MX840A/B
Hex Driver for GaAs FET
Switches and Attenuators
Features:
•
•
•
•
•
•
•
•
CMOS Technology
TTL/CMOS compatible inputs
Low switching noise
<5nS typical true / complement output skew
<3.5nS typical output rise and fall times
Up to 11V output voltage
Output high voltage programmable via V
OPT
Output low voltage programmable via V
EE
General Description
The MX840A and MX840B are high speed six
channel level shifters with complimentary output
drivers. The MX840A features a 3.3V V
CC
positive
supply, and the MX840B features a 5.0V V
CC
positive supply.
The input buffers accept digital TTL or CMOS level
signals, amplifies them to the V
CC
and GND supply
rails, and generates complementary outputs. The
translator level shifts these output signals by
amplifying them to the V
CC
and V
EE
supply rails.
The output drivers then buffer the signals to V
OPT
and V
EE
. V
OPT
may be set within the range of V
CC
and GND. The output drivers also adjust the
complimentary signals for minimized skew error.
The MX840A and MX840B are designed to operate
over a temperature range of -40°C to +85°C, and
are available as die in wafer form, die in waffle
pack, 24 lead SOIC package, and SOIC on Tape
and Reel.
•
Digital control of analog circuits
•
Level shifting and amplification
•
Circuit applications requiring complementary
signal generation with low skew
•
Bias control for a PIN diode drivers in a
microwave switch
Applications
Ordering Information – MX840A
Part No.
Description
Ordering Information – MX840B
Part No.
Description
19602
19601
19600-00
19641-00
MX840A
MX840A
MX840A
MX840A
Die / Wafer Form
Die / Waffle Pack
24 Lead SOIC
SOIC on Tape & Reel
19902
19901
19900-00
19941-00
MX840B
MX840B
MX840B
MX840B
Die / Wafer Form
Die / Waffle Pack
24 Lead SOIC
SOIC on Tape & Reel
Functional Block Diagram
24 Lead SOIC Configuration
N/C
VEE
1
2
3
4
5
6
7
8
9
24 OUT1_B
23 OUT1
22 OUT2_B
21 OUT2
20 OUT3_B
19 OUT3
18 OUT4_B
17 OUT4
16 OUT5_B
15 OUT5
14 OUT6_B
13 OUT6
input buffer
VCC VCC
translator
VCC
output buffer
VOPT
OUT
IN1
IN2
VCC
IN3
IN4
IN
OUT_B
GND
GND
VEE
VEE
VOPT
IN5
IN6 10
GND 11
N/C 12
MX840A/B
Drawing No. 19609
1
4/11/06
www.claremicronix.com
MX840A/B
Absolute Maximum Ratings
SYMBOL
V
CC
V
EE
V
OPT
V
OPT
-V
EE
V
CC
- V
EE
V
CC
-V
OPT
V
IN
I
IN
T
A
T
STG
ESD
PARAMETER
Positive DC Supply Voltage
Negative DC Supply Voltage
Output Positive DC Supply Voltage
Output Positive to Negative Supply Voltage
Positive to Negative Supply Voltage
Positive to Output Supply Voltage
DC Input Voltage
DC Input Current
Ambient Operating Temperature
Storage Temperature
ESD sensitivity (human body model)
MIN
-0.4
-12.0
-0.4
-0.4
-0.4
-0.4
-10
-40
-65
1.0
MAX
+6.5
+0.4
+6.5
+14.0
+14.0
Vcc+0.4
V
CC
+0.4
+10
+85
+150
UNITS
V
V
V
V
V
V
V
µA
o
C
o
C
kV
Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause
permanent damage to the device. Functional operation of the device at these or any other conditions
beyond those indicated in the operational sections of this data sheet is not implied. Exposure of the
device to the absolute maximum ratings for an extended period may degrade the device and affect
its reliability.
