socket junction modules 21p socket junction module size 22
| 参数名称 | 属性值 |
| Manufacture | Amphenol |
| 产品种类 Product Category | Socket Junction Modules |
| RoHS | N |
| Produc | Socket Junction Modules |
| 大小 Size | 22 |
| 位置数量 Number of Positions | 20 |
| 安装风格 Mounting Style | DIN Rail |
| 封装 Body Material | Polyetherimide |
| 类 Class | D |
| Contact Gende | Without Socket Contacts |
| 触点材料 Contact Material | Copper Alloy |
| 主体材料 Contact Plating | Gold |
| 电流额定值 Current Rating | 5 A |
| 绝缘电阻 Insulation Resistance | 5000 MOhms |
| MIL 类型 MIL Type | MIL-T-81714 II |
| 工作温度范围 Operating Temperature Range | - 65 C to + 200 C |

| M81714/60-22-06-LC | M81714/60-22-05-LC | |
|---|---|---|
| 描述 | socket junction modules 21p socket junction module size 22 | socket junction modules 21p socket junction module size 22 |
| Manufacture | Amphenol | Amphenol |
| 产品种类 Product Category |
Socket Junction Modules | Socket Junction Modules |
| RoHS | N | N |
| Produc | Socket Junction Modules | Socket Junction Modules |
| 大小 Size |
22 | 22 |
| 位置数量 Number of Positions |
20 | 20 |
| 安装风格 Mounting Style |
DIN Rail | DIN Rail |
| 封装 Body Material |
Polyetherimide | Polyetherimide |
| 类 Class |
D | D |
| Contact Gende | Without Socket Contacts | Without Socket Contacts |
| 触点材料 Contact Material |
Copper Alloy | Copper Alloy |
| 主体材料 Contact Plating |
Gold | Gold |
| 电流额定值 Current Rating |
5 A | 5 A |
| 绝缘电阻 Insulation Resistance |
5000 MOhms | 5000 MOhms |
| MIL 类型 MIL Type |
MIL-T-81714 II | MIL-T-81714 II |
| 工作温度范围 Operating Temperature Range |
- 65 C to + 200 C | - 65 C to + 200 C |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved