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MCP2562-H/P

产品描述can interface IC
产品类别无线/射频/通信    电信电路   
文件大小782KB,共30页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
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MCP2562-H/P概述

can interface IC

MCP2562-H/P规格参数

参数名称属性值
是否Rohs认证符合
包装说明DIP,
Reach Compliance Codecompli
Factory Lead Time12 weeks
JESD-30 代码R-PDIP-T8
JESD-609代码e3
长度9.271 mm
功能数量1
端子数量8
最高工作温度150 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)NOT APPLICABLE
座面最大高度5.334 mm
标称供电电压5 V
表面贴装NO
电信集成电路类型SUPPORT CIRCUIT
温度等级AUTOMOTIVE
端子面层Matte Tin (Sn) - annealed
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT APPLICABLE
宽度7.62 mm
Base Number Matches1

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MCP2561/2
High-Speed CAN Transceiver
Features:
• Supports 1 Mb/s Operation
• Implements ISO-11898-2 and ISO-11898-5
Standard Physical Layer Requirements
• Very Low Standby Current (5 µA, typical)
• V
IO
Supply Pin to Interface Directly to
CAN Controllers and Microcontrollers with
1.8V to 5.5V I/O
• SPLIT Output Pin to Stabilize Common Mode in
Biased Split Termination Schemes
• CAN Bus Pins are Disconnected when Device is
Unpowered:
- An Unpowered Node or Brown-Out Event will
Not Load the CAN Bus
• Detection of Ground Fault:
- Permanent Dominant Detection on T
XD
- Permanent Dominant Detection on Bus
• Power-on Reset and Voltage Brown-Out
Protection on V
DD
Pin
• Protection Against Damage Due to Short-Circuit
Conditions (Positive or Negative Battery Voltage)
• Protection Against High-Voltage Transients in
Automotive Environments
• Automatic Thermal Shutdown Protection
• Suitable for 12V and 24V Systems
• Meets or exceeds stringent automotive design
requirements including “Hardware Requirements
for LIN, CAN and FlexRay Interfaces in Automo-
tive Applications”, Version 1.3, May 2012
• High-Noise Immunity Due to Differential Bus
Implementation
• High Electrostatic Discharge (ESD) Protection on
CANH and CANL, meeting the IEC61000-4-2 up
to ±14 kV
• Available in PDIP-8L, SOIC-8L and 3x3 DFN-8L
• Temperature ranges:
- Extended (E): -40°C to +125°C
- High (H): -40°C to +150°C
Description:
The MCP2561/2 is a Microchip Technology Inc. second
generation high-speed CAN transceiver. It serves as an
interface between a CAN protocol controller and the
physical two-wire CAN bus.
The device meets the automotive requirements for
high-speed (up to 1 Mb/s), low quiescent current,
electromagnetic compatibility (EMC) and electrostatic
discharge (ESD).
Package Types
MCP2561
PDIP, SOIC
T
XD
1
V
SS
2
V
DD
3
R
XD
4
8 STBY
7 CANH
6 CANL
5 SPLIT
MCP2562
PDIP, SOIC
T
XD
1
V
SS
2
V
DD
3
R
XD
4
8 STBY
7 CANH
6 CANL
5 V
IO
MCP2561
3x3 DFN*
T
XD
1
V
SS
2
V
DD
3
R
XD
4
EP
9
8 STBY
7 CANH
6 CANL
5 SPLIT
MCP2562
3x3 DFN*
T
XD
1
V
SS
2
V
DD
3
R
XD
4
EP
9
8 STBY
7 CANH
6 CANL
5 V
IO
* Includes Exposed Thermal Pad (EP); see
Table 1-2.
MCP2561/2 Family Members
Device
MCP2561
MCP2562
Note:
Feature
Split pin
V
IO
pin
Description
Common mode stabilization
Internal level shifter on digital I/O pins
For ordering information, see the
“Product Identification System”
section on page 27.
2013-2014 Microchip Technology Inc.
DS20005167C-page 1

MCP2562-H/P相似产品对比

MCP2562-H/P MCP2562-E/MF MCP2561-H/P MCP2561-H/MF MCP2562T-H/MF MCP2561T-H/MF MCP2562-H/MF MCP2561T-H/SN MCP2562-H/SN
描述 can interface IC can interface IC can interface IC can interface IC can interface IC can interface IC can interface IC can interface IC can interface IC
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合
包装说明 DIP, HVSON, DIP, DIP8,.3 DFN-8 HVSON, DFN-8 HVSON, SOP, SOP8,.25 SOP,
Reach Compliance Code compli compli compli compli compli compli compli compli compli
Factory Lead Time 12 weeks 13 weeks 6 weeks 5 weeks 1 week 5 weeks 17 weeks 15 weeks 14 weeks
JESD-30 代码 R-PDIP-T8 S-PDSO-N8 R-PDIP-T8 S-PDSO-N8 S-PDSO-N8 S-PDSO-N8 S-PDSO-N8 R-PDSO-G8 R-PDSO-G8
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e3 e3
长度 9.271 mm 3 mm 9.271 mm 3 mm 3 mm 3 mm 3 mm 4.9 mm 4.9 mm
功能数量 1 1 1 1 1 1 1 1 1
端子数量 8 8 8 8 8 8 8 8 8
最高工作温度 150 °C 125 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP HVSON DIP HVSON HVSON HVSON HVSON SOP SOP
封装形状 RECTANGULAR SQUARE RECTANGULAR SQUARE SQUARE SQUARE SQUARE RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) NOT APPLICABLE 260 NOT APPLICABLE 260 260 260 260 260 260
座面最大高度 5.334 mm 1 mm 5.334 mm 1 mm 1 mm 1 mm 1 mm 1.75 mm 1.75 mm
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES NO YES YES YES YES YES YES
电信集成电路类型 SUPPORT CIRCUIT SUPPORT CIRCUIT CAN TRANSCEIVER CAN TRANSCEIVER SUPPORT CIRCUIT CAN TRANSCEIVER SUPPORT CIRCUIT CAN TRANSCEIVER SUPPORT CIRCUIT
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
端子形式 THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD NO LEAD NO LEAD NO LEAD GULL WING GULL WING
端子节距 2.54 mm 0.65 mm 2.54 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT APPLICABLE 40 NOT APPLICABLE 40 40 40 40 40 40
宽度 7.62 mm 3 mm 7.62 mm 3 mm 3 mm 3 mm 3 mm 3.9 mm 3.9 mm
Base Number Matches 1 1 - - 1 - 1 - 1
厂商名称 - Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) - Microchip(微芯科技) - Microchip(微芯科技) -
湿度敏感等级 - 1 - 1 1 1 1 3 3

 
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