AP2609GY-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
▼
Simple Drive Requirement
▼
Small Package Outline
▼
Surface Mount Device
▼
RoHS Compliant & Halogen-Free
SOT-26
D
D
S
P-CHANNEL ENHANCEMENT MODE
POWER MOSFET
BV
DSS
R
DS(ON)
G
D
D
-20V
57mΩ
- 5.1A
D
I
D
Description
Advanced Power MOSFETs from APEC provide the designer with the best
combination of fast switching,low on-resistance and cost-effectiveness.
The SOT-26 package is widely used for all commercial-industrial
applications.
G
S
Absolute Maximum Ratings
Symbol
V
DS
V
GS
I
D
@T
A
=25℃
I
D
@T
A
=70℃
I
DM
P
D
@T
A
=25℃
T
STG
T
J
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
3
, V
GS
@ 4.5V
Continuous Drain Current
3
, V
GS
@ 4.5V
Pulsed Drain Current
1
Total Power Dissipation
Storage Temperature Range
Operating Junction Temperature Range
Rating
- 20
+12
-5.1
-4
-20
2
-55 to 150
-55 to 150
Units
V
V
A
A
A
W
℃
℃
Thermal Data
Symbol
Rthj-a
Parameter
Maximum Thermal Resistance, Junction-ambient
3
Value
62.5
Unit
℃/W
1
201203011
Data and specifications subject to change without notice
AP2609GY-HF
Electrical Characteristics@T
j
=25
o
C(unless otherwise specified)
Symbol
BV
DSS
R
DS(ON)
Parameter
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance
2
Test Conditions
V
GS
=0V, I
D
=-250uA
V
GS
=-4.5V, I
D
=-5A
V
GS
=-2.5V, I
D
=-3A
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
R
g
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
Gate-Source Leakage
Total Gate Charge
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V
DS
=V
GS
, I
D
=-250uA
V
DS
=-5V, I
D
=-3A
V
DS
=-16V, V
GS
=0V
V
GS
= +12V, V
DS
=0V
I
D
=-3A
V
DS
=-10V
V
GS
=-4.5V
V
DS
=-10V
I
D
=-1A
R
G
=3.3Ω
V
GS
=-5V
V
GS
=0V
V
DS
=-10V
f=1.0MHz
f=1.0MHz
Min.
-20
-
-
-0.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ.
-
40
60
-0.7
10
-
-
8.5
1.2
3
10
20
27
22
660
135
120
7.2
Max. Units
-
57
100
-1.2
-
-10
+100
14
-
-
-
-
-
-
1050
-
-
14.4
V
mΩ
mΩ
V
S
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
Ω
Source-Drain Diode
Symbol
V
SD
t
rr
Q
rr
Parameter
Forward On Voltage
2
Reverse Recovery Time
Reverse Recovery Charge
Test Conditions
I
S
=-1.7A, V
GS
=0V
I
S
=-3A, V
GS
=0V,
dI/dt=100A/µs
Min.
-
-
-
Typ.
-
24
11
Max. Units
-1.2
-
-
V
ns
nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in
2
copper pad of FR4 board, t
≦
10S ; 156℃/W when mounted on min. copper pad.
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP2609GY-HF
16
16
T
A
=25 C
o
12
-I
D
, Drain Current (A)
V
G
= -2.0V
-I
D
, Drain Current (A)
-5.0V
-4.5V
-3.5V
-2.5V
T
A
= 150
o
C
12
-5.0V
-4.5V
-3.5V
-2.5V
65mΩ
G
= -2.0V
V
8
8
4
4
0
0
2
4
6
0
0
2
4
6
8
-V
DS
, Drain-to-Source Voltage (V)
-V
DS
, Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
80
2
I
D
=-3A
T
A
=25 C
70
o
I
D
= -5A
V
GS
= -4.5V
1.6
Normalized R
DS(ON)
R
DS(ON)
(m
Ω
)
60
1.2
50
0.8
40
1
2
3
4
5
0.4
-50
0
50
100
150
-V
GS
, Gate-to-Source Voltage (V)
T
j
, Junction Temperature (
o
C)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
2
4
I
D
= -250uA
1.6
3
T
j
=150
o
C
-I
S
(A)
T
j
=25
o
C
Normalized -V
GS(th)
1.2
2
0.8
1
0.4
2.01E+08
0
0
0.2
0.4
0.6
0.8
1
1.2
0
-50
0
50
100
150
-V
SD
, Source-to-Drain Voltage (V)
T
j
, Junction Temperature (
o
C)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP2609GY-HF
f=1.0MHz
6
1000
-V
GS
, Gate to Source Voltage (V)
5
I
D
= -3A
V
DS
=-10V
800
4
65mΩ
C (pF)
600
C
iss
3
400
2
200
1
C
oss
C
rss
0
0
2
4
6
8
10
12
0
1
5
9
13
17
21
25
Q
G
, Total Gate Charge (nC)
-V
DS
, Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
DUTY=0.5
Normalized Thermal Response (R
thja
)
0.2
10
Operation in this area
limited by R
DS(ON)
100us
1ms
0.1
0.1
-I
D
(A)
0.05
1
0.02
0.01
P
DM
t
T
Single Pulse
10ms
100ms
0.1
0.01
Duty factor = t/T
Peak T
j
= P
DM
x R
thja
+ T
a
R
thja
= 156
o
C/W
T
A
=25
o
C
Single Pulse
0.01
0.01
0.1
1
10
1s
DC
100
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
-V
DS
, Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
8
8
V
DS
=-5V
-I
D
, Drain Current (A)
6
-I
D
, Drain Current (A)
T
j
=150 C
o
T
j
=25 C
o
6
4
4
2
2
T
j
=-40
o
C
0
0
0.5
1
1.5
2
2.5
3
0
25
50
75
100
125
150
-V
GS
, Gate-to-Source Voltage (V)
T
A
, Ambient Temperature ( C )
o
Fig 11. Transfer Characteristics
Fig 12. Maximum Continuous Drain Current
v.s. Ambient Temperature
4
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