flip flops dual J-K W/neg-edge
参数名称 | 属性值 |
Brand Name | NXP Semiconduc |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SSOP1 |
包装说明 | SSOP, SSOP16,.3 |
针数 | 16 |
制造商包装代码 | SOT338-1 |
Reach Compliance Code | compli |
系列 | HC/UH |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e4 |
长度 | 6.2 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | J-KBAR FLIP-FLOP |
最大频率@ Nom-Su | 20000000 Hz |
最大I(ol) | 0.004 A |
湿度敏感等级 | 1 |
位数 | 2 |
功能数量 | 2 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出极性 | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装等效代码 | SSOP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
包装方法 | TAPE AND REEL |
峰值回流温度(摄氏度) | 260 |
电源 | 2/6 V |
传播延迟(tpd) | 265 ns |
认证状态 | Not Qualified |
座面最大高度 | 2 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 4.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
触发器类型 | POSITIVE EDGE |
宽度 | 5.3 mm |
最小 fmax | 24 MHz |
74HC109DB,118 | 74HC109DB,112 | 74HCT109DB,118 | 74HCT109PW,118 | 74HC109D,652 | 74HCT109D,653 | 74HCT109D,652 | |
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描述 | flip flops dual J-K W/neg-edge | flip flops dual J-K W/neg-edge | flip flops dual J-K pos edge | flip flops dual J-K pos edge | flip flops dual J-K W/neg-edge trig | flip flops dual J-K pos edge | flip flops dual J-K pos edge |
Brand Name | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconductor |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | SSOP1 | SSOP1 | SSOP1 | TSSOP | SOP | SOP | SOP |
包装说明 | SSOP, SSOP16,.3 | SSOP, SSOP16,.3 | SSOP, SSOP16,.3 | TSSOP, TSSOP16,.25 | SOT-109, SO-16 | SOP, SOP16,.25 | SOT-109, SO-16 |
针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
制造商包装代码 | SOT338-1 | SOT338-1 | SOT338-1 | SOT403-1 | SOT109-1 | SOT109-1 | SOT109-1 |
Reach Compliance Code | compli | compli | compli | compli | compli | compli | compliant |
系列 | HC/UH | HC/UH | HCT | HCT | HC/UH | HCT | HCT |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
长度 | 6.2 mm | 6.2 mm | 6.2 mm | 5 mm | 9.9 mm | 9.9 mm | 9.9 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP |
最大I(ol) | 0.004 A | 0.004 A | 0.006 A | 0.006 A | 0.004 A | 0.006 A | 0.006 A |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
位数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | SSOP | SSOP | TSSOP | SOP | SOP | SOP |
封装等效代码 | SSOP16,.3 | SSOP16,.3 | SSOP16,.3 | TSSOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
包装方法 | TAPE AND REEL | BULK PACK | TAPE AND REEL | TAPE AND REEL | BULK PACK | TAPE AND REEL | BULK PACK |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | 2/6 V | 2/6 V | 5 V | 5 V | 2/6 V | 5 V | 5 V |
传播延迟(tpd) | 265 ns | 265 ns | 53 ns | 53 ns | 265 ns | 53 ns | 53 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2 mm | 2 mm | 2 mm | 1.1 mm | 1.75 mm | 1.75 mm | 1.75 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 5.5 V | 5.5 V | 6 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2 V | 2 V | 4.5 V | 4.5 V | 2 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 4.5 V | 4.5 V | 5 V | 5 V | 4.5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 5.3 mm | 5.3 mm | 5.3 mm | 4.4 mm | 3.9 mm | 3.9 mm | 3.9 mm |
最小 fmax | 24 MHz | 24 MHz | 18 MHz | 18 MHz | 24 MHz | 18 MHz | 18 MHz |
最大频率@ Nom-Su | 20000000 Hz | 20000000 Hz | 18000000 Hz | 18000000 Hz | 20000000 Hz | 18000000 Hz | - |
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