For board-to-FPC
Narrow pitch connectors
(0.4mm pitch)
A4S
Being 2.5 mm in width, it facilitates ever-increasing device miniaturization and
advanced functionality!
FEATURES
1. “TOUGH CONTACT” construction provides high
resistance to various environmental.
2. Simple lock structure provides tactile feedback to ensure
excellent mating/unmating operation feel.
3. Connectors for inspection available
APPLICATIONS
2.5mm
2.0mm
Smartphones, laptops and other mobile devices
Header
Socket
DETAILED FEATURES
Width 2.5 mm slim two-piece type connector
Compact and slim structure contributes overall miniaturization of
product design.
<Compared to F4S (40 pins, when mated)>
Width: 30% down, Footprint: 30% down
F４S
1.0
A４S
0.8
2.5
3.6
High resistance to various environments!
“TOUGH CONTACT” construction provides high contact
reliability
Ni barrier construction
(Tough against solder
rise!)
Bellows contact construction
(Tough against shock impact!)
Porosity treatment
(Tough against
corrosive gases!)
V notch and Double contact constructions
(Tough against exposure to foreign particles and solder flux!)
ORDERING INFORMATION
AXE
2
5: Socket
6: Header
Number of pins
(2 digits)
Mated height
2: (Fixed)
Socket
1: 0.8 mm/1.0 mm
Header
1: 0.8 mm
2: 1.0 mm
Surface treatment (Contact portion / Terminal portion)
(Socket)
7: Base: Ni plating, Surface: Au plating/
Base: Ni plating, Surface: Au plating
(Header)
4: Base: Ni plating, Surface: Au plating/
Base: Ni plating, Surface: Au plating
Package
Nil: Embossed packaging 8 mm pitch
D: Embossed packaging 4 mm pitch
–1–
ACCTB7E 201803-T
Narrow pitch connectors
A4S
(0.4mm pitch)
SPECIFICATIONS
Characteristics
Item
Rated current
Rated voltage
Electrical
characteristics
Dielectric strength
Insulation resistance
Contact resistance
Mechanical
characteristics
Composite insertion force
Composite removal force
Ambient temperature
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
150V AC for 1 min.
Min. 1,000MΩ (initial)
Max. 90mΩ
Max. 1.200N/pin contact
×
pin contacts (initial)
Min. 0.165N/pin contact
×
pin contacts
–55 to +85°C
The initial specification must be satisfied electrically
and mechanically.
–55 to +85°C (product only)
–40 to +50°C (emboss packing)
No icing. No condensation.
Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector
terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
No icing. No condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature (°C)
0
1
–55
−3
2
3
85
+3
0
4
0
–55
−3
Time (minutes)
30
Max. 5
30
Max. 5
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Conditions
Soldering heat resistance
Storage temperature
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H
2
S resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
Insertion and removal life
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
48 hours,
contact resistance max. 90mΩ
30 times
20 pins Socket: 0.02 g Header: 0.01 g
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% R.H.
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
Material and surface treatment
Part name
Molded portion
Contact and Post
Material
LCP resin (UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating Surface: Au plating
Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel
portions).
Sockets:
Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)
Headers:
Base: Ni plating, Surface: Au plating (except the terminal tips)
Soldering terminals
Copper alloy
–4–
ACCTB7E 201803-T
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