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CY7C1353G-133AXCT

产品描述ZBT SRAM, 256KX18, 6.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-100
产品类别存储    存储   
文件大小488KB,共13页
制造商Cypress(赛普拉斯)
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CY7C1353G-133AXCT概述

ZBT SRAM, 256KX18, 6.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-100

CY7C1353G-133AXCT规格参数

参数名称属性值
厂商名称Cypress(赛普拉斯)
零件包装代码QFP
包装说明LQFP,
针数100
Reach Compliance Codeunknown
ECCN代码3A991.B.2.A
Is SamacsysN
最长访问时间6.5 ns
其他特性FLOW-THROUGH ARCHITECTURE
JESD-30 代码R-PQFP-G100
JESD-609代码e3/e4
长度20 mm
内存密度4718592 bit
内存集成电路类型ZBT SRAM
内存宽度18
功能数量1
端子数量100
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256KX18
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层MATTE TIN/NICKEL PALLADIUM GOLD
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
宽度14 mm
Base Number Matches1

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CY7C1353G
4-Mbit (256K x 18) Flow-through SRAM
with NoBL™ Architecture
Features
• Supports up to 133-MHz bus operations with zero wait
states
— Data is transferred on every clock
• Pin compatible and functionally equivalent to ZBT™ devices
• Internally self timed output buffer control to eliminate the
need to use OE
• Registered inputs for flow-through operation
• Byte Write capability
• 256K x 18 common IO architecture
• 2.5V/3.3V IO power supply (V
DDQ
)
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
• Clock Enable (CEN) pin to suspend operation
• Synchronous self timed writes
• Asynchronous Output Enable
• Available in Pb-free 100-Pin TQFP package
• Burst Capability — linear or interleaved burst order
• Low standby power
Functional Description
[1]
The CY7C1353G is a 3.3V, 256K x 18 Synchronous
Flow-through Burst SRAM designed specifically to support
unlimited true back-to-back Read/Write operations without the
insertion of wait states. The CY7C1353G is equipped with the
advanced No Bus Latency™ (NoBL™) logic required to
enable consecutive Read/Write operations with data being
transferred on every clock cycle. This feature dramatically
improves the throughput of data through the SRAM, especially
in systems that require frequent Write-Read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by the two Byte Write Select
(BW
[A:B]
) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. To avoid bus contention,
the output drivers are synchronously tri-stated during the data
portion of a write sequence.
Logic Block Diagram
A0, A1, A
MODE
CLK
CEN
C
CE
ADV/LD
C
WRITE ADDRESS
REGISTER
ADDRESS
REGISTER
A1
D1
A0
D0
Q1 A1'
A0'
Q0
BURST
LOGIC
ADV/LD
BW
A
BW
B
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
WRITE
DRIVERS
MEMORY
ARRAY
S
E
N
S
E
A
M
P
S
D
A
T
A
S
T
E
E
R
I
N
G
O
U
T
P
U
T
B
U
F
F
E
R
S
E
DQs
DQP
A
DQP
B
WE
OE
CE
1
CE
2
CE
3
ZZ
INPUT
E
REGISTER
READ LOGIC
SLEEP
CONTROL
Note:
1.For best-practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05515 Rev. *E
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised July 09, 2007
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