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MCP79411-I/ST

产品描述real time clock i2c GP rtcc 1kb EE 64b sram eui-48
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小417KB,共35页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
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MCP79411-I/ST概述

real time clock i2c GP rtcc 1kb EE 64b sram eui-48

MCP79411-I/ST规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Microchip(微芯科技)
零件包装代码SOIC
包装说明4.40 MM BODY, ROHS COMPLAINT, PLASTIC, TSSOP-8
针数8
Reach Compliance Codecompli
ECCN代码EAR99
Factory Lead Time6 weeks
其他特性ALSO OPERATES AT 100KHZ WITH 1.8 V NOMINAL
最大时钟频率0.4 MHz
外部数据总线宽度
信息访问方法I2C
中断能力Y
JESD-30 代码R-PDSO-G8
JESD-609代码e3
长度4.4 mm
湿度敏感等级1
端子数量8
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP8,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
电源2/5 V
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压5.5 V
最小供电电压2.5 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn) - annealed
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
最短时间SECONDS
处于峰值回流温度下的最长时间40
易失性NO
宽度3 mm
uPs/uCs/外围集成电路类型TIMER, REAL TIME CLOCK

文档解析

MCP7941X系列实时时钟芯片结合了数字校准、多输出控制和数据存储功能。核心RTCC模块通过数字微调实现±127ppm的校准精度(步进1ppm),显著提升时钟长期稳定性。可编程开漏输出支持四种时钟分频信号(32.768kHz/8.192kHz/4.096kHz/1Hz)及双路闹钟输出,多功能引脚(MFP)可配置为通用I/O或校准信号输出。 器件集成1Kbit EEPROM存储器,支持8字节页写入和可配置写保护(无保护/1/4区/半区/全保护)。64字节SRAM在VBAT备份模式下保持数据,独立64位唯一ID区支持工厂预编程MAC地址或用户自定义ID,需特定解锁序列写入。电源管理模块具备自动VCC/VBAT切换能力,切换阈值典型值1.5V,切换事件触发时间戳记录至专用寄存器。 工作电流典型值400μA(读取),EEPROM写入时峰值3mA,VBAT备份电流低于700nA@1.8V。I²C接口内置4kV ESD保护,适用于网络设备、医疗仪器及能源管理系统,提供工业级8引脚封装选项,包括TDFN(2×3mm)和MSOP微型封装。

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MCP79410/MCP79411/MCP79412
I
2
C™ Real-Time Clock/Calendar with EEPROM, SRAM,
Unique ID and Battery Switchover
Device Selection Table
Part
Number
MCP79410
MCP79411
MCP79412
EEPROM
(Kbits)
1K
1K
1K
SRAM
(Bytes)
64
64
64
Unique ID
Blank
EUI-48
EUI-64
Description:
The MCP7941X series of low-power Real-Time Clocks
(RTC) uses digital timing compensation for an accurate
clock/calendar, a programmable output control for
versatility, a power sense circuit that automatically
switches to the backup supply, and nonvolatile memory
for data storage. Using a low-cost 32.768 kHz crystal,
it tracks time using several internal registers. For
communication, the MCP7941X uses the I
2
C™ bus.
The clock/calendar automatically adjusts for months
with fewer than 31 days, including corrections for
leap years. The clock operates in either the 24-hour
or 12-hour format with an AM/PM indicator and
settable alarm(s) to the second, minute, hour, day of
the week, date or month. Using the programmable
CLKOUT, frequencies of 32.768, 8.192 and 4.096
kHz and 1 Hz can be generated from the external
crystal.
Along with the on-board Serial EEPROM and battery-
backed SRAM memory, a 64-bit protected space is
available for a unique ID or MAC address to be
programmed at the factory or by the end user.
The device is fully accessible through the serial
interface while V
CC
is between 1.8V and 5.5V, but can
operate down to 1.3V for timekeeping and SRAM
retention only.
The RTC series of devices are available in the standard
8-lead SOIC, TSSOP, MSOP and 2x3 TDFN packages.
Features:
• Real-Time Clock/Calendar (RTCC), Battery
Backed:
- Hours, Minutes, Seconds, Day of Week, Day,
Month and Year
- Dual alarm with single output
• On-Chip Digital Trimming/Calibration:
- Range -127 to +127 ppm
- Resolution 1 ppm
• Programmable Open-Drain Output Control:
- CLKOUT with 4 selectable frequencies
- Alarm output
• 64 Bytes SRAM, Battery Backed
• 1 Kbits EEPROM (128x8):
- 8 bytes/page
- Block/sector write protection
- Protect none, 1/4, 1/2 or all of array
• Separate 64-Bit Unique ID:
- User or factory programmable
- Protected area
- EUI-48
or EUI-64
MAC address
- Custom ID programming
• Automatic V
CC
Switchover to V
BAT
Backup
Supply
• Power-Fail Time-Stamp for Battery Switchover
• Low-Power CMOS Technology:
- Dynamic Current: 400
A
max read
- Dynamic Current: 3mA max EEPROM write
- Battery Backup Current: <700nA @ 1.8V
• 100 kHz and 400 kHz Compatibility
• ESD Protection >4,000V
• More than 1 Million Erase/Write Cycles
• Packages include 8-Lead SOIC, TSSOP, 2x3
TDFN, MSOP
• Pb-Free and RoHS Compliant
• Temperature Ranges:
- Industrial (I): -40°C to +85°C.
2010 Microchip Technology Inc.
Package Types
MSOP
X1
X2
V
BAT
V
SS
1
2
3
4
8
7
6
5
SOIC, TSSOP
X1
X2
V
BAT
V
SS
1
2
3
4
8
7
6
5
V
CC
MFP
SCL
SDA
V
CC
MFP
TDFN
SCL
SDA
X1 1
X2 2
V
BAT
3
V
SS
4
8 V
CC
7 MFP
6 SCL
5 SDA
Preliminary
DS22266A-page 1

