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1N3828ATRE3

产品描述Zener Diode, 6.2V V(Z), 5%, 1W,
产品类别分立半导体    二极管   
文件大小138KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
标准
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1N3828ATRE3概述

Zener Diode, 6.2V V(Z), 5%, 1W,

1N3828ATRE3规格参数

参数名称属性值
是否Rohs认证符合
Reach Compliance Codeunknown
ECCN代码EAR99
Is SamacsysN
配置SINGLE
二极管类型ZENER DIODE
最大动态阻抗2 Ω
元件数量1
最高工作温度175 °C
最大功率耗散1 W
标称参考电压6.2 V
表面贴装NO
最大电压容差5%
工作测试电流41 mA
Base Number Matches1

文档预览

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1N3821 thru 1N3830A, e3
1 Watt Metal Case Zener Diodes
SCOTTSDALE DIVISION
DESCRIPTION
This well established zener diode series for the 1N3821 thru 1N3830A
JEDEC registration in the glass hermetic sealed DO-13 package provides a
low voltage selection for 3.3 to 7.5 volts. It is also well suited for high-
reliability applications where it is available in JAN, JANTX, and JANTXV
military qualifications. Higher voltages are also available in the 1N3016
thru 1N3051 series (6.8 V to 200 V) in the same package (see separate
data sheet). Microsemi also offers numerous other Zener diode products
for a variety of other packages including surface mount.
APPEARANCE
WWW .
Microsemi
.C
OM
DO-13
(DO-202AA)
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEATURES
Zener Voltage Range: 3.3 V to 7.5 V
Hermetically sealed DO-13 metal package
Internally solder-bonded construction.
Also available in JAN, JANTX, JANTXV qualifications
per MIL-PRF19500/115 by adding the JAN, JANTX,
or JANTXV prefixes to part numbers for desired level
of screening, e.g. JANTX1N3821, JANTXV1N3051A,
etc.
Surface mount also available with 1N3821UR-1 thru
1N30330AUR-1 series on separate data sheet
RoHS Compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Low voltage selection from 3.3 to 7.5 V
Tight voltage tolerances available
Low reverse (leakage) currents
Nonsensitive to ESD
Hermetically sealed metal package
Inherently radiation hard as described in
Microsemi MicroNote 050
MAXIMUM RATINGS
Operating Junction and Storage Temperatures:
-65
o
C to +175
o
C
o
THERMAL RESISTANCE: 50 C/W* junction to lead
at 0.375 inches (10 mm) from body or 110
o
C/W
junction to ambient when leads are mounted on FR4
PC board with 4 mm
2
copper pads (1 oz) and track
width 1 mm, length 25 mm
DC Power Dissipation
*
: 1 Watt at T
L
< +125
o
C 3/8”
o
(10 mm) from body or 1.0 Watts at T
L
< +65 C when
mounted on FR4 PC board as described for thermal
resistance above (also see Fig 1)
Forward Voltage @ 200 mA: 1.5 Volts.
Solder Temperatures: 260
o
C for 10 s (maximum)
MECHANICAL AND PACKAGING
CASE: DO-13 (DO-202AA), welded, hermetically
sealed metal and glass
FINISH: All external surfaces are Tin-Lead (Pb/Sn)
or RoHS compliant annealed matte-Tin (Sn) plated
and solderable per MIL-STD-750 method 2026
POLARITY: Cathode connected case.
WEIGHT: 1.4 grams.
Tape & Reel option: Standard per EIA-296 (add
“TR” suffix to part number)
See package dimensions on last page
1N3821 – 1N3830A, e3
* For further mounting reference options, thermal resistance from junction to metal case is
<
20
o
C/W
when mounting DO-13 metal case directly on heat sink.
Copyright
©
2006
3-12-2006 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

 
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