analog to digital converters - adc 300/400ksps sgl-sply 4ch serial 10bit
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | TSSOP |
包装说明 | TSSOP, |
针数 | 16 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 12 weeks |
Is Samacsys | N |
最大模拟输入电压 | 2.5 V |
最小模拟输入电压 | |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e3 |
长度 | 5 mm |
最大线性误差 (EL) | 0.0488% |
湿度敏感等级 | 1 |
模拟输入通道数量 | 4 |
位数 | 10 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | BINARY, 2'S COMPLEMENT BINARY |
输出格式 | SERIAL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
采样速率 | 0.3 MHz |
采样并保持/跟踪并保持 | TRACK |
座面最大高度 | 1.1 mm |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 4.4 mm |
Base Number Matches | 1 |
MAX1083AEUE+ | MAX1082BCUE+ | MAX1083BEUE+T | MAX1082AEUE+ | MAX1083ACUE+ | |
---|---|---|---|---|---|
描述 | analog to digital converters - adc 300/400ksps sgl-sply 4ch serial 10bit | analog to digital converters - adc 300/400ksps sgl-sply 4ch serial 10bit | analog to digital converters - adc 300/400ksps sgl-sply 4ch serial 10bit | analog to digital converters - adc 300/400ksps sgl-sply 4ch serial 10bit | analog to digital converters - adc 300/400ksps sgl-sply 4ch serial 10bit |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
包装说明 | TSSOP, | TSSOP, | 4.40 MM, 0.65 MM PITCH, MO-153AC, TSSOP-16 | TSSOP, | TSSOP, |
针数 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | compli | compli | compli | compli | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大模拟输入电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
长度 | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
最大线性误差 (EL) | 0.0488% | 0.0977% | 0.0977% | 0.0488% | 0.0488% |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
模拟输入通道数量 | 4 | 4 | 4 | 4 | 4 |
位数 | 10 | 10 | 10 | 10 | 10 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | - |
输出位码 | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY |
输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 0.3 MHz | 0.4 MHz | 0.3 MHz | 0.4 MHz | 0.3 MHz |
采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK |
座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
表面贴装 | YES | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | 30 | 30 |
宽度 | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | - | Maxim(美信半导体) |
Is Samacsys | N | - | N | - | N |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved