver module. You
can contact them through your
local sales representatives for
additional details.
Marking Information
The unit is marked with ‘yyww’
on the shield:
yy
= year
ww
= work week
Packaging Type
Tape and Reel
Package
Front View
Quantity
2500
I/O Pins Configuration Table
Pin
1
2
3
4
5
6
7
8
-
Symbol
LED A
LED C
TXD
RXD
SD
Vcc
IOVcc
GND
Shield
Description
LED Anode
LED Cathode
Transmit Data. Active High.
Receive Data. Active Low.
Shutdown. Active High.
Supply Voltage
Input/Output ASIC Vcc
Ground
EMI Shield
I/O Type
I
Notes
1
2
I
O
I
3
4
5
6
7
8
9
Recommended Application Circuit Components
Component
R1
Recommended Value
3.9Ω
±
5%, 0.25 watt for 2.4
≤
Vled < 2.7V
5.6Ω
±
5%, 0.25 watt for 2.7
≤
Vled < 3.3V
10Ω
±
5%, 0.25 watt for 3.3
≤
Vled < 4.2V
15Ω
±
5%, 0.25 watt for 4.2
≤
Vled < 5.5V
0.47
µF ±
20%, X7R Ceramic
6.8
µF ±
20%, Tantalum
Notes
CX1, CX4
CX2, CX3
10
11
Notes:
1. Tied through external series resistor, R1, to regulated Vled from 2.4 to 5.5V. Please refer to table
below for recommended series resistor value.
2. Internally connected to LED driver. Leave this pin unconnected.
3. This pin is used to transmit serial data when SD pin is low. If this pin is held high for longer than
50 ms, the LED is turned off. Do NOT float this pin.
4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull-down
resistor is required. The pin is in tri-state when the transceiver is in shutdown mode. The receiver
output echoes transmitted signal.
5. The transceiver is in shutdown mode if this pin is high. Do NOT float this pin.
6. Regulated, 2.4 to 3.6 Volts.
7. Connect to ASIC logic controller Vcc voltage or supply voltage. The voltage at this pin must be
equal to or less than supply voltage.
8. Connect to system ground.
9. Connect to system ground via a low inductance trace. For best performance, do not connect
directly to the transceiver pin GND
10. CX1 must be placed within 0.7 cm of the HSDL-3211 to obtain optimum noise immunity.
11. In environments with noisy power supplies, including CX2, as shown in Figure 1, can enhance
supply ripple rejection performance.
2
CAUTIONS:
The BiCMOS inherent to the design of this component increases the component’s
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions
be taken in handling and assembly of this component to prevent damage and/or degradation which may
be induced by ESD.
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is
≤
50°C/W.
Parameter
S
torage Temperature
Symbol
T
S
T
A
V
LEDA
V
CC
V
I
V
O
I
LED
(DC)
I
LED
(PK)
Min.
-40
-25
0
0
0
0
Max.
+100
+85
6.5
6.5
6.5
6.5
150
600
Units
°C
°C
V
V
V
V
mA
mA
Conditions
Operating Temperature
LED Anode Voltage
Supply Voltage
Input Voltage: TXD, SD/Mode
Output Voltage: RXD
DC LED Transmit Current
Average Transmit Current
≤
90
µs
pulse width
≤
25% duty cycle
Recommended Operating Conditions
Parameter
Operating Temperature
Supply Voltage
Input/Output Voltage
Logic Input Voltage
for TXD, SD/Mode
Receiver Input
Irradiance
Logic High
Logic Low
Logic High
Symbol
T
A
V
CC
IOVcc
V
IH
V
IL
EI
H, min
EI
H, max
EI
L
I
LEDA
Min.
-25
2.4
1.8
IOV
cc
– 0.5
0
Typ.
Max.
+85
3.6
Vcc
IOV
cc
0.4
0.0081
500
0.3
Units
°C
V
V
V
V
mW/cm
2
mW/cm
2
µW/cm
2
mA
Conditions
9.6kbit/s
≤
in-band signals
≤1.152
Mbit/s
[12]
For in-band signals
[12]
Logic Low
LED (Logic High) Current
Pulse Amplitude
Receiver Data Rate
150
0.0096
1.152
Mbit/s
Note :
12. An in-band optical signal is a pulse/sequence where the peak wavelength,
λp,
is defined as 850
≤ λp ≤
900 nm, and the pulse characteristics are
compliant with the IrDA Serial Infrared Physical Layer Link Specification v1.4.
