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192990-0060

产品描述Wire Terminal, 1.5mm2,
产品类别连接器    连接器支架   
文件大小312KB,共7页
制造商ITT
官网地址http://www.ittcannon.com/
标准
下载文档 详细参数 全文预览

192990-0060概述

Wire Terminal, 1.5mm2,

192990-0060规格参数

参数名称属性值
是否Rohs认证符合
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time7 weeks
Is SamacsysN
其他特性CONTACT FINISH: TIN
组装件名称CONTACT
连接器支架类型CONNECTOR ACCESSORY
接触器设计STAMPED
触点性别MALE
DIN 符合性NO
IEC 符合性NO
MIL 符合性NO
材料BRASS
额定电流13 A
最大线径16 AWG
最小线径18 AWG
Base Number Matches1

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Cannon Trident Connector System
General recommendations for the selec-
tion of Trident contacts are listed below.
Platings: Tin is recommended for most
applications. It is cost effective and
matches well to most wires. Gold is pre-
ferred for special situations. Gold resists
oxidation, has high surface conductivity,
and has a low coefficient of friction.
These features make gold the preferred
plating for low level signals (a rule of
thumb is <100 mA), corrosive environ-
ments (for unsealed connectors), and for
increased mating cycles. The electrical
performance of the contact is determined
at the surface of the contact. For this rea-
son, flash gold platings are suitable for
applications with 50 or fewer mating
cycles. Thicker gold platings are recom-
mended for more than 50 mating cycles.
Stamped versus Machined:
The two
part stamped contacts are manufactured
to precise tolerances and are field proven.
They can be supplied on reels which
lowers assembly costs for volume
Contacts
production. Machined contacts offer
improved precision and durability. They
are recommended for applications with
more than 200 mating cycles.
Crimp versus Solder:
Crimp contacts
offer improved electrical performance,
strain relief and quality control compared
to solder cup contacts. Solder cups
contacts are recommended for low
volume and prototype applications
where the added cost of crimp tools is
not justified.
High Conductivity:
These contacts
use a different base material then the
standard contacts. They are recommend-
ed for high current applications. These
contacts will also reduce the derating of
connectors with several high current lines.
Contact Performance Data
Characteristics
Body Material
Retention
Spring Material
Contact Retention
(minimum)
Current Rating
Contact Resistance
(initial)
Mechanical
Endurance
(minimum)
Contacts
Formed (Stamped)
Standard High Conductivity
Brass
Copper Alloy
Brass
Brass
67 N
13 A
5 mΩ
200
Insertions
67 N
16 A
5 mΩ
200
Insertions
Machined
Brass
Beryllium
Copper
67 N
13 A
5 mΩ
500
Insertions
Solder Cup
Brass
Beryllium
Copper
67 N
13 A
5 mΩ
500
Insertions
Flow Solder
(PCB)
Brass
Beryllium
Copper
67 N
13 A
5 mΩ
500
Insertions
30 A
Power
Copper Alloy
Stainless Steel
100 N
30 A
2.5 mΩ
200
Insertions
Coaxial
Brass
Beryllium
Copper
67 N
N/A
2.5 m
200
Insertions
For Tooling and Assembly instructions, see pages 51-58.
Temperature/Current Rating
30ºC Temperature Rise
Derived in accordance with IEC 512-3,
Test 5b.
CURRENT A
13
12
11
10
9
8
7
6
5
4
3
2
1
0
20
30
40
50
60
70
80
90
100 105 110
120 125
SNAP TOGETHER
SLIMLINE CONNECTORS
SNAP TOGETHER
CONNECTORS
RINGLOCK
CONNECTORS
UPPER MATERIAL LIMIT
Figures are for maximum wire sizes.
Smaller wires will reduce rating.
All contacts equally loaded.
PCB mounted connectors will be limited
by PCB performance.
Bunched cables will further reduce values.
Cable insulation type will affect
temperature and loading.
Figures are for maximum connector
sizes in each range. Smaller connectors
will increase rating.
MUTLIWAY
RECTANGULAR
CONNECTORS
TEMPERATURE °C
Dimensions shown in mm (inch)
Specifications and dimensions subject to change
46
www.ittcannon.com
UPPER LIMIT - MULTIWAY

 
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