Document 265-1
Shielded High SRF Inductors – 0805PS
• Higher SRF and than our other power inductors
• High inductance with tight tolerance
• Excellent current handling for a part this size
Designer’s Kit C348
contains 6 of each part
Core material
Ceramic/Ferrite
Core and winding loss
See www.coilcraft.com/coreloss
Terminations
RoHS compliant silver-palladium-platinum-glass frit.
Other terminations available at additional cost.
Weight
57.6 – 62.4 mg
Ambient temperature
–40°C to +65°C with
Irms
current, +65°C to
+105°C with derated current
Storage temperature
Component: –40°C to +105°C.
Tape and reel packaging: –40°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+100 to +250 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Failures in Time (FIT) / Mean Time Between Failures (MTBF)
38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332
Packaging
1500/7″reel; 7500/13″ reel Plastic tape: 8 mm wide,
0.23 mm thick, 4 mm pocket spacing, 2.34 mm pocket depth
PCB washing
Only pure water or alcohol recommended
Isat
6
(A)
0.90
0.85
0.60
0.55
0.50
0.43
0.38
0.32
0.27
0.22
0.18
0.16
0.15
0.12
0.11
0.10
0.10
0.08
0.07
0.06
Irms
7
(A)
1.6
1.3
0.88
0.70
0.61
0.59
0.57
0.46
0.43
0.34
0.33
0.28
0.26
0.24
0.21
0.19
0.18
0.18
0.14
0.11
Part
number
1
0805PS-102KL_
0805PS-152KL_
0805PS-272KL_
0805PS-332KL_
0805PS-392KL_
0805PS-472KL_
0805PS-562KL_
0805PS-682KL_
0805PS-103KL_
0805PS-153KL_
0805PS-223KL_
0805PS-333KL_
0805PS-473KL_
0805PS-683KL_
0805PS-823KL_
0805PS-104KL_
0805PS-124KL_
0805PS-154KL_
0805PS-224KL_
0805PS-334KL_
L
2
±10%
(µH)
1.0
1.5
2.7
3.3
3.9
4.7
5.6
6.8
10
15
22
33
47
68
82
100
120
150
220
330
DCR
4
SRF
5
max
typ
at 1 MHz (Ohms) (MHz)
21
0.14
340
21
0.18
265
21
0.35
190
21
0.50
180
21
0.74
165
21
0.85
155
21
0.91
143
21
1.37
118
21
1.51
66
21
2.04
34
25
2.48
22
25
3.00
17
25
3.85
15
28
4.42
12
30
6.00
12
32
6.96
9.0
32
7.51
7.7
32
8.33
5.0
32
13.71
5.0
32
20.53
3.5
Q min
3
1. When ordering, please specify
termination
and
packaging
codes:
0805PS-334KLC
Termination: L
= RoHS compliant silver-palladium-platinum-glass
frit. Special order:
T
= RoHS tin-silver-copper
(95.5/4/0.5) or
S
= non-RoHS tin-lead (63/37).
Packaging: C
= 7″ machine-ready reel. EIA-481 embossed plastic
tape (1500 parts per full reel).
B
= Less than full reel. In tape, but not machine ready.
To have a leader and trailer added ($25 charge),
use code letter C instead.
D
= 13″ machine-ready reel. EIA-481 embossed plastic
tape. Factory order only, not stocked (7500 parts per
full reel).
2. Inductance measured at 100 kHz, 0.1 Vrms, using a Coilcraft SMD-A
fixture in Agilent/HP 4263B LCR meter.
3. Q measured on an Agilent/HP 4291 with an Agilent/HP 16193 test
fixture.
4. DCR measured on a micro-ohmmeter and a Coilcraft CCF840 test
fixture.
5. SRF measured using an Agilent/HP 8753D network analyzer and a
Coilcraft SMD-D test fixture.
6. DC current at which the inductance drops 10% (typ) from its value
without current.
7. Current that causes a 40°C temperature rise from 25°C ambient.
8. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Document 265-1
Revised 10/06/08
Document 265-2
Power Chip Inductors - 0805PS Series
Typical L vs Frequency Typical L vs Current
1000
330 µH
1000
330 µH
100 µH
100
100 µH
100
Inductance (µH)
10
10 µH
3.3 µH
1 µH
Inductance (µH)
10
10 µH
3.3 µH
1 µH
1
1
0.1
0.01
0.1
1
10
0.1
1
10
100
1000
Frequency (MHz)
Current (mA)
B
F
C
D
I
A
E
G
J
I
Typical Q vs Frequency
70
60
50
330 µH
H
Q factor
40
100 µH
30
20
10
0
0.1
1
1 µH
3.3 µH
10 µH
Terminal wraparound:
approx 0.010/0,25 both ends
Recommended
Land
Pattern
A
B
C
max max max
D
E
F
G
H
I
J
0.133 0.118 0.079 0.053 0.080 0.050 0.020 0.070 0.040 0.030 inches
3,38 3,00 2,00 1,35 2,03 1,27 0,51 1,78 1,02 0,76 mm
10
Frequency (MHz)
Irms Derating
120
110
100
Percent of rated
I
rms
90
80
70
60
50
40
30
20
10
0
-40
-20
0
20
40
60
80
100
120
Ambient temperature (°C)
Document 265-2
Revised 10/06/08
25°C
嵌入式系统
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