GS72116ATP/J/T/U
SOJ, TSOP, FP-BGA, TQFP
Commercial Temp
Industrial Temp
Features
• Fast access time: 6, 8, 10, 12 ns
• CMOS low power operation: 165/125/100/85 mA at
minimum cycle time
• Single 3.3 V power supply
• All inputs and outputs are TTL-compatible
• Byte control
• Fully static operation
• Industrial Temperature Option:
–40°
to 85°C
• Package line up
J: 400 mil, 44-pin SOJ package
TP: 400 mil, 44-pin TSOP Type II package
T: 10 mm x 10 mm, 44-pin TQFP
U: 6 mm x 8 mm Fine Pitch Ball Grid Array package
128K x 16
2Mb Asynchronous SRAM
A
4
A
3
A
2
A
1
A
0
CE
DQ
1
DQ
2
DQ
3
DQ
4
V
DD
V
SS
DQ
5
DQ6
DQ7
DQ
8
WE
A
15
A
14
A
13
A
12
A
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
6, 8, 10, 12 ns
3.3 V V
DD
Center V
DD
and V
SS
SOJ 128K x 16-Pin Configuration
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A
5
A
6
A
7
OE
UB
LB
DQ
16
DQ
15
DQ
14
DQ
13
V
SS
V
DD
DQ
12
DQ
11
DQ
10
DQ
9
NC
A
8
A
9
A
10
A
11
NC
Top view
44-pin
SOJ
Description
The GS72116A is a high speed CMOS Static RAM organized
as 131,072 words by 16 bits. Static design eliminates the need
for external clocks or timing strobes. The GS operates on a sin-
gle 3.3 V power supply and all inputs and outputs are TTL-
compatible. The GS72116A is available in a 6 mm x 8 mm
Fine Pitch BGA package, a 10 mm x 10 mm TQFP package, as
well as in 400 mil SOJ and 400 mil TSOP Type-II packages.
Package J
Pin Descriptions
Symbol
A
0
–A
16
DQ
1
–DQ
16
CE
LB
UB
WE
OE
V
DD
V
SS
NC
Description
Address input
Data input/output
Chip enable input
Lower byte enable input
(DQ1 to DQ8)
Upper byte enable input
(DQ9 to DQ16)
Write enable input
Output enable input
+3.3 V power supply
Ground
No connect
Rev: 1.03 3/2002
1/18
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72116ATP/J/T/U
44-Pin TQFP 128K x 16-Pin Configuration
A
16
A
15
A
14
A
13
A
12
A
11
A
10
A
9
OE UB LB
CE
DQ
1
DQ
2
DQ
3
DQ
4
V
DD
V
SS
1
2
3
4
5
6
7
8
9
44 43 42 41 40 39 38 37 36 35 34
33
32
31
30
29
28
27
26
25
24
DQ
16
DQ
15
DQ
14
DQ
13
V
SS
V
DD
DQ
12
DQ
11
DQ
10
DQ
9
NC
DQ
5
DQ
6
DQ
7
DQ
8
10
23
11
12 13 14 15 16 17 18 19 20 21 22
WE A
0
A
1
A
2
A
3
A
4
NC A
5
A
6
A
7
A
8
Package T
Fine Pitch BGA 128K x 16-Bump Configuration
1
2
3
4
5
6
A
B
C
D
E
F
G
H
LB
DQ
16
OE
UB
A
0
A
3
A
5
NC
NC
A
8
A
10
A
13
A
1
A
4
A
6
A
7
A
16
A
9
A
11
A
14
A
2
CE
DQ
2
DQ
4
DQ
5
DQ
7
WE
A
15
NC
DQ
1
DQ
3
V
DD
V
SS
DQ
14
DQ
15
V
SS
V
DD
DQ
13
DQ
12
DQ
11
DQ
10
DQ
9
NC
NC
A
12
DQ
6
DQ
8
NC
6 mm x 8 mm, 0.75 mm Bump Pitch
Top View
Package U
Rev: 1.03 3/2002
2/18
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72116ATP/J/T/U
