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KS622-49TT

产品描述IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder,
产品类别连接器    插座   
文件大小255KB,共2页
制造商Advanced Interconnections Corp
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KS622-49TT概述

IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder,

KS622-49TT规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Advanced Interconnections Corp
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性SOCKET ADAPTER
主体宽度0.7 inch
主体深度0.095 inch
主体长度1.1 inch
联系完成配合TIN LEAD OVER NICKEL
联系完成终止Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
触点材料BERYLLIUM COPPER/COPPER ALLOY
触点样式RND PIN-SKT
设备插槽类型IC SOCKET
使用的设备类型DIP22
外壳材料POLYIMIDE
JESD-609代码e0
插接触点节距0.1 inch
安装方式STRAIGHT
触点数22
最高工作温度400 °C
最低工作温度-269 °C
PCB接触模式RECTANGULAR
PCB触点行间距0.6 mm
端子节距2.54 mm
端接类型SOLDER

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DIP Sockets
Table of Models
Peel-A-Way DIP Socket Terminal Carriers
Description:
Peel-A-Way
®
Socket (KS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
®
.005
(.13)
Polyimide
Film
For molded insulators, see pages 28-29.
Options
• Removable tape seal protects plated contact in harsh environments
Tape Seal - add 3M to end of part number
Features:
• Peel away terminal carrier after
soldering.
• Disposable carrier.
• Complete soldering visibility on
both sides of PCB.
• Maximum air flow.
• Better flux rinse.
• No contact damage due to
terminal carrier insertion.
• No contact pull out due to
extraction of terminal carrier.
(shown here on
molded socket)
• Spray flux without contaminating contact area
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
Material
Solder Preform Terminals
Tin/Lead: Type -150
Lead-free: Type -811
.072 Dia.
(1.83)
See pg. 29 for intrusive reflow application.
Tin/Lead: Type -111
Lead-free: Type -810
Peel-A-Way
®
only
.058 Dia.
(1.47)
Tin/Lead: Type -151
Lead-free: Type -812
.072 Dia.
(1.83)
.130
(3.30)
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
.165
(4.19)
Solder
Preform
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
.031
(.79)
.155
(3.94)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
.038 Dia.
(.97)
How To Order
KS
Body Type
RoHS Compliant Insulators:
3
16
- 85
M
G
Contact Plating
RoHS Compliant:
KS - Peel-A-Way
DIP Spacing
3 - .300/(7.62mm)
4 - .400/(10.16mm)
6 - .600/(15.24mm)
9 - .900/(22.86mm)
Number of Pins
(8 to 64)
Additional sizes available - consult factory.
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16A
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)

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