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74LVC1G57GS,132

产品描述translation - voltage levels 18ns 5.5V 250mw
产品类别逻辑    逻辑   
文件大小148KB,共21页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
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74LVC1G57GS,132概述

translation - voltage levels 18ns 5.5V 250mw

74LVC1G57GS,132规格参数

参数名称属性值
Source Url Status Check Date2013-06-14 00:00:00
Brand NameNXP Semiconduc
是否Rohs认证符合
厂商名称NXP(恩智浦)
包装说明1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6
制造商包装代码SOT1202
Reach Compliance Codecompli

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74LVC1G57
Low-power configurable multiple function gate
Rev. 6 — 6 December 2011
Product data sheet
1. General description
The 74LVC1G57 provides configurable multiple functions. The output state is determined
by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND,
NOR, XNOR, inverter and buffer. All inputs can be connected to V
CC
or GND.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this
device in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
All inputs (A, B and C) are Schmitt trigger inputs. They are capable of transforming slowly
changing input signals into sharply defined, jitter-free output signals.
2. Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8B/JESD36 (2.7 V to 3.6 V).
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
24
mA output drive (V
CC
= 3.0 V)
CMOS low power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C.

74LVC1G57GS,132相似产品对比

74LVC1G57GS,132 74LVC1G57GM,132 74LVC1G57GF,132 74LVC1G57GM,115 74LVC1G57GV,125
描述 translation - voltage levels 18ns 5.5V 250mw logic gates 3.3V single 2chan logic gates 3.3V 1G low-P config logic gates 3.3V LP config gate logic gates 3.3V LP config gate
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconductor NXP Semiconductor
是否Rohs认证 符合 符合 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
包装说明 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6 VSON, SOLCC6,.04,20 VSON, SOLCC6,.04,14 VSON, SOLCC6,.04,20 TSSOP, TSOP6,.11,37
制造商包装代码 SOT1202 SOT886 SOT891 SOT886 SOT457
Reach Compliance Code compli compli compli compliant compliant
零件包装代码 - SON SON SON TSOP
针数 - 6 6 6 6
系列 - LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 - R-PDSO-N6 S-PDSO-N6 R-PDSO-N6 R-PDSO-G6
JESD-609代码 - e3 e3 e3 e3
长度 - 1.45 mm 1 mm 1.45 mm 2.9 mm
负载电容(CL) - 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 - LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT
最大I(ol) - 0.024 A 0.024 A 0.024 A 0.024 A
湿度敏感等级 - 1 1 1 1
功能数量 - 1 1 1 1
端子数量 - 6 6 6 6
最高工作温度 - 125 °C 125 °C 125 °C 125 °C
最低工作温度 - -40 °C -40 °C -40 °C -40 °C
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - VSON VSON VSON TSSOP
封装等效代码 - SOLCC6,.04,20 SOLCC6,.04,14 SOLCC6,.04,20 TSOP6,.11,37
封装形状 - RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
封装形式 - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法 - TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) - 260 260 260 260
电源 - 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 - Not Qualified Not Qualified Not Qualified Not Qualified
施密特触发器 - YES YES YES YES
座面最大高度 - 0.5 mm 0.5 mm 0.5 mm 1.1 mm
最大供电电压 (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) - 1.65 V 1.65 V 1.65 V 1.65 V
标称供电电压 (Vsup) - 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 - YES YES YES YES
技术 - CMOS CMOS CMOS CMOS
温度等级 - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 - Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn)
端子形式 - NO LEAD NO LEAD NO LEAD GULL WING
端子节距 - 0.5 mm 0.35 mm 0.5 mm 0.95 mm
端子位置 - DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 - 30 30 30 30
宽度 - 1 mm 1 mm 1 mm 1.5 mm

 
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