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74AHC00D,112: 产品描述logic gates quad 2-input nand; 产品类别逻辑逻辑; 文件大小79KB，共15页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74AHC00D,112概述

logic gates quad 2-input nand

74AHC00D,112规格参数

参数名称	属性值
Brand Name	NXP Semiconduc
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	SOIC
包装说明	SOP, SOP14,.25
针数	14
制造商包装代码	SOT108-1
Reach Compliance Code	compli
系列	AHC/VHC/H/U/V
JESD-30 代码	R-PDSO-G14
JESD-609代码	e4
长度	8.65 mm
负载电容（CL）	50 pF
逻辑集成电路类型	NAND GATE
最大I（ol）	0.008 A
湿度敏感等级	1
功能数量	4
输入次数	2
端子数量	14
最高工作温度	125 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP14,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
包装方法	TUBE
峰值回流温度（摄氏度）	260
电源	2/5.5 V
Prop。Delay @ Nom-Su	9.5 ns
传播延迟（tpd）	14.5 ns
认证状态	Not Qualified
施密特触发器	NO
座面最大高度	1.75 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	3.9 mm

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74AHC00; 74AHCT00

Quad 2-input NAND gate

Rev. 04 — 28 April 2008

Product data sheet

1. General description

The 74AHC00; 74AHCT00 is a high-speed Si-gate CMOS device and is pin compatible

with Low-power Schottky TTL (LSTTL). It is speciﬁed in compliance with JEDEC

standard No. JESD7-A.

The 74AHC00; 74AHCT00 provides the quad 2-input NAND function.

2. Features

Balanced propagation delays

All inputs have Schmitt-trigger actions

Inputs accept voltages higher than V

Input levels:

For 74AHC00: CMOS level

For 74AHCT00: TTL level

ESD protection:

HBM EIA/JESD22-A114E exceeds 2000 V

MM EIA/JESD22-A115-A exceeds 200 V

CDM EIA/JESD22-C101C exceeds 1000 V

Multiple package options

Speciﬁed from

−40 °C

to +85

°C

and from

−40 °C

to +125

°C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74AHC00

74AHC00D

74AHC00PW

74AHC00BQ

−40 °C

to +125

°C

−40 °C

to +125

°C

−40 °C

to +125

°C

SO14

TSSOP14

plastic small outline package; 14 leads;

body width 3.9 mm

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

SOT108-1

SOT402-1

SOT762-1

Name

Description

Version

Type number

DHVQFN14 plastic dual in-line compatible thermal enhanced very

thin quad ﬂat package; no leads; 14 terminals;

body 2.5

0.85 mm

74AHC00D,112相似产品对比

	74AHC00D,112	74AHCT00D,118	74AHC00PW,112	74AHCT00PW,118	74AHCT00PW,112	74AHCT00BQ,115	74AHCT00D,112	74AHC00PW,118	74AHC00BQ,115	74AHC00D,118
描述	logic gates quad 2-input nand	logic gates quad 2-input nand	logic gates quad 2-input nand	logic gates quad 2-input nand	logic gates quad 2-input nand	logic gates 5V quad 2-input nand	logic gates quad 2-input nand	logic gates quad 2-input nand	logic gates 5V quad 2-input nand	logic gates quad 2-input nand
Brand Name	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconductor
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	SOIC	SOIC	TSSOP	TSSOP	TSSOP	QFN	SOIC	TSSOP	QFN	SOIC
包装说明	SOP, SOP14,.25	SOP, SOP14,.25	4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14	TSSOP, TSSOP14,.25	TSSOP, TSSOP14,.25	2.50 X 3MM, 0.85 MM, PLASTIC, MO-241, SOT762-1, DHVQFN-14	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14	4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14	2.50 X 3MM, 0.85 MM, PLASTIC, MO-241, SOT762-1, DHVQFN-14	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
针数	14	14	14	14	14	14	14	14	14	14
制造商包装代码	SOT108-1	SOT108-1	SOT402-1	SOT402-1	SOT402-1	SOT762-1	SOT108-1	SOT402-1	SOT762-1	SOT108-1
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli	compli	compli	compliant
系列	AHC/VHC/H/U/V	AHCT/VHCT/VT	AHC/VHC/H/U/V	AHCT/VHCT/VT	AHCT/VHCT/VT	AHCT/VHCT/VT	AHCT/VHCT/VT	AHC/VHC/H/U/V	AHC/VHC/H/U/V	AHC/VHC/H/U/V
JESD-30 代码	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PQCC-N14	R-PDSO-G14	R-PDSO-G14	R-PQCC-N14	R-PDSO-G14
JESD-609代码	e4	e4	e4	e4	e4	e4	e4	e4	e4	e4
长度	8.65 mm	8.65 mm	5 mm	5 mm	5 mm	3 mm	8.65 mm	5 mm	3 mm	8.65 mm
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE
最大I（ol）	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
湿度敏感等级	1	1	1	1	1	1	1	1	1	1
功能数量	4	4	4	4	4	4	4	4	4	4
输入次数	2	2	2	2	2	2	2	2	2	2
端子数量	14	14	14	14	14	14	14	14	14	14
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	SOP	TSSOP	TSSOP	TSSOP	HVQCCN	SOP	TSSOP	HVQCCN	SOP
封装等效代码	SOP14,.25	SOP14,.25	TSSOP14,.25	TSSOP14,.25	TSSOP14,.25	LCC14,.1X.12,20	SOP14,.25	TSSOP14,.25	LCC14,.1X.12,20	SOP14,.25
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE
包装方法	TUBE	TAPE AND REEL	TUBE	TAPE AND REEL	TUBE	TAPE AND REEL	TUBE	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260	260	260
电源	2/5.5 V	5 V	2/5.5 V	5 V	5 V	5 V	5 V	2/5.5 V	2/5.5 V	2/5.5 V
传播延迟（tpd）	14.5 ns	10 ns	14.5 ns	10 ns	10 ns	10 ns	10 ns	14.5 ns	14.5 ns	14.5 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
施密特触发器	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
座面最大高度	1.75 mm	1.75 mm	1.1 mm	1.1 mm	1.1 mm	1 mm	1.75 mm	1.1 mm	1 mm	1.75 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	2 V	4.5 V	2 V	4.5 V	4.5 V	4.5 V	4.5 V	2 V	2 V	2 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子面层	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	GULL WING	GULL WING	NO LEAD	GULL WING
端子节距	1.27 mm	1.27 mm	0.65 mm	0.65 mm	0.65 mm	0.5 mm	1.27 mm	0.65 mm	0.5 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD	DUAL
处于峰值回流温度下的最长时间	30	30	30	30	30	30	30	30	30	30
宽度	3.9 mm	3.9 mm	4.4 mm	4.4 mm	4.4 mm	2.5 mm	3.9 mm	4.4 mm	2.5 mm	3.9 mm
Prop。Delay @ Nom-Su	9.5 ns	10 ns	9.5 ns	10 ns	9 ns	10 ns	9 ns	9.5 ns	9.5 ns	-

74AHC00D,112

74AHC00D,112概述

74AHC00D,112规格参数

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