FMS2027
FMS2027
DC-20GHz MMIC LOW LOSS SPDT
ABSORPTIVE SWITCH
Package Style: Bare Die
NOT FOR NEW DESIGNS
Product Description
The FMS2027 is a low loss, high isolation broadband single-pole double-throw Gal-
lium Arsenide switch, designed on the FL05 0.5m switch process from RFMD. It
offers absorptive properties from the output (50 termination). This process tech-
nology offers leading-edge performance optimized for switch applications.
The FMS2027 is developed for the broadband communications, instrumentation,
and electronic warfare markets.
Features
Low Insertion Loss: 2.1dB at
20GHz
High Isolation: 42dB at
20GHz
Absorptive Output in Off State
Excellent Low Control Voltage
Performance
Broadband Communications
Test Instrumentation
Fiber Optics
Electronic Warfare (ECM,
ESM)
Optimum Technology
Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
InP HBT
RF MEMS
LDMOS
RFIN
Applications
RFO1
Parameter
Electrical Specifications
(Small-Signal Unless Noted)
Insertion Loss
NE
W
Min.
Specification
Typ.
DE
SI
GN
RFO2
Max.
Unit
S
Condition
Based on on-wafer measurements.
T
AMBIENT
=25°C, V
CTRL
=0V/-5V, Z
IN
=Z
OUT
=50
Isolation
Input Return Loss (ON State)
Output Return Loss (OFF State)
Output Return Loss (OFF State)
P1dB
FO
R
-1
-1.5
-1.8
-2.3
NO
T
23
21
19
-0.85
-1.3
-1.6
-2.1
-42
-12
-16
-22
23
22.5
21
-40
-10
-13
-12
dB
dB
dB
dB
dB
dB
dB
dB
dBm
dBm
dBm
DC
10GHz
15GHz
20GHz
DC-20GHz
DC-20GHz
DC-20GHz
DC-20GHz
2GHz
10GHz
18GHz
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2012, RF Micro Devices, Inc.
DS120621
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
1 of 5
FMS2027
Absolute Maximum Ratings
Parameter
Maximum Input Power (P
IN
)
Control Voltage (V
CTRL
)
Operating Temperature (T
OPER
)
Storage Temperature (T
STOR
)
-40 to 85
-55 to 150
Rating
+27
Unit
dBm
V
°C
°C
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical perfor-
mance or functional operation of the device under Absolute Maximum Rating condi-
tions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended appli-
cation circuitry and specifications at any time without prior notice.
Truth Table
Control Line
A
-5V
0V
B
0V
-5V
RF Path
RFIN-RFO1
RFIN-RFO2
Notes: -5V±0.2 V; -0V±0.2 V
DE
SI
GN
Pad Layout
Pad
RFIN
RFO1
RFO2
A
A
A
A
B
B
B
Min. Bond Pad Pitch (m)
146
On
Off
Off
On
B
A
RFIN
A
B
RFO1
A B
FO
R
NE
W
A
RFO2
Note: Only one control line A and one control line B require
connection.
Die Size (m)
1336x934
Die Thickness (m)
100
S
Description
RFIN
RFOUT1
RFOUT2
VA1
VA2
VA3
VA4
VB1
VB2
VB3
Min. Bond Pad Opening (mxm)
94x94
NO
T
2 of 5
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
DS120621
FMS2027
Typical Measured Performance On Wafer
Measurement Conditions: V
CTRL
=5V (low) and 0V (high), T
AMBIENT
=25C.
Both arms RFO1 and RFO2 are symmetrical.