3
Electrical & Optical Specifications
Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted.
Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C, Vcc set to 3.0V
and IOVcc set to 1.8V unless otherwise noted.
Parameter
Receiver
Viewing Angle
Peak Sensitivity Wavelength
RXD Output Voltage
Logic High
Logic Low
RXD Pulse Width (SIR)
[13]
RXD Pulse Width (MIR)
[14]
RXD Rise and Fall Times
Receiver Latency Time
[15]
Receiver Wake Up Time
[16]
Transmitter
Radiant Intensity
Viewing Angle
Peak Wavelength
Spectral Line Half Width
TXD Input Current
LED ON Current
TXD Pulse Width (SIR)
TXD Pulse Width (MIR)
Maximum Optical PW
[17]
TXD Rise and fall Time (Optical)
LED Anode On-State Voltage
Transceiver
Supply Current
Shutdown
Idle
I
CC1
I
CC2
0.001
0.4
1
1.0
µA
mA
V
SD
≥
V
IH,
Ta= 25
°C
V
SD
≤
V
IL
, V
TXD
≤
V
IL
, EI=0
t
r
, t
f
V
ON(LEDA)
1.6
High
Low
I
H
I
L
I
LEDA
t
PW
(SIR)
t
PW
(MIR)
1.5
148
t
PW(max.)
-10
IE
H
2θ
λ
p
∆λ
0.02
-0.02
150
1.6
217
1.8
260
50
40
2.0
10
30
875
35
10
10
µA
µA
mA
µs
ns
100
ns
V
45
60
mW/sr
°
nm
nm
V
TXD
≥
V
IH
0
≤
V
TXD
≤
V
IL
V
TXD
≥
V
IH
, R1=5.6ohm, Vled=3.0V
t
PW
(TXD) = 1.6
µs
at 115.2 kbit/s
t
PW
(TXD) = 217 ns at 1.152 Mbit/s
µs
t
PW
(TXD) = ns at 1.152 Mbit/s
I
LEDA
=150 mA, V
TXD
≥V
IH
I
LEDA
= 150 mA,
θ ≤
15°, V
TXD
≥
V
IH
,
V
SD
≤
V
IL
, Ta=25°C
2θ
λp
V
OH
V
OL
IOV
CC
– 0.2
0
t
PW
(SIR)
t
PW
(MIR)
t
r
, t
f
t
L
t
W
1
100
25
25
50
50
100
30
880
IOV
CC
0.4
°
nm
V
V
4.0
500
I
OH
= -200
µA,
EI
≤
0.3
µW/cm
2
I
OL
= 200
µA,
EI
≥
8.1
µW/cm
2
µsθ ≤
15°, C
L
= 9 pF
nsθ
≤
15°, C
L
= 9 pF
nsC
L
= 9 pF
µs
µs
Symbol
Min.
Typ.
Max.
Units
Conditions
Notes:
13. For in-band signals from 9.6 kbit/s to 115.2 kbit/s, where 9
µW/cm
2
≤
EI
≤
500 mW/cm
2
.
14. For in-band signals from 0.576 Mbit/s to 1.152 Mbit/s, where 22.5
µW/cm
2
≤
EI
≤
500 mW/cm
2
.
15. Latency time is defined as the time from the last TxD light output pulse until the receiver has recovered full sensitivity.
16. Receiver wake up time is measured from Vcc power on or SD pin high to low transition to a valid RXD output.
17. The maximum optical PW is the maximum time the LED remains on when the TXD is constantly high. This is to prevent long turn on time of the LED
for eye safety protection.
4
t
pw
t
pw
V
OH
90%
50%
10%
LED OFF
LED ON
90%
50%
10%
V
OL
t
f
t
r
t
r
t
f
Figure 3. RxD output waveform.
Figure 4. LED optical waveform.
SD
TXD
RX
LIGHT
LED
RXD
t
pw (MAX.)
t
RW
Figure 5. TxD “Stuck On” protection waveform.
Figure 6. Receiver wakeup time waveform.
0.18
0.16
0.14
LOP (mW/Sr)
50
40
0.12
Iled (A)
0.10
0.08
0.06
0.04
30
20
10
0.02
0
1.4
1.5
1.6
VledA (V)
1.7
1.8
0
0
0.05
0.1
lled (A)
0.15
0.2
Figure 7. LED anode voltage vs. LED current.
Figure 8. LED current vs. radiant intensity.
5
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