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TPS61085
SLVS859B – JUNE 2008 – REVISED DECEMBER 2014
TPS61085 650-kHz,1.2-MHz, 18.5-V Step-Up DC-DC Converter
1 Features
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•
•
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1
3 Description
The TPS61085 is a high frequency, high efficiency
DC-DC converter with an integrated 2.0-A, 0.13-Ω
power switch capable of providing an output voltage
up to 18.5 V. The selectable frequency of 650 kHz or
1.2 MHz allows the use of small external inductors
and capacitors and provides fast transient response.
The external compensation allows optimizing the
application for specific conditions. A capacitor
connected to the soft-start pin minimizes inrush
current at startup.
Device Information
(1)
PART NUMBER
TPS61085
PACKAGE
VSSOP (8)
TSSOP (8)
BODY SIZE (NOM)
3.00 mm × 3.00 mm
3.00 mm × 4.40 mm
2.3 V to 6 V Input Voltage Range
18.5-V Boost Converter With 2.0-A Switch Current
650-kHz/1.2-MHz Selectable Switching Frequency
Adjustable Soft-Start
Thermal Shutdown
Undervoltage Lockout
8-Pin VSSOP Package
8-Pin TSSOP Package
2 Applications
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Handheld Devices
GPS Receivers
Digital Still Cameras
Portable Applications
DSL Modems
PCMCIA Cards
TFT LCD Bias Supply
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Schematic
L
3.3
m
H
V
IN
2.3 V to 6 V
C
BY
1 µF
16 V
6
IN
3
SW
5
D
PMEG2010AEH
R1
158 k
R2
18.2 k
V
S
12 V/300 mA
C
IN
10 µF
16 V
EN
2
FB
1
C
OUT
2* 10 µF
25 V
7
FREQ
4
GND
TPS61085
SS
COMP
8
R
COMP
51 k
C
COMP
1.1 nF
C
SS
100 nF
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61085
SLVS859B – JUNE 2008 – REVISED DECEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features
..................................................................
Applications
...........................................................
Description
.............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions
.........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
1
1
1
1
2
3
3
3
3
4
4
4
5
8.3 Feature Description...................................................
8
8.4 Device Functional Modes..........................................
8
9
Application and Implementation
..........................
9
9.1 Application Information..............................................
9
9.2 Typical Application ....................................................
9
9.3 System Examples ...................................................
15
10 Power Supply Recommendations
.....................
18
11 Layout...................................................................
19
11.1 Layout Guidelines .................................................
19
11.2 Layout Example ....................................................
19
12 Device and Documentation Support
.................
20
12.1 Trademarks ...........................................................
20
12.2 Electrostatic Discharge Caution ............................
20
12.3 Glossary ................................................................
20
8
Detailed Description
..............................................
7
8.1 Overview ...................................................................
7
8.2 Functional Block Diagram .........................................
7
13 Mechanical, Packaging, and Orderable
Information
...........................................................
20
5 Revision History
Changes from Revision A (April 2012) to Revision B
•
Page
Added
ESD Ratings
table,
Feature Description
section,
Device Functional Modes, Application and Implementation
section,
Power Supply Recommendations
section,
Layout
section,
Device and Documentation Support
section, and
Mechanical, Packaging, and Orderable Information
section ..................................................................................................
1
Changes from Original (June 2008) to Revision A
•
•
•
•
•
•
•
•
•
•
•
Page
Changed the circuit illustration value of C
COMP
From: 1.6 nF To: 1.1 nF ...............................................................................
1
Deleted Lead Temperature from the Abs Max table ..............................................................................................................
3
Added a conditions statement and two new graphs (Max Load Current vs Input Voltage) to the Typical
Characteristics graphs ............................................................................................................................................................
5
Added three paragraphs of text to the Detailed Description. .................................................................................................
7
Changed
Figure 8
to
Figure 17
..............................................................................................................................................
9
Changed the Design Procudures step 3 details following
Equation 4
................................................................................
10
Changed text in the Inductor Selection section "inductor current ripple is below 20%" to " inductor current ripple is
below 35%" ..........................................................................................................................................................................
10
Changed
Equation 8............................................................................................................................................................. 12
Added Used I
OUT
to
Table 5.................................................................................................................................................. 12
Added
Equation 10
...............................................................................................................................................................
13
Changed the White LED Applications optional Zener connection for
Figure 19
to
Figure 21.............................................. 17
2
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TPS61085
Copyright © 2008–2014, Texas Instruments Incorporated
TPS61085
www.ti.com
SLVS859B – JUNE 2008 – REVISED DECEMBER 2014
6 Pin Configuration and Functions
DGK, PW Packages
8 Pins
Top View
COMP
FB
EN
PGND
1
2
3
4
8
7
6
5
SS
FREQ
IN
SW
8-PIN 4.9-mm × 3-mm × 1.1-mm VSSOP (DGK)
8-PIN 6.4-mm × 3-mm × 1.2-mm TSSOP (PW)
Pin Functions
PIN
NAME
COMP
EN
FB
FREQ
IN
PGND
SS
SW
NO.
1
3
2
7
6
4
8
5
O
I
I/O
I/O
I
I
I
I
Compensation pin
Shutdown control input. Connect this pin to logic high level to enable the device
Feedback pin
Frequency select pin. The power switch operates at 650 kHz if FREQ is connected to GND and at 1.2 MHz if
FREQ is connected to IN
Input supply pin
Power ground
Soft-start control pin. Connect a capacitor to this pin if soft-start needed. Open = no soft-start
Switch pin
DESCRIPTION
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
Input voltage range IN
Voltage range on pins EN, FB, SS, FREQ, COMP
Voltage on pin SW
Continuous power dissipation
Operating junction temperature
Storage temperature
(1)
(2)
–0.3
–0.3
-0.3
–40
–65
MAX
7
7
20
150
150
UNIT
V
V
V
°C
°C
See
Thermal Information
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability
All voltage values are with respect to network ground terminal.
