REVISIONS
LTR
A
B
DESCRIPTION
Delete subgroups 10 and 11 in Table IIA for device class Q. - lgt
Change made to paragraph 3.2.3. Remove radiation test circuit for device
types 01 and 02. – rrp
Delete case outline Z figure 1. Drawing updated to reflect current
requirements. – gt
For device type 02 only, make change to I
OS(+)
and I
OS(-)
test limits as
specified under Table I. - ro
To make the title generic, delete the words “Radiation hardened” from the title
block. Add footnote to Table IIB. Delete paragraph 4.4.4.1.1. Add CAGE
code 60264. - ro
DATE (YR-MO-DA)
00-03-07
00-10-13
03-02-28
05-10-24
APPROVED
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
C
D
E
11-06-22
C. SAFFLE
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
E
15
REV
SHEET
PREPARED BY
L. G. TRAYLOR
E
1
E
2
E
3
E
4
E
5
E
6
E
7
E
8
E
9
E
10
E
11
E
12
E
13
E
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
RAJESH PITHADIA
APPROVED BY
RAY MONNIN
DRAWING APPROVAL DATE
99-02-12
REVISION LEVEL
E
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, LINEAR, SINGLE, LOW-INPUT-
CURRENT OPERATIONAL AMPLIFIER,
EXTERNALLY COMPENSATED, MONOLITHIC
SILICON
SIZE
A
CAGE CODE
AMSC N/A
67268
SHEET
1 OF 15
5962-98637
DSCC FORM 2233
APR 97
5962-E323-11
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
R
98637
01
V
G
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
PM108A
LM108A
Circuit function
Single low-input-current operational amplifier
Single low-input-current operational amplifier
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
C
G
H
P
Z
Descriptive designator
GDIP1-T14 or CDIP2-T14
MACY1-X8
GDFP1-F10 or CDFP2-F10
GDIP1-T8 or CDIP2-T8
GDFP1-G10
Terminals
14
8
10
8
10
Package style
Dual-in-line
Can
Flat pack
Dual-in-line
Flat pack with gull wing leads
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98637
SHEET
E
2
1.3 Absolute maximum ratings. 1/
Supply voltage (V
CC
) .................................................................................
22 V
Input voltage (V
IN
) 2/ ................................................................................
Differential input current 3/ .......................................................................
Output short-circuit duration ......................................................................
Storage temperature range .......................................................................
Lead temperature :
Device type 01 (soldering, 60 seconds) .................................................
Device type 02 (soldering, 10 seconds) .................................................
Power dissipation (P
D
) 4/ ........................................................................
Thermal resistance, junction-to-case (
JC
) :
Case C, G, H, P .....................................................................................
Case Z ...................................................................................................
Thermal resistance, junction-to-ambient (
JA
) : 5/
Device type 01:
Case G ...............................................................................................
Case H ...............................................................................................
Case P ...............................................................................................
Device type 02:
Case C ...............................................................................................
Case G ...............................................................................................
Case H ...............................................................................................
Case P ...............................................................................................
Case Z ...............................................................................................
Junction temperature (T
J
) ..........................................................................
1.4 Recommended operating conditions.
Supply voltage (V
CC
) .................................................................................
5
V dc to
20
V dc
Ambient temperature range (T
A
) ............................................................... -55C to +125C
1.5 Radiation features.
Maximum total dose available (dose rate = 50 - 300 rads (Si)/s) .............. 100 krads (Si) 6/
15 V
10 mA
Indefinite
-65C to +150C
300C
300C
500 mW
See MIL-STD-1835
21C/W
150C/W
119C/W
119C/W
94C/W
159C/W
229C/W
123C/W
225C/W
+175C
_______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ For supply voltages less than
15
V, the absolute maximum input voltage is equal to the supply voltage.
3/ The inputs are shunted with back-to-back diodes for overvoltage protection. Therefore, if a differential input voltage in
excess of 1 V is applied between the inputs, excessive current will flow, unless some limiting resistance is provided.
4/
The maximum power dissipation must be derated at elevated temperatures and is dictated by T
J
,
JA
, and T
A
. The
maximum allowable power dissipation at any temperature is P
D
= (T
J
– T
A
)/
JA
or the number in 1.3 herein, whichever is
lower.
5/
JA
is specified for worst case mounting conditions, i.e.,
JA
is specified for device in socket for TO, CerDIP, and P-DIP
packages.
6/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98637
SHEET
E
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.daps.dla.mil/quicksearch/
or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN is not feasible due to space limitations, the manufacturer has the
option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked.
Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in
accordance with MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98637
SHEET
E
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/ 3/
-55C
T
A
+125C
unless otherwise specified
Group A
subgroups
Device
type
Min
Limits
Max
0.5
1.0
2.0
0.5
1.0
0.5
0.5
1.0
0.5
0.5
1.0
0.5
0.5
1.0
0.5
Unit
Input offset voltage
V
IO
R
S
= 50
4/
1
2, 3
01
-0.5
-1.0
-2.0
mV
M, D, P, L, R
+V
CC
= 35 V, -V
CC
= -5 V,
V
CM
= -15 V
M, D, P, L, R
+V
CC
= 5 V, -V
CC
= -35 V,
V
CM
= 15 V
M, D, P, L, R
+V
CC
= 20 V, -V
CC
= 20 V,
V
CM
= 0 V
M, D, P, L, R
+V
CC
= 5 V, -V
CC
= -5 V
1
1
2, 3
1
1
2, 3
1
1
2, 3
1
1
2, 3
02
02
02
02
-0.5
-1.0
-0.5
-0.5
-1.0
-0.5
-0.5
-1.0
-0.5
-0.5
-1.0
-0.5
mV
mV
mV
mV
M, D, P, L, R
Input offset voltage
temperature
sensitivity
V
IO
/
T
1
5/ 6/
2, 3
All
-5.0
5.0
V/C
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98637
SHEET
E
5
模拟与混合信号
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
