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CYG2217

产品描述MODEM-SUPPORT CIRCUIT, DMA9
产品类别热门应用    无线/射频/通信   
文件大小381KB,共4页
制造商CLARE
官网地址http://www.clare.com
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CYG2217概述

MODEM-SUPPORT CIRCUIT, DMA9

CYG2217规格参数

参数名称属性值
功能数量1
端子数量9
最小工作温度0.0 Cel
最大工作温度70 Cel
加工封装描述1.070 X 1.070 X 0.400 INCH MODULE-9
each_compliYes
状态Active
通信类型MODEM-SUPPORT CIRCUIT
jesd_30_codeS-XDMA-P9
jesd_609_codee0
moisture_sensitivity_levelNOT SPECIFIED
包装材料UNSPECIFIED
ckage_codeDIP
ckage_equivalence_codeDIP18(UNSPEC)
包装形状SQUARE
包装尺寸MICROELECTRONIC ASSEMBLY
eak_reflow_temperature__cel_NOT SPECIFIED
wer_supplies__v_5
qualification_statusCOMMERCIAL
sub_categoryOther Telecom ICs
最大供电电压0.0060 mA
额定供电电压5 V
表面贴装NO
工艺HYBRID
温度等级COMMERCIAL
端子涂层TIN LEAD
端子形式PIN/PEG
端子位置DUAL
ime_peak_reflow_temperature_max__s_NOT SPECIFIED

文档预览

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CYG2217
CYBERGATE™
Features
Low distortion transformer signal coupling
(0.01% max)
Complete ring detector circuit
Low power hookswitch
Electronic inductor/gyrator circuit
Solid state surge protection
Transient protection zeners
Complete hybrid circuit (2-4 wire converter)
included
Compatible with all modem chip sets
V.32 bis/V.34 compatible
Description
Clare’s Cybergate™ CYG2217 DAA module provides a
complete telephone line interface circuit, including a 2-4
wire converter for transmit and receive signal separation
in a small 1.07" x 1.07" x 0.4" package. The module pro-
vides a fast and cost effective solution for designs that
require an interface to the telephone line. The module is
designed to meet FCC part 68 requirements thus provid-
ing a low risk design solution.
Applications
Modems
Fax machines
Remote data acquisition
Security systems
Voice mail systems
PC motherboard
Computer telephony
Process control
Medical
PBX
Direct broadcast satellite
Approvals
UL recognized file #: E174201
Ordering Information
Part #
CYG2217
Description
DAA Module (18/Tube)
Block Diagram
XMIT+
2 to 4
Wire
Converter
RCV
OH
Line
Transformer
Line
Current
Circuit
Surge
Protection
TIP
RING
Hookswitch
RI
Ring
Detect
Handling and Assembly Recommendations
The CYG2217 products are not hermetically sealed and should not be exposed to any liquid-based rinsing processes. Clare recommends two (2) approaches. The
modem should either use a no clean soldering flux that would mostly evaporate during the normal wave soldering processes, or be soldered in by hand after the rest of
the card is wave soldered.
DS-CYG2217-R1
www.clare.com
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