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TLK1501IRCPG4

产品描述0.6 to 1.5 Gbps Transceiver 64-HVQFP -40 to 85
产品类别无线/射频/通信    电信电路   
文件大小1MB,共33页
制造商Bel Fuse
标准
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TLK1501IRCPG4概述

0.6 to 1.5 Gbps Transceiver 64-HVQFP -40 to 85

TLK1501IRCPG4规格参数

参数名称属性值
Brand NameTexas Instruments
是否无铅不含铅
是否Rohs认证符合
厂商名称Bel Fuse
零件包装代码QFP
包装说明HVQFP-64
针数64
Reach Compliance Codecompliant
ECCN代码5A991.B.1
Factory Lead Time6 weeks
Is SamacsysN
数据速率2500000 Mbps
JESD-30 代码S-PQFP-G64
JESD-609代码e4
长度10 mm
湿度敏感等级3
功能数量1
端子数量64
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码HVFQFP
封装等效代码TQFP64,.47SQ
封装形状SQUARE
封装形式FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)260
电源2.5 V
认证状态Not Qualified
座面最大高度1 mm
标称供电电压2.5 V
表面贴装YES
技术TTL
电信集成电路类型TELECOM CIRCUIT
温度等级INDUSTRIAL
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度10 mm
Base Number Matches1

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TLK1501
0.6 TO 1.5 GBPS TRANSCEIVER
SLLS428F − JUNE 2000 − REVISED JANUARY 2004
D
Hot Plug Protection
D
0.6 to 1.5 Gigabits Per Second (Gbps)
D
D
D
D
D
Serializer/Deserializer
High-Performance 64-Pin VQFP Thermally
Enhanced Package (PowerPAD)
2.5 V Power Supply for Low Power
Operation
Programmable Voltage Output Swing on
Serial Output
Interfaces to Backplane, Copper Cables, or
Optical Converters
Rated for Industrial Temperature Range
D
On-Chip 8-Bit/10-Bit (8B/10B)
D
D
D
D
D
Encoding/Decoding, Comma Alignment,
and Link Synchronization
On-Chip PLL Provides Clock Synthesis
From Low-Speed Reference
Receiver Differential Input Thresholds
200 mV Minimum
Typical Power: 250 mW
Loss of Signal (LOS) Detection
Ideal for High-Speed Backplane
Interconnect and Point-to-Point Data Link
description
The TLK1501 is a member of the transceiver family of multigigabit transceivers used in ultrahigh-speed
bidirectional point-to-point data transmission systems. The TLK1501 supports an effective serial interface
speed of 0.6 Gbps to 1.5 Gbps, providing up to 1.2 Gbps of data bandwidth. The TLK1501 is pin-for-pin
compatible with the TLK2500. The TLK1501 is both pin-for-pin compatible with and functionally identical to the
TLK2501, a 1.6 to 2.5 Gbps transceiver, providing a wide range of performance solutions with no required board
layout changes.
The primary application of this chip is to provide very high-speed I/O data channels for point-to-point baseband
data transmission over controlled impedance media of approximately 50
Ω.
The transmission media can be
printed-circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is
dependent upon the attenuation characteristics of the media and the noise coupling to the environment.
This device can also be used to replace parallel data transmission architectures by providing a reduction in the
number of traces, connector terminals, and transmit/receive terminals. Parallel data loaded into the transmitter
is delivered to the receiver over a serial channel, which can be a coaxial copper cable, a controlled impedance
backplane, or an optical link. It is then reconstructed into its original parallel format. It offers significant power
and cost savings over current solutions, as well as scalability for higher data rate in the future.
The TLK1501 performs data conversion parallel-to-serial and serial-to-parallel. The clock extraction functions
as a physical layer interface device. The serial transceiver interface operates at a maximum speed of 1.5 Gbps.
The transmitter latches 16-bit parallel data at a rate based on the supplied reference clock (GTX_CLK). The
16-bit parallel data is internally encoded into 20 bits using an 8-bit/10-bit (8B/10B) encoding format. The
resulting 20-bit word is then transmitted differentially at 20 times the reference clock (GTX_CLK) rate. The
receiver section performs the serial-to-parallel conversion on the input data, synchronizing the resulting 20-bit
wide parallel data to the extracted reference clock (RX_CLK). It then decodes the 20 bit wide data using
8-bit/10-bit decoding format resulting in 16 bits of parallel data at the receive data terminals (RXD0-15). The
outcome is an effective data payload of 480 Mbps to 1.2 Gbps (16 bits data x the GTX_CLK frequency).
The TLK1501 is housed in a high performance, thermally enhanced, 64-pin VQFP PowerPAD package. Use
of the PowerPAD package does not require any special considerations except to note that the PowerPAD, which
is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is
recommended that the TLK1501 PowerPAD be soldered to the thermal land on the board. All ac performance
specifications in this data sheet are measured with the PowerPAD soldered to the test board.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
2000 − 2004, Texas Instruments Incorporated
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
1
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