OTP ROM, 8KX8, 200ns, CMOS, PQCC32
| 参数名称 | 属性值 |
| 包装说明 | , |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最长访问时间 | 200 ns |
| JESD-30 代码 | R-PQCC-J32 |
| 内存密度 | 65536 bi |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | J BEND |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 27C64A-20A | 27C64AI15A | 27C64AI15N | 27C64A-12A | 27C64A-20N | 27C64AI20A | 27C64A-15A | 27C64A-15N | |
|---|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 8KX8, 200ns, CMOS, PQCC32 | OTP ROM, 8KX8, 150ns, CMOS, PQCC32 | OTP ROM, 8KX8, 150ns, CMOS, PDIP28 | OTP ROM, 8KX8, 120ns, CMOS, PQCC32 | OTP ROM, 8KX8, 200ns, CMOS, PDIP28 | OTP ROM, 8KX8, 200ns, CMOS, PQCC32 | OTP ROM, 8KX8, 150ns, CMOS, PQCC32 | OTP ROM, 8KX8, 150ns, CMOS, PDIP28 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 200 ns | 150 ns | 150 ns | 120 ns | 200 ns | 200 ns | 150 ns | 150 ns |
| JESD-30 代码 | R-PQCC-J32 | R-PQCC-J32 | R-PDIP-T28 | R-PQCC-J32 | R-PDIP-T28 | R-PQCC-J32 | R-PQCC-J32 | R-PDIP-T28 |
| 内存密度 | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 28 | 32 | 28 | 32 | 32 | 28 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
| 端子位置 | QUAD | QUAD | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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