Guaranteed Operating Range
MX840A 3.3V version
SYMBOL
PARAMETER
V
CC
Positive DC Supply Voltage
V
EE
Negative DC Supply Voltage
V
OPT
Output Positive DC Supply Voltage
V
OPT
-V
EE
Output Positive to Negative Supply Voltage
V
CC
- V
EE
Positive to Negative Supply Voltage
V
CC
-V
OPT
Positive to Output Supply Voltage
T
A
Ambient Operating Temperature
T
R
, T
F
Input Rise and Fall Time
MX840B 5.0V version
SYMBOL
PARAMETER
V
CC
Positive DC Supply Voltage
V
EE
Negative DC Supply Voltage
V
OPT
Output Positive DC Supply Voltage
V
OPT
-V
EE
Output Positive to Negative Supply Voltage
V
CC
- V
EE
Positive to Negative Supply Voltage
V
CC
-V
OPT
Positive to Output Supply Voltage
T
A
Ambient Operating Temperature
T
R
, T
F
Input Rise and Fall Time
MIN
3.0
-11.0
0.0
7.5
9.0
0.0
-40
0.0
MAX
3.6
-4.5
3.6
11.0
14.0
V
CC
+85
500
UNITS
V
V
V
V
V
V
o
C
nS
MIN
4.5
-9.5
0.0
7.5
9.0
0.0
-40
0.0
MAX
5.5
-4.5
5.5
11.0
14.0
V
CC
+85
500
UNITS
V
V
V
V
V
V
o
C
nS
MX840A/B
Drawing No. 19609
2
4/11/06
www.claremicronix.com
MX840A/B
DC Characteristics -
Over Guaranteed Operating Range
SYMBOL
V
IH
V
IL
V
OH
V
OL
I
IN
I
CC
I
EE
I
OPT
PARAMETER
Input HIGH Voltage
Input LOW Voltage
Output HIGH Voltage(I
OH
=-1mA)
Output LOW Voltage (I
OL
=1mA)
Input Current (V
IN
=0.0 to V
CC
)
Supply Current (V
IN
=0.0 or V
CC
)
Supply Current (V
IN
=0.0 or V
CC
)
Supply Current (V
IN
=0.0 or V
CC
)
V
CC
= 3.3V
V
CC
= 5.0V
V
CC
= 3.3V
V
CC
= 5.0V
V
CC
= 3.3V
V
CC
= 5.0V
MIN
2.0
V
OPT
- 0.1
-10
<1.0
<1.0
<1.0
<1.0
<1.0
<1.0
V
EE
+ 0.1
+10
TYP
MAX
0.8
Units
V
V
V
V
uA
uA
uA
uA
uA
uA
uA
ESD Warning
ESD (electrostatic discharge) sensitive device. Although the MX840A/B features proprietary ESD protection circuitry, permanent
damage may be sustained if subjected to high energy electrostatic discharges. Proper ESD precautions are recommended to avoid
performance degradation or loss of functionality.
MX840A/B
Drawing No. 19609
3
4/11/06
www.claremicronix.com
MX840A/B
AC Characteristics
V
CC
=V
OPT
=3.3V, V
EE
=-7.7V or -4.5V, Input rise and fall time 6ns, V
IH
=3.1, V
IL
=0.2V, T
A
= -40
O
C to +85
O
C
V
CC
=V
OPT
=5.0V, V
EE
=-6.0V or -4.5V, Input rise and fall time 6ns, V
IH
=4.8, V
IL
=0.2V, T
A
= -40
O
C to +85
O
C
SYMBOL
T
PLH
T
PHL
T
TLH
T
THL
T
SKEW
C
IN
PARAMETER
Propagation Delay (low to high input)
Propagation Delay (high to low input)
Output Rise Time (C
LD
=10pf)
Output Fall Time (C
LD
=10pf)
Delay Skew (Output A to Output B)
Input Capacitance
V
CC
= 3.3V
V
CC
= 5.0V
V
CC
= 3.3V
V
CC
= 5.0V
V
CC
= 3.3V
V
CC
= 5.0V
V
CC
= 3.3V
V
CC
= 5.0V
V
CC
= 3.3V
V
CC
= 5.0V
Typ
16
14
16
14
3.3
2.7
3.3
2.7
4.5
3.6
Max
29
29
29
29
9
9
8
8
10
10
15
UNITS
nS
nS
nS
nS
nS
nS
nS
nS
nS
nS
pF
Note: Production Tested at 25
O
C
6ns
6ns
VCC-0.2V
IN
0.2V
90%
50%
10%
90%
50%
10%
Tlh
90%
50%
10%
Tplh
Tphl
90%
50%
10%
Thl
Tskew
Tplh
Tphl
90%
50%
10%
Tlh
90%
50%
10%
Thl
Vopt
Vee
Tskew
OUT
Vopt
Vee
OUTB
MX840A/B
Drawing No. 19609
4
4/11/06
www.claremicronix.com
MX840A/B
Pad Locations
(in µm)
PAD NAME
IN1
OUT1
OUT1_B
IN2
OUT2
OUT2_B
IN3
OUT3
OUT3_B
VOPT
VCC
VEE
GND
X
583.75
0.00
0.00
583.75
0.00
0.00
583.75
0.00
0.00
583.75
583.75
583.75
583.75
Y
230.25
270.75
90.75
522.25
633.75
453.75
1002.75
1043.25
863.25
1535.00
762.50
0.00
2280.25
PAD NAME
IN4
OUT4
OUT4_B
IN5
OUT5
OUT5_B
IN6
OUT6
OUT6_B
X
583.75
0.00
0.00
583.75
0.00
0.00
583.75
0.00
0.00
Y
1294.75
1406.25
1226.25
1771.75
1812.25
1632.25
2063.75
2175.25
1995.25
Pad location is the pad center point in microns. The origin of the coordinates is located as shown.
GND
OUT6
IN6
OUT6_B
OUT5
OUT5_B
VOPT
OUT4
OUT4_B
OUT3
OUT3_B
VCC
OUT2
IN2
OUT2_B
OUT1
OUT1_B
VEE
IN1
IN4
IN5
MX840
IN3
Die Size: 940µm X 2850 µm
(Not Drawn To Scale)
MX840A/B
Drawing No. 19609
5
4/11/06
www.claremicronix.com
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