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1364150-3 Product Details
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PGA Sockets
5 of 6 EU R oHS/ELV C om pliant
(
Sta te m e nt of C om pliance
)
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1364150-3
T E I nternal N umber: 1 3 6 4 1 5 0 - 3
Product Highlights:
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Zero Insertion Force
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479 Positions
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PC B Mount Style = Surface Mount
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Grid Size = 26x26
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Grid Spacing = 1.27 x 1.27 mm
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Obsolete
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Documentation & Additional Information
Product Drawings:
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None Available
Catalog Pages/Data Sheets:
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None Available
Product Specifications:
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None Available
Application Specifications:
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Lever-Actuated Zero Insertion Force (ZIF) Micro Pin ...
(PDF, English)
Instruction Sheets:
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Lever-Actuated Zero Insertion Force (ZIF) Micro Pin ...
(PDF, English)
CAD Files:
(C
AD Format & C ompression Information)
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2D Drawing
(DXF, Version N)
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3D Model
(IGES, Version N)
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3D Model
(STEP, Version N)
List all Documents
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Insertion Force
= Zero
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Number of Positions
= 479
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PC B Mount Style = Surface Mount
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Grid Size
= 26x26
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Grid Spacing (mm [in])
= 1.27 x 1.27 [.050 x .050]
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C hip C ompatibility
= Intel? Pentium? 3 MOBILE (mPGA478A pattern),
Intel? Pentium? 4 (mPGA478B pattern), Intel? Pentium? 4 Processor
-M MOBILE (mPGA478B pattern), Intel? Pentium? M MOBILE
(mPGA478C pattern)
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Frame Style
= Open
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Heat Sink Attachment
= With
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Heat Sink Style = Two C enter Latches
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ZIF Actuator
= Single Lever
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Profile
= Low
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C over Material = High Temperature Thermoplastic
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Leg Style = Ball Grid Array (BGA)
Termination Related Features:
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Socket Identifier = mPGA479
Body Related Features:
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Assembly Process Feature = None
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Actuator Handle Material = Stainless steel
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C over C olor = Natural
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Socket Overall Height (mm [in]) = 4 [0.157]
Contact Related Features:
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C ontact Style
= Stamped + Formed
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C ontact Base Material = C opper Alloy
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C ontact Plating, Mating Area, Material = Gold (30)
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Handle Type = Low Profile
Housing Related Features:
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Housing C olor = Natural
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Housing Material = High Temperature Thermoplastic
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Housing Flammability Rating = UL 94V-0
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Housing Material Temperature = High
Industry Standards:
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RoHS/ELV C ompliance
= ELV compliant, 5 of 6 C ompliant
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Lead Free Solder Processes
= Not suitable for lead free processing
Operation/Application:
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Application
= Production
Packaging Related Features:
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Packaging Method
= JEDEC Hard Tray
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Packaging Quantity = 540 sockets/box
Other:
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Brand = AMP
Additional Information:
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Product Line Information
Related Products:
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Tooling
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