电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HW-08-08-L-D-255-SM-LC

产品描述Board Stacking Connector, 16 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Surface Mount Terminal, Black Insulator,
产品类别连接器    连接器   
文件大小325KB,共3页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

HW-08-08-L-D-255-SM-LC概述

Board Stacking Connector, 16 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Surface Mount Terminal, Black Insulator,

HW-08-08-L-D-255-SM-LC规格参数

参数名称属性值
是否Rohs认证符合
Objectid145154687742
Reach Compliance Codecompliant
ECCN代码EAR99
YTEOL8.58
板上安装选件SPLIT BOARD LOCK
主体宽度0.1 inch
主体深度0.255 inch
主体长度0.8 inch
连接器类型BOARD STACKING CONNECTOR
接触器设计PREASSEM CONN
触点性别MALE
触点材料PHOSPHOR BRONZE
触点模式RECTANGULAR
触点样式SQ PIN-SKT
滤波功能NO
绝缘体颜色BLACK
绝缘体材料LIQUID CRYSTAL POLYMER
插接触点节距0.1 inch
匹配触点行间距0.1 inch
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装方式STRAIGHT
安装类型BOARD
连接器数ONE
PCB行数2
装载的行数2
最高工作温度125 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
PCB接触模式RECTANGULAR
PCB触点行间距0.1 mm
电镀厚度10u inch
参考标准UL
端子节距2.54 mm
端接类型SURFACE MOUNT
触点总数16
UL 易燃性代码94V-0

文档预览

下载PDF文档
REVISION BA
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
HW-XX-XX-XX-X-XXXX-SM-X-XXX
2. TUBE POSITIONS -05 THRU -36 ONLY; POSITIONS -02
THRU -04 TO BE LAYER PACKAGED.
No OF POSITIONS
OPTION #2
3. MAXIMUM CUT FLASH: .020 [0.51] CUT FLASH TO BE
POLARIZED POSITION
-02 THRU -36
IN A NON-CRITICAL AREA LOCATED BETWEEN BODIES.
SPECIFY OMITTED PIN
4. FOR ADDED MECHANICAL STABILITY, SAMTEC RECOMMENDS
LEAD STYLE
MECHANICAL BOARD SPACERS BE USED IN APPLICATIONS WITH
OPTION #1
(SEE TABLE 1)
GOLD OR SELECTIVE GOLD PLATED CONNECTORS. CONTACT
-LC: LOCKING CLIP (SEE FIG 2, SHT 2)
IPG@SAMTEC.COM FOR MORE INFORMATION.
(-D: USE RTSM-50-DVU, USE LC-05-TM)
PLATING SPECIFICATION
36
02
.195 4.95
REF
01
2 MAX SWAY
.100 2.54 REF
(EITHER DIRECTION)
-S: SINGLE ROW
02
72
.295 7.49
REF
01
.200 5.08 REF
71
2 MAX SWAY
(EITHER DIRECTION)
35
-T: MATTE TIN ON CONTACT AND TAIL.
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
-G: 10µ" SELECTIVE GOLD IN CONTACT AREA,
3µ" SELECTIVE GOLD ON TAIL.
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
-TL: 250µ" TIN/LEAD ON CONTACT AND TAIL.
-H: 30µ" SELECTIVE GOLD IN CONTACT
AREA, 3µ" SELECTIVE GOLD ON TAIL.
-F: 3µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
-TM: MATTE TIN ON CONTACT AND TAIL.
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
-LM: 10µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
-FM: 3µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
ROW OPTION
-D: DOUBLE ROW
(USE RTSM-50-DVU FOR BOTTOM INSULATOR)
(USE WRTSM-50-DVU FOR TOP INSULATOR)
-S: SINGLE ROW
(USE TSM-XX-S BODY FOR BOTTOM INSULATOR)
(USE WTSM-50-SV FOR TOP INSULATOR)
C
"B" .000[0.00] MIN
[("C" + .150[3.81]) -A]
.050 1.27
WTSM-50-SV
.100 2.54 REF
DO NOT
SCALE FROM
THIS PRINT
(-S: USE TSM-50-SV BODY, USE LC-08-TM-02)
-A: ALIGNMENT PIN (SEE FIG 3, SHT 2)
(-S: 3 POSITION USE TSM-03-SV-A,
MUST BE MOLDED TO POSITION)
(4-50 POSITIONS USE TSM-XX-SV-XX,
2 POSITIONS TO USE TSM-48-SV-04)
(-D: FOR MOLDED TO POSITION,
USE RTSM-50-DVU-XX BODY,
AVAILABLE ON POS -02 THRU -36)
(-D: FOR STAKED, USE RTSM-50-DVU BODY,
3 POS MIN)
-TR: TAPE & REEL
(4 THRU 27 POSITIONS ONLY)
(MAX HEIGHT: .6875)
LEAVE BLANK FOR NO HOLD DOWN OPTION
(-D: USE RTSM-50-DVU, CAN BE CUT
TO POSITION, SEE FIG 1)
(-S: USE TSM-50-SV, CAN BE CUT
TO POSITION, SEE FIG 1)
SURFACE MOUNT
FIG 1
HW-XX-10-XX-X-675-SM SHOWN
(NO OF POS x .100[2.54])
+.000[0.00]
- .015[0.38]
(NO OF POS -1) x .100[2.54]
.025 0.64 SQ
REF (TYP)
BOARD SPACE
"A" = -XXX
(SEE FIG 1 & TABLE 1)
MAX= C + .150
.100 2.54
T-1S6-XX-XX-2
WRTSM-50-DVU
C
"A"±.008[0.20]
BOARD OPTION
(.250[6.35] MIN)
(SEE TABLE 1)
(MAX = "C" + .150[3.81])
"H" REF
.100 2.54 REF
C
.006[0.15]
90°
- 0°
+5°
TSM-50-SV
.050 1.27
RTSM-50-DVU
-S: SINGLE ROW
*
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
*
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
.XX: .01 [0.3]
2
.XXX: .005 [0.13]
.XXXX: .0020 [0.051]
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
INSULATOR: LCP, UL 94 V0, COLOR: BLACK
TERMINAL: PHOS BRONZE
HW BOARD TO BOARD ASSEMBLY
HW-XX-XX-XX-X-XXXX-SM-X-XXX
F:\DWG\MISC\MKTG\HW-XX-XX-XX-X-XXXX-SM-X-XXX-MKT.SLDDRW
BY:
G PURVIS
03/12/1993
SHEET
1
OF
3

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2200  2418  1091  947  645  45  49  22  20  13 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved