Supporting next-generation 100 Gbps Ethernet and 100
Gbps InfiniBand* Enhanced Data Rate (EDR) applications,
Molex’s zQSFP+ Interconnect Solution transmits up
to 25 Gbps per-serial-lane data rates with excellent
signal integrity (SI), electro magnetic interference (EMI)
protection and thermal cooling
Molex’s zQuad Small Form-factor Pluggable Plus (zQSFP+) interconnect
solution is designed for high-density interconnect applications and conforms
to SFF-8665 QSFP28. Components of the system include SMT connectors
(series 170432); and stacked integrated 2-by-1, 2-by-2 and 2-by-3 connectors
and cages (series 171565). Products scheduled for upcoming release include:
copper passive cable assemblies (Series 111114); EMI cages (Series 111115)
and active optical cables (Series 106412).
Molex’s zQSFP+ SMT connector supports new 100 Gbps Ethernet and
100 Gbps InfiniBand* (IB) Enhanced Data Rate (EDR) applications. EDR
applications consist of four lanes of high-speed differential signals with
individual data rates at 25 Gbps. The preferential coupling design uses a
narrow-edge coupled, blanked- and formed-contact geometry and insert
molding to optimize electrical performance. The zQSFP+ connector shares
the same mating interface as the QSFP+ form factor, making it backward
compatible with current connectors, cages and cable assemblies. Overall
connector length is 2.20mm deeper than the current QSFP+ connector.
Soon-to-be-released zQSFP+ EMI cages will be designed with an advanced
heat-sink system to provide a high level of heat dissipation for next-
generation system-power levels. The spring-finger design will provide optimal
EMI grounding and allow for more space to route high-speed traces.
Future low-power, integrated active optical cable (AOC) solutions will provide
less expensive, reliable transport for aggregated data rates up to 100 Gbps.
The singlemode fiber technology will provide long reaches of up to 4km,
enabling deployment in data centers and campus environments.
zQuad Small Form-
factor Pluggable
Plus (zQSFP+)
Interconnect
System
170432
SMT Connectors
171565
Stacked Integrated
2-by-1, 2-by-2 and
2-by-3 Connectors
and Cages
zQSFP+ SMT Connector (Series 170432)
zQSFP+ Stacked, Integrated, 2-by-1
Connector and Cage (Series 171565)
*InfiniBand is a registered trademark of the InfiniBand Trade Association
Specifications
SMT Connectors
Reference Information
Packaging: Tape and Reel
UL File No.: E29179
CSA File No.: LR19980
Mates With:
Copper Cable Assemblies
(Series 74757, 111040)
Designed In: Millimeters
Electrical
Voltage: 30V
Current: 0.5A max.
Contact Resistance: 30 milliohms max.
Dielectric Withstanding Voltage: 500V AC
Insulation Resistance:
1000 Megohms min.
Mechanical
Contact Retention to Housing: 4.45N
Mating Force: 1.25N per circuit
Unmating Force: 0.25N per circuit
Durability:
250 cycles for 30μ” Gold (Au) plating
Physical
Housing:
High-Temperature Thermoplastic
Glass Filled, UL 94V-0, Black
Contact: Copper (Cu) Alloy
Plating:
Contact Area — 15μ” (0.38μm)
or 30μ” (0.76μm) Gold (Au)
Solder Tail Area — Tin (Sn)
Underplating — Nickel (Ni)
RoHS Compliant: Yes
Operating Temperature: -40 to +80°C
Stacked Integrated Connectors
and Cages
Reference Information
Packaging: Tray
UL File No.: E29179
Mates With:
Copper Cable Assemblies
(Series 74757, 111040)
Designed In: Millimeters
Electrical
Voltage: 30V
Current: 0.5A max.
Contact Resistance: 30 milliohms max.
Dielectric Withstanding Voltage:
500V AC
Insulation Resistance:
1000 Megohms min.
zQuad Small Form-
factor Pluggable
Plus (zQSFP+)
Interconnect
System
Mechanical
Mating Force: 0.75N per circuit
Unmating Force: 0.25N per circuit
Durability:
100 cycles for 30μ” Gold (Au) plating
Physical
Housing:
High-Temperature Thermoplastic
Glass Filled, UL 94V-0, Black
Contact: Copper (Cu) Alloy
Plating:
Contact Area —30μ” (0.76μm)
Gold (Au)
Signal Tail Area — Tin / Lead (Sn/Pb)
Underplating — Nickel (Ni)
RoHS Compliant: Yes – By Exemption
Operating Temperature: -40 to +80°C
Features and Benefits
Preferential coupling design uses a narrow-edge
coupled, blanked- and formed-contact
geometry and insert molding
Proven 25 Gbps data rate with potential up to 40 Gbps
Provides superior signal integrity (SI) performance,
including extremely low insertion loss (IL) of <0.8dB at
a very high frequency, 14 GHz
Meets or exceeds current requirements for 100 Gigabit
Ethernet and InfiniBand* EDR 4X applications. Supports
current 10 Gbps Ethernet and 16 Gbps Fibre Channel
applications. Scalable for next-generation applications
Provides superior EMI containment
For EMI suppression
Backward compatible with QSFP+ form factor to extend the
life of existing platforms and reduce development costs
Allows for ease of routing and provides the option for
placement on both sides of the PCB
Ideal for pluggable applications
Offers design options for high-density applications
Second-source option available
Stacked integrated connectors include an elastomeric
gasket
Stacked integrated connectors include a metal finger
gasket
Identical mating interface as the QSFP+ connector
Surface Mount Technology (SMT) design (series 170432
version only)
0.80mm pitch host connector designed for placement
beneath EMI cage
Stacked integrated connectors and cages are available
in three sizes (2-by-1, 2-by-2 and 2-by-3)
Drop-in replacement product from TE Connectivity
*InfiniBand is a registered trademark of the InfiniBand Trade Association
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