eeprom 2K 256x8 1.5V serial EE
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | DFN |
| 包装说明 | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 13 weeks |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| 数据保留时间-最小值 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 内存密度 | 2048 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -20 °C |
| 组织 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC8,.11,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.8/3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 0.000001 A |
| 最大压摆率 | 0.003 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.5 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 2 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE/SOFTWARE |
| 34VL02T/MNY | 34VL02T/SN | 34VL02/ST | 34VL02/MS | 34VL02/SN | 34VL02T/ST | |
|---|---|---|---|---|---|---|
| 描述 | eeprom 2K 256x8 1.5V serial EE | eeprom 2K 256x8 1.5V serial EE | eeprom 2K 256x8 1.5V serial EE | eeprom 2K 256x8 1.5V serial EE | eeprom 2K 256x8 1.5V serial EE | eeprom 2K 256x8 1.5V |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DFN | SOIC | TSOP | MSOP | SOIC | TSOP |
| 包装说明 | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | 3.90 MM, ROHS COMPLIANT, PLATIC, SOIC-8 | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSOP-8 | ROHS COMPLIANT, PLASTIC, MSOP-8 | 3.90 MM, ROHS COMPLIANT, PLATIC, SOIC-8 | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSOP-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 13 weeks | 23 weeks | 23 weeks | 22 weeks | 23 weeks | 23 weeks |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| 数据保留时间-最小值 | 200 | 200 | 200 | 200 | 200 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e4 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 3 mm | 4.9 mm | 4.4 mm | 3 mm | 4.9 mm | 4.4 mm |
| 内存密度 | 2048 bi | 2048 bi | 2048 bit | 2048 bit | 2048 bit | 2048 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 湿度敏感等级 | 1 | 3 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| 字数代码 | 256 | 256 | 256 | 256 | 256 | 256 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 组织 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | SOP | TSSOP | TSSOP | SOP | TSSOP |
| 封装等效代码 | SOLCC8,.11,20 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.19 | SOP8,.25 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 1.75 mm | 1.2 mm | 1.1 mm | 1.75 mm | 1.2 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大待机电流 | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A |
| 最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 |
| 宽度 | 2 mm | 3.9 mm | 3 mm | 3 mm | 3.9 mm | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
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