电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1N5943CPTR

产品描述Zener Diode,
产品类别分立半导体    二极管   
文件大小379KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

1N5943CPTR概述

Zener Diode,

1N5943CPTR规格参数

参数名称属性值
Reach Compliance Codecompliant
ECCN代码EAR99
Base Number Matches1

文档预览

下载PDF文档
1N5913BP thru 1N5956BP (Plastic)
Axial-Leaded 1.5 Watt Zener Diodes
SCOTTSDALE DIVISION
DESCRIPTION
The 1N5913-5956B series of 1.5 watt Zeners provides voltage regulation in a
selection from 3.3 to 200 volts with different tolerances as identified by suffix
letter on the part. These plastic encapsulated Zeners have moisture
classification of Level 1 with no dry pack required. They are also available in
various military screening levels by adding a prefix identifier as described in
the Features below. The plastic molded Zeners with a P suffix provide a
lower thermal resistance (junction to lead) compared to the optional glass
body (G suffix) for these same JEDEC part numbers. Both package options
are available by Microsemi. Microsemi also offers numerous other Zener
products to meet higher or lower power and test-current applications.
APPEARANCE
WWW .
Microsemi
.C
OM
DO-41 or
DO-204AL
(Plastic)
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEATURES
JEDEC registered 1N5913 to 1N5956B
Zener voltage available 3.3V to 200V
Standard voltage tolerances are plus/minus 5% with
B suffix and 10 % with A suffix identification
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
Surface mount equivalents available as SMBJ5913 to
SMBJ5956B or SMBG5913 to SMBG5956B
Optional glass body axial-leaded Zeners available as
1N5913BG to 1N5956BG (see separate data sheet)
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 3.3 to 200 V
Flexible axial-lead mounting terminals
Nonsensitive to ESD
Moisture classification is Level 1 per IPC/JEDEC
J-STD-020B with no dry pack required
Specified capacitance (see Figure 3)
MAXIMUM RATINGS
Power dissipation at 25
º
C: 1.5 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to +150
º
C
Thermal Resistance: 45
º
C/W junction to lead at 3/8
(10 mm) lead length from body, or 105
º
C/W junction
to ambient when mounted on FR4 PC board (1 oz
Cu) with 4 mm
2
copper pads and track width 1 mm,
length 25 mm
Steady-State Power: 1.5 watts at T
L
< 82.5
o
C 3/8
inch (10 mm) from body, or 1.19 watts at T
A
= 25
º
C
when mounted on FR4 PC board as described for
thermal resistance (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Leads, tin-lead plated solderable per
MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Part number
TAPE & REEL optional: Standard per EIA-296
(add “TR” suffix to part number)
WEIGHT: 0.7 grams
See package dimensions on last page
1N5913B thru 1N5956B
(Plastic)
Copyright
2003
10-13-2003 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

推荐资源

EEWORLD大学堂----Atmel软件框架(ASF)入门(上)
Atmel软件框架(ASF)入门(上):https://training.eeworld.com.cn/course/462更进一步了解Atmel软件框架,,一个产品源代码集合,如驱动、协议栈和触摸功能。学习创建项目,导入新驱动、DMA和中断 ......
dongcuipin 嵌入式系统
PCB抄板过程中反推原理图的方法 
怎样来进行PCB原理图的反推,反推过程有该注意那些细节呢?  1、合理划分功能区域  在对一块完好的PCB电路板进行原理图的逆向设计时,合理划分功能区域能够帮工程师减少一些不必要的麻烦 ......
方学放 PCB设计
U-boot下用tftp下载kernel,并加载kernel
本帖最后由 sdwuyawen 于 2014-7-20 14:04 编辑 S3C2416通过U-Boot启动后,U-Boot会自动执行bootcmd来加载内核。《君益兴开发板手册V2》第3.3.4节,把kernel烧写到nandflash的0x40000地 ......
sdwuyawen 嵌入式系统
简单的裸板程序编写问题啊..?求教..
我想把自己的一张320*240的图放到2440开发板上显示..可是发现我在把图转成*.c之后..在ADS里把代码复制到原来的图片代码那里取代了原来的代码位置..为什么make的时候会出现L62181E: error:Unde ......
3108009356 嵌入式系统
如何快速通过STM32单片机实现ST传感器的驱动测试
今天我将要向大家介绍如何快速通过STM32单片机实现ST传感器的驱动测试。本次我们使用的传感器是LSM6DSOX,因为SensorTile.box开发板集成了这颗传感器,所以我将用SensorTile.box来演示,如何通 ......
littleshrimp ST传感器与低功耗无线技术论坛
关于结构体在多个文件中的调用问题
本帖最后由 李嘉辉 于 2016-12-21 16:19 编辑 遇到了这样一个问题 ,我要把数据打包,装到结构体里面我在Pack.h文件里面定义了一个结构体,在Pack. c里面用到了这个结构体,同时我又在另一w ......
李嘉辉 编程基础

热门文章更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2323  815  1515  343  469  47  17  31  7  10 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved