translation - voltage levels 11.2ns 5.5V 300mw
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| Brand Name | NXP Semiconduc |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SON |
| 包装说明 | 1.35 X 1 MM, 0.35 MM HEIGHT, 0.35 MM PITCH, SOT-1203, SON-8 |
| 针数 | 8 |
| 制造商包装代码 | SOT1203 |
| Reach Compliance Code | compli |

| 74LVC2G02GS,115 | 74LVC2G02DP,125 | 74LVC2G02GD,125 | 74LVC2G02GN,115 | 74LVC2G02DC,125 | 74LVC2G02GT,115 | 74LVC2G02GM,125 | 74LVC2G02GF,115 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | translation - voltage levels 11.2ns 5.5V 300mw | logic gates 3.3V dual 2-input | logic gates nor gate 2-element 2-IN cmos 8-pin | logic gates dual 2-input nor gate | logic gates dual 2-input nor | logic gates 3.3V dual 2-input | logic gates 3.3V dual 2input nor | logic gates nor 2circuit 5.5V |
| Brand Name | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SON | TSSOP | SON | SON | SSOP | SON | QFN | SON |
| 包装说明 | 1.35 X 1 MM, 0.35 MM HEIGHT, 0.35 MM PITCH, SOT-1203, SON-8 | TSSOP, TSSOP8,.16 | 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8 | 1.20 X 1 MM, 0.35 MM HEIGHT, SOT-1116, SON-8 | VSSOP, TSSOP8,.12,20 | 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-833-1, SON-8 | VBCC, LCC8,.06SQ,20 | 1.35 X 1 MM, 0.50 MM HEIGHT, MO-252, SOT-1089, SON-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 制造商包装代码 | SOT1203 | SOT505-2 | SOT996-2 | SOT1116 | SOT765-1 | SOT833-1 | SOT902-2 | SOT1089 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli |
| 系列 | - | LVC/LCX/Z | LVC/LCX/Z | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | - |
| JESD-30 代码 | - | S-PDSO-G8 | R-PDSO-N8 | - | R-PDSO-G8 | R-PDSO-N8 | S-PBCC-B8 | - |
| JESD-609代码 | - | e4 | e4 | - | e4 | e3 | e4 | - |
| 长度 | - | 3 mm | 3 mm | - | 2.3 mm | 1.95 mm | 1.6 mm | - |
| 负载电容(CL) | - | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | - |
| 逻辑集成电路类型 | - | NOR GATE | NOR GATE | - | NOR GATE | NOR GATE | NOR GATE | - |
| 最大I(ol) | - | 0.024 A | 0.024 A | - | 0.024 A | 0.024 A | 0.024 A | - |
| 湿度敏感等级 | - | 1 | 1 | - | 1 | 1 | 1 | - |
| 功能数量 | - | 2 | 2 | - | 2 | 2 | 2 | - |
| 输入次数 | - | 2 | 2 | - | 2 | 2 | 2 | - |
| 端子数量 | - | 8 | 8 | - | 8 | 8 | 8 | - |
| 最高工作温度 | - | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | TSSOP | VSON | - | VSSOP | VSON | VBCC | - |
| 封装等效代码 | - | TSSOP8,.16 | SOLCC8,.11,20 | - | TSSOP8,.12,20 | SOLCC8,.04,20 | LCC8,.06SQ,20 | - |
| 封装形状 | - | SQUARE | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | SQUARE | - |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | - |
| 包装方法 | - | TAPE AND REEL | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | - |
| 峰值回流温度(摄氏度) | - | 260 | 260 | - | 260 | 260 | 260 | - |
| 电源 | - | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | - |
| Prop。Delay @ Nom-Su | - | 6.2 ns | 6.2 ns | - | 6.2 ns | 6.2 ns | 6.2 ns | - |
| 传播延迟(tpd) | - | 11.2 ns | 11.2 ns | - | 11.2 ns | 11.2 ns | 11.2 ns | - |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
| 施密特触发器 | - | NO | NO | - | NO | NO | NO | - |
| 座面最大高度 | - | 1.1 mm | 0.5 mm | - | 1 mm | 0.5 mm | 0.5 mm | - |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | - | 1.65 V | 1.65 V | - | 1.65 V | 1.65 V | 1.65 V | - |
| 标称供电电压 (Vsup) | - | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | - |
| 表面贴装 | - | YES | YES | - | YES | YES | YES | - |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS | CMOS | - |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | - | GULL WING | NO LEAD | - | GULL WING | NO LEAD | BUTT | - |
| 端子节距 | - | 0.65 mm | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | - |
| 端子位置 | - | DUAL | DUAL | - | DUAL | DUAL | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | - | 30 | 30 | 30 | - |
| 宽度 | - | 3 mm | 2 mm | - | 2 mm | 1 mm | 1.6 mm | - |
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