FMS2024
FMS2024
DC-20GHz MMIC LOW LOSS SPDT
ABSORPTIVE SWITCH
Package Style: Bare Die
NOT FOR NEW DESIGNS
Product Description
The FMS2024 is a low loss, high isolation broadband single-pole double-throw Gal-
lium Arsenide switch, designed on the FL05 0.5m switch process from RFMD. It
offers absorptive properties from the output (50 termination). This process tech-
nology offers leading-edge performance optimized for switch applications.
The FMS2024 is developed for the broadband communications, instrumentation,
and electronic warfare markets.
Features
Low Insertion Loss: 1.4dB at
20GHz
High Isolation: 37dB at
20GHz
All Reflective Design
Excellent Low Control Voltage
Performance
Broadband Communications
Test Instrumentation
Fiber Optics
Electronic Warfare (ECM,
ESM)
Optimum Technology
Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
InP HBT
RF MEMS
LDMOS
RFIN
V2
V1
RF O1
Applications
V11
V22
V3
V4
Parameter
Electrical Specifications
(Small-Signal Unless Noted)
Insertion Loss
NE
W
Min.
Specification
Typ.
DE
SI
GN
V33
V44
RFO2
Max.
Unit
S
Condition
T
AMBIENT
=25°C, V
CTRL
=0V/-5V, Z
IN
=Z
OUT
=50
Isolation
Input Return Loss
Output Return Loss
P1dB
FO
R
-1
-1.25
-1.6
-1.6
-1.8
NO
T
23
22
22
-0.7
-0.85
-1.1
-1.2
-1.35
-37
-14
-15
28
24
24
-34
-11
-11
dB
dB
dB
dB
dB
dB
dB
dB
dBm
dBm
dBm
DC
5GHz
10GHz
15GHz
20GHz
DC-20GHz
DC-20GHz
DC-20GHz
2GHz
10GHz
20GHz
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2012, RF Micro Devices, Inc.
DS120621
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
1 of 5
FMS2024
Absolute Maximum Ratings
1
Parameter
Maximum Input Power (P
IN
)
Control Voltage (V
CTRL
)
Operating Temperature (T
OPER
)
Storage Temperature (T
STOR
)
Rating
+27
+1/-10
-40 to 85
-55 to 150
Unit
dBm
V
°C
°C
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical perfor-
mance or functional operation of the device under Absolute Maximum Rating condi-
tions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended appli-
cation circuitry and specifications at any time without prior notice.
Truth Table
V1 or V11
-5V
0V
0V
Notes: -5V±0.2 V; -0V±0.2 V; V11, V22, V33, and V44 are alternative control lines to V1, V2, V3, and V4 respectively.
DE
SI
GN
Pad Layout
Pad
RFIN
RFO1
RFO2
V1
V2
V3
V4
V11
V22
V33
V44
Min. Bond Pad Pitch (m)
150
0V
-5V
-5V
-5V
0V
-5V
0V
-5V
0V
On
Off
Off
S
Control Line
V2 or V22
V3 or V33
V4 or V44
RF Path
RFIN-RFO1
RFIN-RFO2
Off
On
Off
FO
R
Description
RFIN
RFOUT1
RFOUT2
V1
V2
V3
V4
V11
V22
V33
V44
Pin Coordinates (m)
116, 1055
1408, 1929
1408, 181
645, 1929
395, 1929
395, 181
645, 181
1735, 1608
1753, 1408
1753, 702
1753, 502
NE
W
NO
T
Die Size (m)
1910x2110
Note: Coordinates are referenced from the bottom left hand
corner of the die to the center of the bond pad opening.
Die Thickness (m)
100
Min. Bond Pad Opening (mxm)
116x116
2 of 5
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
DS120621
FMS2024
Typical Measured Performance On Wafer
Measurement Conditions: V
CTRL
=5V (low) and 0V (high), T
AMBIENT
=25C unless otherwise stated.
