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JANTX1N5518UR-1

产品描述Zener Diode, 3.3V V(Z), 20%, Silicon, Unidirectional, DO-213AA, HERMETIC SEALED, GLASS, MLL34, MELF-2
产品类别分立半导体    二极管   
文件大小204KB,共6页
制造商Microsemi
官网地址https://www.microsemi.com
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JANTX1N5518UR-1概述

Zener Diode, 3.3V V(Z), 20%, Silicon, Unidirectional, DO-213AA, HERMETIC SEALED, GLASS, MLL34, MELF-2

JANTX1N5518UR-1规格参数

参数名称属性值
是否Rohs认证不符合
Objectid2125382542
零件包装代码DO-213AA
包装说明R-LELF-R2
针数2
Reach Compliance Codecompliant
ECCN代码EAR99
YTEOL0
其他特性METALLURGICALLY BONDED
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-213AA
JESD-30 代码R-LELF-R2
JESD-609代码e0
元件数量1
端子数量2
封装主体材料GLASS
封装形状RECTANGULAR
封装形式LONG FORM
极性UNIDIRECTIONAL
认证状态Not Qualified
标称参考电压3.3 V
表面贴装YES
技术AVALANCHE
端子面层TIN LEAD
端子形式WRAP AROUND
端子位置END
最大电压容差20%
工作测试电流20 mA

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1N5518BUR-1 thru 1N5546BUR-1
Low Voltage Avalanche
500 mW Zener Diodes
Qualified per MIL-PRF-19500/437
DESCRIPTION
The 1N5518BUR-1 thru 1N5546BUR-1 series of 0.5 watt glass surface mount Zener voltage
regulators provides a selection from 3.3 to 33 volts with tolerances ranging from plus/minus
1% to 20%. The standard tolerance is plus/minus 5% with the B suffix unless ordered
otherwise. These glass surface mount devices are available with an internal metallurgical
bond option. This type of bonded Zener package construction is also in JAN, JANTX, and
JANTXV military qualifications. Microsemi also offers numerous other Zener products to meet
higher and lower power applications.
Available on
commercial
versions
Qualified Levels:
JAN, JANTX and
JANTXV
DO-213AA MELF
Package
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
JEDEC registered 1N5518 thru 1N5546.
Voltage tolerances of plus/minus 20%, 10%, 5%, 2%, and 1% available. See
Note 1
on page 3.
Internal metallurgical bond.
JAN, JANTX, and JANTXV qualification per MIL-PRF-19500/437 available.
RoHS compliant versions available (commercial grade only).
Also available in:
DO-35
(DO-204AH)
(axial-leaded)
1N5518B-1 thru 1N5546B-1
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current and temperature range.
Extensive selection from 3.3 to 33 V.
Hermetically sealed surface mount package.
Nonsensitive to ESD per MIL-STD-750 Method 1020.
Minimal capacitance (see
Figure 3).
Inherently radiation hard as described in Microsemi’s “MicroNote
050”
which is available at
Microsemi.com.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
(Note 1)
Steady-State Power
(Also see derating in
Figure 2)
Symbol
T
J
and T
STG
P
D
(Note 2)
Value
-65 to +175
0.5
100
300
35
1.1
260
Unit
o
C
W
Thermal Resistance Junction-to-End Cap
(Note 2)
Thermal Resistance Junction-to-Ambient
Thermal Impedance
Forward Voltage 200mA
Solder Pad Temperature @ 10 s
R
ӨJEC
R
ӨJA
Z
ӨJX
V
F
T
SP
o
o
C/W
C/W
o
C/W
V
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
1-800-446-1158
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. At end cap temperature T
EC
< 125
o
C or at ambient T
A
< 50
º
C when mounted on FR4 PC board as
described for thermal resistance above (see
Figure 2
for derating). Derate to 0 at +175
o
C.
2. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).
T4-LDS-0037, Rev 2 (111456)
©2011 Microsemi Corporation
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