analog to digital converters - adc 8-bit precision adc
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP20,.3 |
| 针数 | 20 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 12 weeks |
| 最大模拟输入电压 | 5.1 V |
| 最小模拟输入电压 | -0.1 V |
| 最长转换时间 | 2 µs |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e3 |
| 长度 | 26.16 mm |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 4.572 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MX7820KN+ | MX7820KCWP+ | MAX150BCWP+ | MX7820KEWP+T | MAX150BCPP+ | MX7820KEWP+ | MX7820KCWP+T | MAX150BEPP+ | |
|---|---|---|---|---|---|---|---|---|
| 描述 | analog to digital converters - adc 8-bit precision adc | analog to digital converters - adc 8-bit precision adc | analog to digital converters - adc 8-bit 500ksps 5V precision adc | analog to digital converters - adc 8-bit precision adc | analog to digital converters - adc 8-bit 500ksps 5V precision adc | analog to digital converters - adc 8-bit precision adc | analog to digital converters - adc 8-bit precision adc | analog to digital converters - adc 8-bit 500ksps 5V precision adc |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | DIP | SOIC | SOIC | SOIC | DIP | SOIC | SOIC | DIP |
| 包装说明 | DIP, DIP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 | SOP, | DIP, DIP20,.3 | SOP, | SOP, SOP20,.4 | DIP, DIP20,.3 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | 3A001.A.2.C | EAR99 | EAR99 |
| Factory Lead Time | 12 weeks | 12 weeks | 13 weeks | 12 weeks | 13 weeks | 12 weeks | 12 weeks | 6 weeks |
| 最大模拟输入电压 | 5.1 V | 5.1 V | 5.1 V | 5.1 V | 5.1 V | 5.1 V | 5.1 V | 5.1 V |
| 最小模拟输入电压 | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.1 V |
| 最长转换时间 | 2 µs | 2 µs | 2 µs | 2 µs | 2 µs | 2 µs | 2 µs | 2 µs |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 26.16 mm | 12.8 mm | 12.8 mm | 12.8 mm | 26.16 mm | 12.8 mm | 12.8 mm | 26.16 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | SOP | DIP | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 4.572 mm | 2.65 mm | 2.65 mm | 2.65 mm | 4.572 mm | 2.65 mm | 2.65 mm | 4.572 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 |
| 宽度 | 7.62 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm |
| 封装等效代码 | DIP20,.3 | SOP20,.4 | SOP20,.4 | - | DIP20,.3 | - | SOP20,.4 | DIP20,.3 |
| 电源 | 5 V | 5 V | 5 V | - | 5 V | - | 5 V | 5 V |
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