MCP79411-I/ST相似产品对比

MCP79411-I/ST MCP79410-I/SN MCP79412-I/MS MCP79411T-I/SN MCP79412T-I/SN MCP79411T-I/ST MCP79412T-I/ST
描述 real time clock i2c GP rtcc 1kb EE 64b sram eui-48 real time clock i2c GP rtcc 1kb EE 64b sram ID real time clock i2c GP rtcc 1kb EE 64b sram eui-64 real time clock i2c GP rtcc 1kb EE 64b sram eui-48 real time clock i2c GP rtcc 1kb EE 64b sram eui-64 real time clock i2c GP rtcc 1kb EE 64b sram eui-48 real time clock i2c GP rtcc 1kb EE 64b sram eui-64
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)
零件包装代码 SOIC SOIC MSOP SOIC SOIC SOIC SOIC
包装说明 4.40 MM BODY, ROHS COMPLAINT, PLASTIC, TSSOP-8 SOP, SOP8,.25 ROHS COMPLAINT, PLASTIC, MSOP-8 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 4.40 MM BODY, ROHS COMPLAINT, PLASTIC, TSSOP-8 TSSOP-8
针数 8 8 8 8 8 8 8
Reach Compliance Code compli compli compli compli compli compli compli
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Factory Lead Time 6 weeks 11 weeks 18 weeks 11 weeks 16 weeks 6 weeks 6 weeks
其他特性 ALSO OPERATES AT 100KHZ WITH 1.8 V NOMINAL ALSO OPERATES AT 100KHZ WITH 1.8 V NOMINAL ALSO OPERATES AT 100KHZ WITH 1.8 V NOMINAL ALSO OPERATES AT 100KHZ WITH 1.8 V NOMINAL ALSO OPERATES AT 100KHZ WITH 1.8 V NOMINAL ALSO OPERATES AT 100KHZ WITH 1.8 V NOMINAL ALSO OPERATES AT 100KHZ WITH 1.8 V NOMINAL
最大时钟频率 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz
信息访问方法 I2C I2C I2C I2C I2C I2C I2C
中断能力 Y Y Y Y Y Y Y
JESD-30 代码 R-PDSO-G8 R-PDSO-G8 S-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609代码 e3 e3 e3 e3 e3 e3 e3
长度 4.4 mm 4.9 mm 3 mm 4.9 mm 4.9 mm 4.4 mm 4.4 mm
湿度敏感等级 1 3 1 3 3 1 1
端子数量 8 8 8 8 8 8 8
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP SOP TSSOP SOP SOP TSSOP TSSOP
封装等效代码 TSSOP8,.25 SOP8,.25 TSSOP8,.19 SOP8,.25 SOP8,.25 TSSOP8,.25 TSSOP8,.25
封装形状 RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 260 260 260 260 260 260 260
电源 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.75 mm 1.1 mm 1.75 mm 1.75 mm 1.2 mm 1.2 mm
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 1.27 mm 0.65 mm 1.27 mm 1.27 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL
最短时间 SECONDS SECONDS SECONDS SECONDS SECONDS SECONDS SECONDS
处于峰值回流温度下的最长时间 40 40 40 40 40 40 40
易失性 NO NO NO NO NO NO NO
宽度 3 mm 3.9 mm 3 mm 3.9 mm 3.9 mm 3 mm 3 mm
uPs/uCs/外围集成电路类型 TIMER, REAL TIME CLOCK TIMER, REAL TIME CLOCK TIMER, REAL TIME CLOCK TIMER, REAL TIME CLOCK TIMER, REAL TIME CLOCK TIMER, REAL TIME CLOCK TIMER, REAL TIME CLOCK
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