Closed Frame
Dual In-Line Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Standard & High Temperature Closed Frame DIP Sockets
Conforms to NECQ/EIA 540D000 & 540DAAA Standards
Features:
• Multiple finger contact on all sockets
assures maximum reliability.
• Tapered entry for ease of insertion.
• Closed bottom sleeve for 100% anti-
wicking of solder.
• To fit .100” (2.54 mm) pitch.
• Easily customized to fit your application.
• For surface mount applications use HDS
only.
Standard Sockets
DS -
Insulator Material:
Glass Filled Thermoplastic Polyester (P.B.T.)
U.L. Rated 94V-O, -60˚C to 140˚C (-76˚F to 284˚F)
How To Order
DS
Body Type
Standard Closed Frame DIP
DIP Spacing
3 - .300" (7.62 mm)
4 - .400" (10.16 mm)
6 - .600" (15.24 mm)
3
16
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types.
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
63% Tin, 37% Lead
Number of Pins
(8 to 40)
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
High Temperature Sockets
HDS -
Insulator Material:
High Temp. Glass Filled Thermoplastic
U.L. Rated 94V-O, -60˚C to 260˚C (-76˚F to 500˚F)
How To Order
HDS
Body Type
High Temp. Closed Frame DIP
DIP Spacing
3 - .300" (7.62 mm)
4 - .400" (10.16 mm)
6 - .600" (15.24 mm)
3
16
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types.
Number of Pins
(8 to 40)
NECQ = National Electronic Component Qualification System
EIA = Electronic Industry Association
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 80
Closed Frame
Dual In-Line Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Standard & High Temperature Closed Frame DIP Sockets
Conforms to NECQ/EIA 540D000 & 540DAAA Standards
A
C
B
Low Profile Solder Tail
Type -01
Terminal Information
Low Profile Solder Tail
Type -29
Low Profile Solder Tail
Type -30
.125
(3.18)
.125
(3 18)
.165
(4.19)
.125
(3.18)
.020 Dia.
(.51)
.020 Dia.
(.51)
.165
(4.19)
.170
(4.32)
.020 Dia.
(.51)
.165
(4.19)
.275
(6.99)
Dimensional Information
# of
Pins
8
14
16
18
20
22
24
28
40
A
B
C
.300
.400
.400
(7.62)
(10.16)
(10.16)
.300
.400
.700
(7.62)
(10.16)
(17.78)
.300
.400
.800
(7.62)
(10.16)
(20.32)
.300
.400
.900
(7.62)
(10.16)
(22.86)
.300
.400
1.000
(7.62)
(10.16)
(25.40)
.400
.500
1.100
(10.16)
(12.70)
(27.94)
.600
.700
1.200
(15.24)
(17.78)
(30.48)
.600
.700
1.400
(15.24)
(17.78)
(35.56)
.600
.700
2.000
(15.24)
(17.78)
(50.80)
Also available in Open Frame,
LS series, see page 82
Surface Mount
Type -37
HDS Only
Low Profile Solder Tail
Type -51
Wire Wrap
®
Type - 02, - 03
.155
(3.94)
.130
(3.30)
.110
(2.79)
.020 Dia.
(.51)
.190
(4.83)
.052 Dia.
(1.32)
2 level
.360/(9.14)
3 level .500/(12.70)
.025 Sq.
(.64)
Quick turn delivery available on standard terminal types.
Additional terminal types available.
See terminal section for detailed terminal information.
Solder Preform PGA Sockets - Intrusive Reflow Application
Available on HDS Body Type
Features:
• Combines the labor of socket loading and
solder application into one operation.
• Eliminates the use of solder paste and
screening operation.
• Eliminates solder bridges and/or solder
shorts due to excess solder.
• Ensures a reliable solder joint with
controlled solder volume.
• Ideal for surface mount and mixed
technology applications.
• For custom solder preform terminal
applications consult factory.
• See previous page for material
specifications and how to order
Wire Wrap
®
is a registered trademark of Gardner-Denver Co.
Solder Preform
PC Board
Preform After
Solder Flow
Solder Preform Terminals
Type -150
.072 Dia.
(1.83)
Type -151
.072 Dia.
(1.83)
.072 Dia.
(1.83)
.165
.165
(4.19)
(4.19)
Solder
Preform
.125
.125
(3.18)
(3.18)
.020 Dia.
(.51)
.130
(3.30)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
.020 Dia.
(.51)
NECQ = National Electronic Component Qualification System
EIA = Electronic Industry Association
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 81
FPGA/CPLD
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