The documentation and process conversion
measures necessary to comply with this
revision shall be completed by 16 November 1998
INCH-POUND
MIL-PRF-19500/647A
16 August 1998
SUPERSEDING
MIL-PRF-19500/647
18 April 1997
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON,
POWER RECTIFIER, ULTRAFAST,
TYPES 1N6778 AND 1N6779
JAN, JANTX, JANTXV, and JANS
This specification is approved for use by all Depart-
ments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for silicon, ultrafast, power rectifier diodes. Four levels of product
assurance are provided for each device type as specified in MIL-PRF-19500.
1.2 Physical dimensions. See figure 1 (2 pin, isolated, TO-257).
1.3 Maximum ratings.
Types
V
RWM
I
D
= 10
µA
dc
I
F
1/
T
C
= +100°C
I
FSM
t
p
= 8.3ms
R
θJC
R
θJA
T
STG
and T
OP
V dc
1N6778
1N6779
400
600
A dc
15
A(pk)
140
°C/W
1.8
°C/W
40
°C
-65 to +150
1/ Derate at 300 mA/°C above T
C
= +100°C.
1.4 Primary electrical characteristics. Unless otherwise specified, primary electrical characteristics are at +25°C.
Types
V
F1
I
F
= 8 A dc
V
F2
I
F
= 15 A
dc
I
R1
V
R
= 0.8 V
RWM
(See 1.3)
µA
dc
10
I
R2
V
R
= 0.8 V
RWM
(See 1.3)
T
C
= +100°C
µA
dc
1,000
t
rr
C
J
V
R
= 5 V
f = 1 MHz
V dc
1N6778
1N6779
1.40
V dc
1.60
ns
60
pF
300
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this
document should be addressed to: Commander, Defense Supply Center, Columbus, ATTN: DSCC-VA, 3990 East Broad Street,
Columbus, Ohio 43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end
of this document or by letter.
AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
FSC 5961
MIL-PRF-19500/647A
Dimensions
Symbol
Min
BL
CH
LD
LL
LO
LS
MHD
MHO
TL
TT
TW
.410
.249
.035
.500
.150 typ
.200 bsc
.140
.527
.645
.040
.410
.150
.537
.665
.050
.420
Inches
Max
.430
.260
.045
.750
Millimeters
Min
10.4
6.32
0.89
12.70
Max
10.9
6.60
1.14
19.05
3.81 typ
5.08 bsc
3.55
13.4
16.4
1.02
10.4
3.80
13.6
16.9
1.27
10.7
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only. See 3.3.
3. All terminals are isolated from case.
Configuration
Terminal
1
2
Description
Cathode
Anode
1
2
FIGURE 1. Physical dimensions and configuration (2 pin, isolated) (similar to TO-257).
2
MIL-PRF-19500/647A
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements
documents cited in sections 3 and 4 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
STANDARD
MILITARY
MIL-STD-750 - Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the
Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Associated specification. The individual item requirements shall be in accordance with MIL-PRF-19500 and as specified herein.
3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in
MIL-PRF-19500.
3.3 Interface requirements and physical dimensions. The interface requirements and physical dimensions shall be as specified in
MIL-PRF-19500 and on figure 1 (TO-257) herein. Methods used for electrical isolation of the terminal feedthroughs shall employ
materials that contain a minimum of 90 percent Al
2
O
3
(ceramic). Examples of such construction techniques are metallized ceramic
eyelets or ceramic walled packages. The preferred measurements used herein is the metric SI system. However, since this item was
originally designed using inch-pound units of measurement, in the event of a conflict between the metric and inch-pound units, the inch-
pound units shall take precedence.
3.3.1 Lead material and finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein. Where
a choice of lead finish or formation is desired,- it shall be specified in the acquisition document (see 6.2). When lead formation is
performed, as a minimum, the vendor shall perform 100 percent hermetic seal in accordance with screen 14 of table II of MIL-PRF-19500
and 100 percent DC testing in accordance with group A, subgroup 2 herein.
3.3.2 Polarity. Polarity and terminal configuration shall be in accordance with figure 1 herein.
3.4 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in 1.3, 1.4, and table I herein.
3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and 4.4.3 herein.
3.7 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing
on the applicable qualified products list before contract award (see 4.2 and 6.2 ).
3
MIL-PRF-19500/647A
4. QUALITY ASSURANCE VERIFICATION
4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3)
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500, and table III herein.
