OCT 0603, OCU 0805
Vishay Beyschlag
High Ohmic Flat Chip Resistors
FEATURES
•
Unique very high ohmic chip resistor product
•
•
•
•
•
•
Standard TCR: ± 100 ppm/K
Excellent overall stability
Low voltage coefficient: 0.05 %/V
Wide high ohmic range: > 10 MΩ to 130 MΩ
Lead (Pb)-free solder contacts
Compliant to RoHS directive 2002/95/EC
APPLICATIONS
OCT 0603 and OCU 0805 high ohmic flat chip resistors are
best suited where high resistance, high stability and high
reliability are required. Typical applications include any kind
of battery driven electronics, particularly low consumption
CMOS circuitry.
•
Any kind of battery driven electronics
•
Low consumption CMOS circuitry
•
Small signal measurement
METRIC SIZE
INCH:
METRIC:
0603
RR 1608M
0805
RR 2012M
TECHNICAL SPECIFICATIONS
DESCRIPTION
Metric size
Resistance range
Resistance tolerance
Temperature coefficient
Operation mode
Climatic category (LCT/UCT/days)
Rated dissipation,
P
70 (1)
Operating voltage,
U
max.
AC/DC
Film temperature
Max. resistance change at
P
70
for resistance range,
|ΔR/R| max., after:
1000 h
8000 h
Specified lifetime
Insulation voltage:
1 min;
U
ins
Continuous
Failure rate: FIT
observed
100 V
75 V
≤
0.1 x 10
-9
/h
200 V
75 V
≤
1%
≤
2%
≤
2%
≤
4%
8000 h
≤
1%
≤
2%
≤
2%
≤
4%
11 MΩ to 47 MΩ
11 MΩ to 47 MΩ
75 V
125 °C
150 V
155 °C
Standard
55/125/56
OCT 0603
RR 1608M
11 MΩ to 130 MΩ
±5%
± 250 ppm/K; ± 100 ppm/K
Power
55/155/56
Standard
55/125/56
Power
55/155/56
OCU 0805
RR 2012M
11 MΩ to 130 MΩ
Limited by
U
max.
150 V
125 °C
200 V
155 °C
Note
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded.
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Document Number: 28709
Revision: 23-Nov-09
OCT 0603, OCU 0805
High Ohmic Flat Chip Resistors
Vishay Beyschlag
PART NUMBER AND PRODUCT DESCRIPTION
(1)
PART NUMBER: OCT06030B5106JP500
O
MODEL/SIZE
OCT0603
OCU0805
C
T
0
6
0
3
TCR
0
B
5
1
VALUE
0
6
J
P
5
0
0
SPECIAL
Up to 2 digits
00
= Standard
SPECIAL CHARACTER
0
= Neutral
TOLERANCE PACKAGING
(2)
J=
±5%
P5
PW
B
= ± 100 ppm/K
W
= ± 250 ppm/K
3 digit value
1 digit multiplier
MULTIPLIER
5
= *10
5
6
= *10
6
PRODUCT DESCRIPTION: OCT 0603 -100 5% P5 51M
OCT
MODEL
OCT
OCU
0603
SIZE
0603
0805
-100
TCR
±
100
ppm/K
±
250
ppm/K
5%
TOLERANCE
±
5
%
P5
PACKAGING
(2)
P5
PW
51M
RESISTANCE VALUE
47M
= 47 MΩ
220M
= 220 MΩ
Notes
(1)
Products can be ordered using either the PRODUCT DESCRIPTION or the PART NUMBER
(2)
Please refer to table PACKAGING, below
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
DESCRIPTION
TCR
± 250 ppm/K
± 100 ppm/K
TOLERANCE
±5%
±5%
OCT 0603
51 MΩ to 130 MΩ
11 MΩ to 47 MΩ
RESISTANCE VALUE
(3)
OCU 0805
51 MΩ to 130 MΩ
11 MΩ to 47 MΩ
Note
(3)
Resistance values to be selected from E24 series
PACKAGING
REEL
MODEL
PIECES/
PAPER TAPE ON REEL
5000
OCT 0603
20 000
5000
OCU 0805
20 000
PW
PW
P5
CODE
P5
Document Number: 28709
Revision: 23-Nov-09
For technical questions, contact:
thinfilmchip@vishay.com
www.vishay.com
164
OCT 0603, OCU 0805
Vishay Beyschlag
DIMENSIONS
T
1
High Ohmic Flat Chip Resistors
W
W
T
H
T
2
L
DIMENSIONS AND MASS
TYPE
H
(mm)
0.45 + 0.1/- 0.05
0.45 + 0.1/- 0.05
L
(mm)
1.55 ± 0.05
2.0 ± 0.1
W
(mm)
0.85 ± 0.1
1.25 ± 0.15
W
T
(mm)
> 75 % of W
> 75 % of W
T
1
(mm)
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
T
2
(mm)
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
MASS
(mg)
1.9
4.6
OCT 0603
OCU 0805
SOLDER PAD DIMENSIONS
G
Y
Z
X
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
TYPE
G
(mm)
OCT 0603
OCU 0805
0.55
0.80
Y
(mm)
1.10
1.25
X
(mm)
1.10
1.50
Z
(mm)
2.75
3.30
G
(mm)
0.65
0.90
Y
(mm)
0.70
0.90
X
(mm)
0.95
1.40
Z
(mm)
2.05
2.70
REFLOW SOLDERING
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the
reliability of the assembly.
Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on board materials.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.
Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent
conductor areas.
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Document Number: 28709
Revision: 23-Nov-09
OCT 0603, OCU 0805
High Ohmic Flat Chip Resistors
Vishay Beyschlag
DESCRIPTION
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A newly
developed cermet layer is deposited on a high grade (Al
2
O
3
)
ceramic substrate and conditioned to achieve the desired
temperature coefficient. Inner contacts are built on both
sides of the substrate. A special laser is used to achieve the
target value by smoothly cutting the resistive layer without
damaging the ceramics. The resistor elements are covered
by a protective coating designed for electrical, mechanical
and climatic protection. The terminations receive a final pure
tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with
IEC 60286-3
(3)
.
All products comply with the
GADSL
(1)
and the
CEFIC-EECA-EICTA
(2)
list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
•
2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
•
2002/95/EC Restriction of
Substances directive (RoHS)
the
use
of
Hazardous
•
2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
APPROVALS
The resistors are tested in accordance with
EN 140401-802
which refers to
EN 60115-1 and EN 140400.
The detail
specification refers to the climatic category 55/125/56, which
relates to the “Standard operation mode” of this datasheet.
Vishay BEYSCHLAG has achieved
“Approval
Manufacturer”
in accordance with
EN 100114-1.
of
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic soldering
using wave, reflow or vapour phase as shown in
IEC 61760-1
(3)
. The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
suitability of conformal coatings, if applied, shall be qualified
by appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS compliant; the pure tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
Notes
(1)
(2)
Global Automotive Declarable Substance List, see
www.gadsl.org
CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see
www.eicta.org/index.php?id=995
→
issue
→
environment policy
→
chemicals
→
chemicals for electronics
The quoted IEC standards are also released as EN standards with the same number and identical contents
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166
(3)
Document Number: 28709
Revision: 23-Nov-09
OCT 0603, OCU 0805
Vishay Beyschlag
TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification (includes tests)
EN 140400, sectional specification (includes schedule for
qualification approval)
EN 140401-802, detail specification (includes schedule for
conformance inspection)
The components are approved in accordance with the
European CECC-system, where applicable. The following
table contains only the most important tests. For the full test
schedule refer to the documents listed above. The testing
also covers most of the requirements specified by
EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60068 and
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
High Ohmic Flat Chip Resistors
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days) is
valid.
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on boards in
accordance with EN 60115-1, 4.31 unless otherwise
specified.
The requirements stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-802. However, some
additional tests and a number of improvements against those
minimum requirements have been included.
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE
(ΔR/R)
Stability for product types:
OCT 0603
OCU 0805
4.5
4.8.4.2
4.25.1
-
-
-
Endurance at 70 °C:
Standard operation mode
Resistance
Temperature coefficient
U
= 100 V
At (20/- 55/20)
°C
and (20/125/20)
°C
U
=
U
max.
;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
4.25.3
4.24
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
78 (Cab)
Endurance at upper
category temperature
Damp heat, steady state
Climatic sequence:
dry heat
damp heat, cyclic
cold
low air pressure
damp heat, cyclic
UCT; 16 h
55 °C; 24 h; > 90 % RH;
1 cycle
LCT; 2 h
8.5 kPa; 2 h; (25 ± 10) °C
55 °C; 5 days; > 95 to 100 % RH; 5 cycles
LCT = - 55 °C; UCT = 125 °C
±1%
no visible damage
125 °C; 1000 h
155 °C; 1000 h
(40 ± 2) °C; 56 days; (93 ± 3) % RH
±1%
±2%
±2%
±3%
±1%
11 MΩ to 130 MΩ
11 MΩ to 130 MΩ
±5%
± 250 ppm/K; ± 100 ppm/K
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167
For technical questions, contact:
thinfilmchip@vishay.com
Document Number: 28709
Revision: 23-Nov-09
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