Isolation
Insertion Loss
0.00
-0.20
-0.40
S21 (dB)
-0.60
-0.80
-1.00
-1.20
-1.40
0
2
4
6
8
10
12
14
16
18
20
Frequency (GH
z)
S21 (dB )
0.00
-10.00
-20.00
-30.00
-40.00
-50.00
-60.00
-70.00
-80.00
0
2
4
6
8
10
12
14
16
18
20
Fre q uen cy (GHz)
Input R
eturn Loss
0.00
-5.00
S11 (dB)
-10.00
-15.00
-20.00
-25.00
-30.00
0
2
4
6
8
10
12
14
16
Frequency (GH
z)
18
DE
SI
GN
0.00
S22 (dB)
-5.00
-10.00
-15.00
-20.00
-25.00
-30.00
-35.00
-40.00
-45.00
20
0
S
2
4
6
Output Retur n Loss
8
10
12
14
16
18
20
NO
T
DS120621
FO
R
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
NE
W
Fr equency (GHz)
3 of 5
FMS2024
Typical Measured Performance On-Wafer Over Temperature
Measurement Conditions: V
CTRL
=-5V (low) and 0V (high).
T
AMBIENT
=25C,
T
COLD
=-40C,
T
HOT
=+85C
Isolation
Insertion Loss
0.10
-0.10
-0.30
S21 (dB)
0.00
-10.00
-20.00
S21 (dB)
-30.00
-40.00
-50.00
-60.00
-70.00
-80.00
0
2
4
6
8
10
12
14
16
18
20
-0.50
-0.70
-0.90
-1.10
-1.30
-1.50
Frequency (GH
z)
0
2
4
6
8
10
12
14
16
18
20
Frequency (GH
z)
0.00
-5.00
S11 (dB)
-10.00
-15.00
-20.00
-25.00
-30.00
0
2
4
6
8
NE
W
10
12
14
16
18
DE
SI
GN
0.00
-5.00
-10.00
-15.00
-20.00
-25.00
-30.00
-35.00
-40.00
-45.00
20
0
2
4
S22 (dB)
Input R
eturn Loss
S
6
Output Retur n Loss
8
10
12
14
16
18
20
Frequency (GH
z)
Frequency (GH
z)
NO
T
4 of 5
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
FO
R
DS120621
FMS2024
Preferred Assembly Instructions
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible.
The back of the die is metallized and the recommended mounting method is by the use of conductive epoxy. Epoxy should be
applied to the attachment surface uniformly and sparingly to avoid encroachment of epoxy onto the top face of the die. Ideally
it should not exceed half the chip height. For automated dispense Ablestick LMISR4 is recommended and for manual dispense
Ablestick 84-1 LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150C for one hour in an oven
especially set aside for epoxy curing only. If possible the curing oven should be flushed with dry nitrogen. The gold-tin (80% Au
20% Sn) eutectic die attach has a melting point of approximately 280°C but the absolute temperature being used depends on
the leadframe material used and the particular application. The maximum time at used should be kept to a minimum.
This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is recommended that 25.4mm diameter
gold wire be used. Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter
wire. Bond force, time stage temperature and ultrasonics are all critical parameters and the settings are dependent on the
setup and application being used. Ultrasonic or thermosonic bonding is not recommended.
Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires
should be minimized especially when making RF or ground connections.
To avoid damage to the devices, care should be exercised during handling. Proper Electro-
static Discharge (ESD) precautions should be observed at all stages of storage, handling,
assembly, and testing.
ESD/MSL Rating
These devices should be treated as Class 1A (250V to 500V) using the human body model as defined in JEDEC Standard No.
22-A114. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. This is an unpack-
aged part and therefore no MSL rating applies.
Application Notes and Design Data
Reliability
Application Notes and design data including S-parameters are available on request from www.rfmd.com.
Disclaimers
This product is not designed for use in any space-based or life-sustaining/supporting equipment.
Ordering Information
NO
T
FO
R
An MTTF of in excess of 9 million hours at a channel temperature of 150°C is achieved for the process used to manufacture
this device.
Delivery Quantity
Full Pack (100)
Small Quantity (25)
Small Quantity (3)
NE
W
DS120621
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
DE
SI
GN
Ordering Code
FMS2024-000
FMS2024-000SQ
FMS2024-000S3
Handling Precautions
S
5 of 5
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