INTERCONNECTS
2,0 Grid
Surface Mount Headers And Sockets
Left Hand
Footprint
2,21
2,0
Series 830, 831
832, 833
0,48
3,61
2,79
4,8
2,29
Right Hand
Footprint
2,0
4,0
1,14
4,39
•
Series 830 and 831
interconnects are
available in single
and double row
form.
•
Single row intercon-
nects having an
even number of pins
are now available
with a left or right
hand footprint.
•
Headers (830 &
832) use MM# 6218
pins. (See page 166 for details)
•
Sockets (831 & 833) use MM# 1802 receptacles and
accept pin diameters from 0,38-0,64. (See page 138
for details)
•
Insulators are high temp. thermoplastic.
Fig. 1
4,83
Footprint
2,41
4,19
2,0
2,0
2,0
1,14
0,48
3,61
2,79
4,8
6,86
Ordering Information
Fig. 1L
Single Row Header, Left Hand Footprint
Odd or Even # of pins
6,4
2,0
830-XX-0_ _-30-001000
Specify # of pins
01-50
Single Row Header, Right Hand Footprint
Even # of pins
Fig. 2
Left Hand
Footprint
Fig. 1R
830-XX-0_ _-30-002000
Specify even # of pins
02-50
Double Row Header, Even # of pins
2,21
2,0
2,11
3,68
2,79
5,79
2,29
Fig. 2
SPECIFY PLATING CODE XX=
1,14
832-XX-_ _ _-30-001000
Specify even # of pins
10
0,25µm Au
Right Hand
Footprint
4,39
2,0
4,0
002-100
90
5,08µm Sn/Pb
40
5,08µm Sn
Pin Plating
Fig. 3
4,83
Fig. 3L
Single Row Socket, Left Hand Footprint
Odd or Even # of pins
831-XX-0_ _-30-001000
Specify # of pins
01-50
Single Row Socket, Right Hand Footprint
Even # of pins
Footprint
2,41
4,19
2,0
2,0
1,14
3,68
2,11
2,79
5,79
6,86
2,0
Fig. 3R
831-XX-0_ _-30-002000
Specify even # of pins
02-50
Double Row Socket, Even # of pins
Fig. 4
SPECIFY PLATING CODE XX=
833-XX-_ _ _-30-001000
Specify even # of pins
13
0,76µm Au
6,4
2,0
002-100
99
43
44
93
0,76µm Au
Fig. 4
w w w. m i l l - m a x . c o m
Sleeve (Pin)
Contact (Clip)
0,25µm Au 5,08µm Sn/Pb 5,08µm Sn/Pb 5,08µm Sn 5,08µm Sn
5,08µm Sn/Pb 0,76µm Au 5,08µm Sn
74
516-922-6000
FPGA/CPLD
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