电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

KS614-04TT

产品描述IC Socket, DIP14, 14 Contact(s),
产品类别连接器    插座   
文件大小253KB,共2页
制造商Advanced Interconnections Corp
下载文档 详细参数 全文预览

KS614-04TT概述

IC Socket, DIP14, 14 Contact(s),

KS614-04TT规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Advanced Interconnections Corp
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性SOCKET ADAPTER
联系完成配合TIN LEAD OVER NICKEL
联系完成终止Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
触点材料BERYLLIUM COPPER/COPPER ALLOY
设备插槽类型IC SOCKET
使用的设备类型DIP14
外壳材料POLYIMIDE
JESD-609代码e0
触点数14

文档预览

下载PDF文档
DIP Sockets
Table of Models
Peel-A-Way DIP Socket Terminal Carriers
Description:
Peel-A-Way
®
Socket (KS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
®
.005
(.13)
Polyimide
Film
For molded insulators, see pages 28-29.
Options
• Removable tape seal protects plated contact in harsh environments
Tape Seal - add 3M to end of part number
Features:
• Peel away terminal carrier after
soldering.
• Disposable carrier.
• Complete soldering visibility on
both sides of PCB.
• Maximum air flow.
• Better flux rinse.
• No contact damage due to
terminal carrier insertion.
• No contact pull out due to
extraction of terminal carrier.
(shown here on
molded socket)
• Spray flux without contaminating contact area
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
Material
Solder Preform Terminals
Tin/Lead: Type -150
Lead-free: Type -811
.072 Dia.
(1.83)
See pg. 29 for intrusive reflow application.
Tin/Lead: Type -111
Lead-free: Type -810
Peel-A-Way
®
only
.058 Dia.
(1.47)
Tin/Lead: Type -151
Lead-free: Type -812
.072 Dia.
(1.83)
.130
(3.30)
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
.165
(4.19)
Solder
Preform
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
.031
(.79)
.155
(3.94)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
.038 Dia.
(.97)
How To Order
KS
Body Type
RoHS Compliant Insulators:
3
16
- 85
M
G
Contact Plating
RoHS Compliant:
KS - Peel-A-Way
DIP Spacing
3 - .300/(7.62mm)
4 - .400/(10.16mm)
6 - .600/(15.24mm)
9 - .900/(22.86mm)
Number of Pins
(8 to 64)
Additional sizes available - consult factory.
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16A
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
74LS07做驱动的问题。
74LS07做数码管的位选驱动实际行不行?为什么我用它做驱动,数码管不亮?...
半个灵魂 51单片机
MSP430F5528 PCB QFN 封装
最近项目用到5528,请问哪位大侠有 430F5528 VQFN PCB封装,期待!!...
tobycheng 微控制器 MCU
网络精品免费软件
下载的一些实用小工具...
flywith 微控制器 MCU
电力行业企业高薪招聘嵌入式开发人员!!
欢迎满足以下条件之一的有识之士与我们联系,公司网址: www.nerc.com.cn,发送简历邮箱地址:whl668@epri.ac.cn。 1.具有2年以上电力行业嵌入式产品开发经验。 ......
Hellenlee 嵌入式系统
FPGA信号时延问题
请问如何让FPGA的输出信号具有不同的时延呢?在程序中怎么体现出来啊?...
linuxp FPGA/CPLD
2416相比2440的十大优势
本帖最后由 jorya_txj 于 2014-6-27 20:20 编辑 三星2009上半年推出的2416芯片相比2440具有压倒性的优势,是完美替代2440的首要选择: 1. 性能以及对视频播放能力的支持:2416标准主频533MHz ......
jorya_txj 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1864  1992  1252  2903  2417  38  41  26  59  49 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved