20-301590-10
REPLACES NATIONAL SEMICONDUCTOR DP7310J
.3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE
FEATURES:
• Allows placing an SOIC (narrow body) on a board laid
out for an SOWIC (wide body).
• Solder masked top side pads allow user to hand solder
devices directly to top side of adapter with fewer prob-
lems of solder bridging.
• Bottom pins bent in gull wing fashion to improve solder
joint mechanical integrity.
SPECIFICATIONS:
• Board material is .062 [1.58] thick FR-4 with 1 oz.
Copper traces, both sides.
• Pads are HASL.
• Pins are Brass Alloy 360 1/2 hard per UNS C36000
ASTM-B16-85.
• Pin plating is 200μ [5.08μm] min. Tin per MIL-T-10727
Type 1 or Tin/Lead 90/10 MIL-P-81728 over 100μ
[2.54μm] Nickel per QQ-N-290.
• Operating Temperature=221°F [105°C].
MOUNTING CONSIDERATIONS:
• Solder process just like any other surface mount device.
Note: Aries specializes in custom design and production. In addition to the standard
products shown on this page, special materials, platings, sizes, and configurations
can be furnished, depending on quantities. Aries reserves the right to change prod-
uct specifications without notice.
A
LL DIMENSIONS
:
INCHES
[
MILLIMETERS
]
All tolerances ± .005 [.13]
unless otherwise specified
http://www.arieselec.com • info@arieselec.com
NORTH AMERICA
Frenchtown, NJ USA
TEL:(908) 996-6841
FAX:(908) 996-3891
abc
EUROPE
TEL: +44 870 240 0249
FAX: +44 871 919 6033
europe@arieselec.com
18062
REV.C
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