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MX1PMT4108CE3

产品描述Zener Diode, 14V V(Z), 2%, 0.5W, Silicon, Unidirectional, DO-216AA, ROHS COMPLIANT, DO-216, POWERMITE-2
产品类别分立半导体    二极管   
文件大小111KB,共4页
制造商Microsemi
官网地址https://www.microsemi.com
标准
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MX1PMT4108CE3概述

Zener Diode, 14V V(Z), 2%, 0.5W, Silicon, Unidirectional, DO-216AA, ROHS COMPLIANT, DO-216, POWERMITE-2

MX1PMT4108CE3规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码DO-216
包装说明S-PSSO-G1
针数2
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
其他特性LOW NOISE
外壳连接CATHODE
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-216AA
JESD-30 代码S-PSSO-G1
JESD-609代码e3
元件数量1
端子数量1
封装主体材料PLASTIC/EPOXY
封装形状SQUARE
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
极性UNIDIRECTIONAL
最大功率耗散0.5 W
认证状态Not Qualified
标称参考电压14 V
表面贴装YES
技术ZENER
端子面层MATTE TIN
端子形式GULL WING
端子位置SINGLE
处于峰值回流温度下的最长时间40
最大电压容差2%
工作测试电流0.25 mA
Base Number Matches1

文档预览

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1PMT4614e3 thru 1PMT4627e3,
1PMT4099e3 thru 1PMT4135e3
SCOTTSDALE DIVISION
POWERMITE
TM
Low Noise 1 Watt Zener Diodes
DESCRIPTION
This Microsemi Powermite
®
surface mount low noise Zener package series
provides a higher power handling capability that are also RoHS compliant.
In addition to its size advantages, Powermite
®
package features include a
full-metallic bottom that eliminates the possibility of solder flux entrapment
during assembly, and a unique locking tab acts as an efficient heat path
from die to mounting plane for external heat sinking with very low thermal
resistance junction to case (bottom). Its innovative design makes this
device ideal for use with automatic insertion equipment.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
DO-216
FEATURES
Surface mount equivalent to JEDEC registered
1N4099 thru 1N4135 and 1N4614 thru 1N4627
series except with additional power capability
RoHS compliant
Options for screening in accordance with Mil-PRF-
19500/435 for JAN, JANTX, JANTXV and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers. For example,
designate MX1PMT4099 for a JANTX (consult factory
for Tin-Lead plating if required).
Optional 100% avionics screening available by
adding MA prefix for 100% temperature cycle,
thermal impedance, and 24 hour HTRB testing
(consult factory for Tin-Lead plating if required).
APPLICATIONS / BENEFITS
Extensive selection from 1.8 to 100 V
Regulates voltage over a broad operating current
and temperature range
Low noise density (1-3 kHz) at test current
Low reverse leakage current
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
Hermetically sealed surface mount package
Nonsensitive to ESD per MIL-STD-750 Method 1020
Compatible with automatic insertion equipment
Full metallic bottom eliminates flux entrapment
MAXIMUM RATINGS
Operating and Storage Temperatures: -55°C to +150°C
Steady-State Power: 1.0 watt at T
C
< 120
o
C where
T
C
is case bottom temperature at mounting plane, or
0.5 watts at T
A
= 30
º
C (ambient temperature) when
mounted on FR4 PC board as described for thermal
resistance (also see power deratings in Figure 1)
Thermal Resistance: 30°C/W junction to case
(bottom) and 240°C/W junction to ambient on FR4
PC board (1 oz copper) with recommended footprint
(see last page)
Forward voltage: 1.1 Volts @ 200 mA
Solder Temperatures: 260°C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting epoxy
compound meeting UL94V-0
FINISH: Annealed matte-Tin plating over copper and
readily solderable per MIL-STD-750 method 2026
(consult factory for Tin-Lead plating)
POLARITY: Cathode designated by Tab 1 (bottom)
MARKING: Three numerical digits of P/N and a dot
(see next page listing)
WEIGHT: 0.016 grams (approx.)
Package dimensions on last page
Tape & Reel option: Standard per EIA-481-B
3000 on 7 inch reel and 12,000 on 13” reel
1PMT4614-27 &
1PMT4099-4135
Copyright
©
2005
5-06-2005 REV G
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

 
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