Isolation (S21 OFF)
Inser tion Loss (S21 ON)
0.00
-0.50
S21 (dB)
-1.00
-1.50
-2.00
-2.50
0
2
4
6
8
10
12
14
16
18
20
Fr equency (GHz)
S21 (dB)
0.00
-20.00
-40.00
-60.00
-80.00
-100.00
-120.00
0
2
4
6
8
10
12
14
16
18
20
Fr equency (GHz)
0.00
-5.00
S11 (dB)
-10.00
-15.00
-20.00
-25.00
-30.00
0
2
4
6
8
NE
W
10
12
14
16
18
DE
SI
GN
0.00
-5.00
S22 (dB)
-10.00
-15.00
-20.00
-25.00
0
2
4
20
Input Retur n Loss (S11 ON)
S
Output Return Loss (S22 ON)
6
8
10
12
14
16
18
20
Frequency (GHz)
Frequency (GHz )
0.00
-10.00
S22 (dB)
-20.00
-30.00
-40.00
-50.00
-60.00
Absorptive Output Return Loss (S22 OFF)
28.00
P1dB
FO
R
24.00
P1dB (dBm)
12
14
16
18
20
20.00
16.00
12.00
8.00
4.00
0.00
NO
T
0
2
4
6
8
10
2
4
6
8
10
12
14
16
18
20
Fr equency (GHz)
Fr equency (GHz)
DS120621
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
3 of 5
FMS2027
Typical Measured Performance On-Wafer Over Temperature
Measurement Conditions: V
CTRL
=-5V (low) and 0V (high).
Both arms RFO1 and RFO2 are symmetrical.
T
AMBIENT
=25C,
T
COLD
=-40C,
T
HOT
=+85C
Insertion Loss (S21 ON
)
Isolation (S21 OFF)
0.00
-0.50
S21 (dB)
-1.00
-1.50
-2.00
-2.50
0
2
4
6
8
10
12
14
16
18
20
Frequency (GHz)
S21 (dB)
0.00
-10.00
-20.00
-30.00
-40.00
-50.00
-60.00
-70.00
-80.00
-90.00
Input Return Loss (S11 ON)
0.00
-5.00
S11 (dB)
-10.00
-15.00
-20.00
-25.00
-30.00
0
2
4
6
8
NE
W
DE
SI
GN
0.00
-5.00
S22 (dB)
-10.00
-15.00
-20.00
-25.00
10
12
14
16
18
20
0
S
2
4
6
0
2
4
6
8
10
12
14
16
18
20
Frequency (GHz)
Output Retur n Loss (S22 ON
)
8
10
12
14
16
18
20
Frequency (GHz)
Frequency (GHz)
Absorptive Output Retur n Loss (S22 OFF)
0.00
-10.00
-20.00
S22(dB)
-30.00
-40.00
-50.00
-60.00
NO
T
0
2
FO
R
4
6
8
10
12
14
16
18
20
Frequency (GHz)
4 of 5
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
DS120621
FMS2027
Preferred Assembly Instructions
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible.
The back of the die is metallized and the recommended mounting method is by the use of conductive epoxy. Epoxy should be
applied to the attachment surface uniformly and sparingly to avoid encroachment of epoxy onto the top face of the die. Ideally
it should not exceed half the chip height. For automated dispense Ablestick LMISR4 is recommended and for manual dispense
Ablestick 84-1 LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150C for one hour in an oven
especially set aside for epoxy curing only. If possible the curing oven should be flushed with dry nitrogen. The gold-tin (80% Au
20% Sn) eutectic die attach has a melting point of approximately 280°C but the absolute temperature being used depends on
the leadframe material used and the particular application. The maximum time at used should be kept to a minimum.
This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is recommended that 25.4mm diameter
gold wire be used. Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter
wire. Bond force, time stage temperature and ultrasonics are all critical parameters and the settings are dependent on the
setup and application being used. Ultrasonic or thermosonic bonding is not recommended.
Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires
should be minimized especially when making RF or ground connections.
To avoid damage to the devices, care should be exercised during handling. Proper Electro-
static Discharge (ESD) precautions should be observed at all stages of storage, handling,
assembly, and testing.
ESD/MSL Rating
These devices should be treated as Class 1A (250V to 500V) using the human body model as defined in JEDEC Standard No.
22-A114. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. This is an unpack-
aged part and therefore no MSL rating applies.
Application Notes and Design Data
Reliability
Application Notes and design data including S-parameters are available on request from www.rfmd.com.
Disclaimers
This product is not designed for use in any space-based or life-sustaining/supporting equipment.
Ordering Information
NO
T
FO
R
An MTTF of in excess of 9 million hours at a channel temperature of 150°C is achieved for the process used to manufacture
this device.
Delivery Quantity
Full Pack (100)
Small Quantity (25)
Sample Quantity (3)
NE
W
DS120621
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
DE
SI
GN
Ordering Code
FMS2027-000
FMS2027-000SQ
FMS2027-000S3
Handling Precautions
S
5 of 5
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