4.3 Screening (JANTX, JANTXV, and JANS levels). Screening shall be in accordance with table IV of MIL-PRF-19500, and as
specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I
herein shall not be acceptable.
Screen (see
table IV of MIL-
PRF-19500)
3C 1/
Measurement
JANS level
Thermal impedance (see 4.3.2)
JANTX and JANTXV levels
Thermal impedance (see 4.3.2)
9 and 10
Not applicable
Not applicable
11
I
R1
and V
F2
I
R1
and V
F2
12
See 4.3.1, t = 240 hours
See 4.3.1, t = 48 hours
13
Subgroups 2 and 3 of table I herein;
V
F2
and I
R1
;
∆I
R1
≤
100 percent of
initial value or ±2.5
µA,
whichever is
greater;
∆V
F2
≤
±100 mV.
Subgroup 2 of table I herein;
V
F2
and I
R1
;
∆I
R1
≤
100 percent of
initial value or ±2.5
µA,
whichever
is greater;
∆V
F2
≤
±100 mV.
1/ Thermal impedance shall be performed any time before screen 13.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows:
MIL-STD-750 method 1038, test condition A. T
C
= +125°C; V
R
= 0.8 of rated V
RWM
(see 1.3).
4.3.2 Thermal impedance (Z
θJX
) measurements for screening. The Z
θJX
measurements shall be performed in accordance with MIL-
STD-750, method 3101. The maximum limit (not to exceed the group A, subgroup 2 limit) and conditions for Z
θJX
in screening (table IV of
MIL-PRF-19500) shall be derived by each vendor by means of statistical process control. When the process has exhibited control and
capability, the capability data shall be used to establish the fixed screening limit. In addition to screening, once a fixed limit has been
established, monitor all future sealing lots using a random five piece sample from each lot to be plotted on the applicable X, R chart. If a
lot exhibits an out of control condition, the entire lot shall be removed from the line and held for Engineering evaluation and disposition.
4.3.2.1 Thermal impedance (Z
θJX
) measurements for initial qualification or requalification. The Z
θJX
measurements shall be performed
in accordance with MIL-STD-750, method 3101 (read and record data Z
θJX
). Derived conditions limits and thermal response curve shall
be supplied to the qualifying activity on the qualification lot prior to qualification approval. Measurement conditions shall be in accordance
with 4.4.1.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as specified herein.
4
MIL-PRF-19500/647A
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500 and table I herein. Electrical
measurements (end-points) and delta requirements shall be in accordance with the applicable steps of table II herein. The following test
conditions shall be used for Z
θJX
, group A inspection:
a.
b.
c.
d.
e.
I
M
measure current ----------------------- 15 mA
I
H
forward heating current --------------- 9.9 A
t
H
heating time ----------------------------- 200 ms
t
MD
measurement delay time ------------ 35
µs
V
H
heating voltage ------------------------- 1 V
The maximum limit for Z
θJX
under these conditions are Z
θJX
(max) = 1.6°C/W
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in
table VIa (JANS) and table VIb (JANTX and JANTXV) of MIL-PRF-19500 and as follows. Electrical measurements (end-points) and
delta requirements shall be in accordance with the applicable steps of table II herein.
4.4.2.1 Group B inspection, table VIa (JANS) of MIL-PRF-19500.
Subgroup
4
Method
1037
Condition
I
F
or I
O
= 1.25 A to 10 A;
∆T
J
= +85°C, minimum for 2,000 cycles minimum.
4.4.2.2 Group B inspection, table VIb (JANTX and JANTXV) of MIL-PRF-19500.
Subgroup
3
Method
1037
Condition
I
F
or I
O
= 1.25 A to 10 A;
∆T
J
= +85°C, minimum for 2,000 cycles minimum.
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in
table VII of MIL-PRF-19500 and as follows. Electrical measurements (end-points) and delta requirements shall be in accordance with the
applicable steps of table II herein.
4.4.3.1 Group C inspection, table VII of MIL-PRF-19500.
Subgroup
2
6
Method
2036
1037
Condition
Test condition A, 5 pounds, t = 15 seconds ± 3 seconds.
I
F
or I
O
= 1.25 A to 10 A;
∆T
J
= +85°C, minimum for 6,000 cycles minimum.
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for subgroup testing in
table III herein. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps and
footnotes of table II herein.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.
5
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