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TECHNICAL CHARACTERISTICS
MATERIAL
INSULATOR: LCP
FLAMABILITY RATING: UL94-V0
COLOR: BLUE
CONTACT MATERIAL: PHOSPHOR BRONZE
CONTACT TYPE: STAMPED
CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni
CONTACT AREA 0.76 µm Gold
SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
SHIELDING: BRASS MATT TIN PLATED
ENVIRONMENTAL
OPERATING TEMPERATURE: -20 up to +85°C
COMPLIANCE: RoHS & LEAD FREE AS PER DIRECTIVE 2002/95/EC
HALOGEN FREE COMPLIANT AS PER IEC 61249-2-21
ELECTRICAL
CURRENT RATING:
- PIN 1 & PIN 4 (Vbus & corresponding ground PIN) 1.8A Max
- OTHER PINS 0.25 A Max
WORKING VOLTAGE: 30Vac
DIELECTRIC WITHSTANDING VOLTAGE: 100Vac/min
INSULATION RESISTANCE: > 100MΩ
CONTACT RESISTANCE:
- PIN 1 & PIN 4: 30mΩ Max
- OTHER PINS: 50mΩ Max
STANDARD
CERTIFIED: E323964
MECHANICAL
INSERTION FORCE: 35.0N Max
EXTRACTION FORCE: 10.0N min
QUALITY CLASS: 5000 MATING CYCLES
SOLDERING
JEDEC LEAD FREE WAVE SOLDERING PROCESS
PACKAGING
TAPE & REEL
A
PCB LAYOUT * - COMPONENT VIEW
B
C
RoHS Compliant
G
F
E
D
C
B
A
REV
24-JUN-14
01-APR-14
12-AUG-13
09-NOV-11
21-SEP-11
10-MAY-11
04-AUG-10
DATE
*
NOTE: THE RECOMMENDED PCB LAYOUT IS FOR AN OPTIMIZED RETENTION FORCE OF CONNECTOR ON PCB BUT IT IMPLIES INSERTION FORCE THAT A LOT OF PICK AND PLACE MACHINES ARE NOT ABLE TO HANDLE. THEREFORE IT MIGHT BE NECESSARY TO
DRILL BIGGER HOLES FOR THE CLIPS. PLEASE CHECK THIS CARFULLY.
LAYOUT
SOLDERING
CHARACTERISTIC
STENCIL
NOTE
UL
PDF
FILE
AS
QL
QL
GG
GG
GG
JP
BY
PROJECTION:
GENERAL TOLERANCE
.X = +/- 0.2
.XX = +/- 0.15
APPROVAL: RJ
UNIT: MM
SCALE:
SHEET: 1/3
DRAW: JOE
DESCRIPTION: USB 3.0 REVERSE HORIZONTAL TYPE A
WITH OFFSET 0.14 MM
WERI PART NO: 692 121 130 100
SIZE
A4
D
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