TSOP-II 128K x 16-Pin Configuration
A
4
A
3
A
2
A
1
A
0
CE
DQ
1
DQ
2
DQ
3
DQ
4
V
DD
V
SS
DQ
5
DQ
6
DQ
7
DQ
8
WE
A
15
A14
A
13
A
12
A
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A
5
A
6
A
7
OE
UB
LB
DQ
16
DQ
15
DQ
14
DQ
13
V
SS
V
DD
DQ
12
DQ
11
DQ
10
DQ
9
NC
A
8
A
9
A
10
A
11
NC
Top view
44-pin
TSOP II
Package TP
Block Diagram
A
0
Address
Input
Buffer
Row
Decoder
Memory Array
A
16
CE
WE
Control
OE
UB
_____
LB
_____
Column
Decoder
I/O Buffer
DQ
1
DQ
16
Rev: 1.03 3/2002
3/18
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72116ATP/J/T/U
Truth Table
CE
H
OE
X
WE
X
LB
X
L
UB
X
L
H
L
L
H
L
X
H
DQ
1
to DQ
8
Not Selected
Read
Read
High Z
Write
Write
Not Write, High Z
High Z
High Z
DQ
9
to DQ
16
Not Selected
Read
High Z
Read
Write
Not Write, High Z
Write
High Z
High Z
V
DD
Current
ISB
1
, ISB
2
L
L
H
L
H
L
L
X
L
L
H
I
DD
L
L
H
X
H
X
X
H
Note: X: “H” or “L”
Absolute Maximum Ratings
Parameter
Supply Voltage
Input Voltage
Output Voltage
Allowable power dissipation
Storage temperature
Symbol
V
DD
V
IN
V
OUT
PD
T
STG
Rating
–0.5
to +4.6
–0.5
to V
DD
+0.5
(≤ 4.6 V max.)
–0.5
to V
DD
+0.5
(≤ 4.6 V max.)
0.7
–55
to 150
Unit
V
V
V
W
o
C
Note:
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Rec-
ommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device
reliability.
Rev: 1.03 3/2002
4/18
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72116ATP/J/T/U
Recommended Operating Conditions
Parameter
Supply Voltage for -8/-10/12
Supply Voltage for -6
Input High Voltage
Input Low Voltage
Ambient Temperature,
Commercial Range
Ambient Temperature,
Industrial Range
Symbol
V
DD
V
DD
V
IH
V
IL
T
Ac
T
A
I
Min
3.0
3.135
2.0
–0.3
0
–40
Typ
3.3
3.3
—
—
—
—
Max
3.6
3.6
V
DD
+0.3
0.8
70
85
Unit
V
V
V
V
o
C
C
o
Note:
1. Input overshoot voltage should be less than V
DD
+2 V and not exceed 20 ns.
2. Input undershoot voltage should be greater than
–2
V and not exceed 20 ns.
Capacitance
Parameter
Input Capacitance
Output Capacitance
Symbol
C
IN
C
OUT
Test Condition
V
IN
= 0 V
V
OUT
= 0 V
Max
5
7
Unit
pF
pF
Notes:
1. Tested at T
A
= 25°C, f = 1 MHz
2. These parameters are sampled and are not 100% tested.
DC I/O Pin Characteristics
Parameter
Input Leakage
Current
Output Leakage
Current
Output High Voltage
Output Low Voltage
Symbol
I
IL
I
LO
V
OH
V
OL
Test Conditions
V
IN
= 0 to V
DD
Output High Z
V
OUT
= 0 to V
DD
I
OH
=
–4mA
I
LO
= +4mA
Min
–
1 uA
–1
uA
2.4
—
Max
1 uA
1 uA
—
0.4 V
Rev: 1.03 3/2002
5/18
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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