7.2 ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
V
(ESD)
Electrostatic discharge
(1)
UNIT
±2000
±500
±200
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101
(2)
Machine model (MM)
(1)
(2)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±XXX V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±YYY V may actually have higher performance.
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TPS61085
3
Copyright © 2008–2014, Texas Instruments Incorporated
TPS61085
SLVS859B – JUNE 2008 – REVISED DECEMBER 2014
www.ti.com
7.3 Recommended Operating Conditions
MIN
V
IN
V
S
T
A
T
J
Input voltage range
Boost output voltage range
Operating free-air temperature
Operating junction temperature
2.3
V
IN
+ 0.5
–40
–40
TYP
MAX
6
18.5
85
125
UNIT
V
V
°C
°C
7.4 Thermal Information
TPS61085
THERMAL METRIC
R
θJA
R
θJC(top)
R
θJB
ψ
JT
ψ
JB
(1)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
(1)
DGK
8 PINS
189.3
57.1
109.9
3.5
108.3
PW
8 PINS
183.3
66.7
112.0
8.3
110.3
UNIT
°C/W
For more information about traditional and new thermal metrics, see the
IC Package Thermal Metrics
application report,
SPRA953.
7.5 Electrical Characteristics
V
IN
= 3.3 V, EN = V
IN
, V
S
= 12 V, T
A
= –40°C to 85°C, typical values are at T
A
= 25°C (unless otherwise noted)
PARAMETER
SUPPLY
V
IN
I
Q
I
SDVIN
UVLO
T
SD
T
SD(HYS)
V
IH
V
IL
I
lkg
V
S
V
FB
gm
I
FB
r
DS(on)
I
lkg
I
LIM
I
SS
f
S
Input voltage range
Operating quiescent current into IN
Shutdown current into IN
Undervoltage lockout threshold
Thermal shutdown
Thermal shutdown hysteresis
High level input voltage
Low level input voltage
Input leakage current
Boost output voltage
Feedback regulation voltage
Transconductance error amplifier
Feedback input bias current
N-channel MOSFET on-resistance
SW leakage current
N-Channel MOSFET current limit
Soft-start current
Oscillator frequency
Line regulation
Load regulation
V
SS
= 1.238 V
FREQ = V
IN
FREQ = GND
V
IN
= 2.3 V to 6 V, I
OUT
= 10 mA
V
IN
= 3.3 V, I
OUT
= 1 mA to 400 mA
V
FB
= 1.238 V
V
IN
= V
GS
= 5 V, I
SW
= current limit
V
IN
= V
GS
= 3.3V, I
SW
= current limit
EN = GND, V
SW
= 6V TBD
2.0
7
0.9
480
2.6
10
1.2
650
0.0002
0.11
0.13
0.15
V
IN
= 2.3 V to 6 V
V
IN
= 2.3 V to 6 V
EN = FREQ = GND
V
IN
+
0.5
1.230
1.238
107
0.1
0.20
0.24
10
3.2
13
1.5
820
µA
A
μA
MHz
kHz
%/V
%/A
2
0.5
0.1
18.5
1.246
Device not switching, V
FB
= 1.3 V
EN = GND
V
IN
falling
V
IN
rising
Temperature rising
150
14
2.3
70
6
100
1
2.2
2.3
V
μA
μA
V
V
°C
°C
V
V
μA
V
V
μA/V
μA
Ω
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LOGIC SIGNALS EN, FREQ
BOOST CONVERTER
4
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Product Folder Links:
TPS61085
Copyright © 2008–2014, Texas Instruments Incorporated
TPS61085
www.ti.com
SLVS859B – JUNE 2008 – REVISED DECEMBER 2014
7.6 Typical Characteristics
The typical characteristics are measured with the inductors 7447789003 3.3 µH (high frequency) or B82464G4 6.8 µH (low
frequency) from Epcos and the rectifier diode SL22.
Table 1. Table Of Graphs
FIGURE
I
OUT(max)
η
Maximum load current
Efficiency
Supply current
Frequency
Frequency
vs Input voltage at high frequency (1.2 MHz)
vs Input voltage at low frequency (650 kHz)
vs Load current, V
S
= 12 V, V
IN
= 3.3 V
vs Load current, V
S
= 9 V, V
IN
= 3.3 V
vs Supply voltage
vs Load current
vs Supply voltage
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
1.6
f
S
= 1.2 MHz
1.4
1.2
I
OUT
− Output Current (A)
1
0.8
0.6
0.4
0.2
V
OUT
= 18.5 V
0
2.5
3.0
3.5
4.0
4.5
5.0
V
IN
− Input Voltage (V)
5.5
6.0
G000
1.6
f
S
= 1.2 MHz
V
OUT
= 9 V
1.4
1.2
V
OUT
= 12 V
I
OUT
− Output Current (A)
1
0.8
0.6
0.4
V
OUT
= 15 V
V
OUT
= 15 V
0.2
V
OUT
= 18.5 V
0
2.5
3.0
3.5
4.0
4.5
5.0
V
IN
− Input Voltage (V)
5.5
6.0
G000
V
OUT
= 9 V
V
OUT
= 12 V
Figure 1. Maximum Load Current vs Input Voltage
Figure 2. Maximum Load Current vs Input Voltage
Copyright © 2008–2014, Texas Instruments Incorporated
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