real time clock spi GP rtcc 2kb EE 64b sram eui-64
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Microchip(微芯科技) |
包装说明 | 3 X 3 MM, PLASTIC, MSOP-10 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 13 weeks |
其他特性 | ALSO OPEARTES AT 1.8V MIN SUPPLY AT 3MHZ CLOCK FREQ |
最大时钟频率 | 5 MHz |
JESD-30 代码 | S-PDSO-G10 |
JESD-609代码 | e3 |
长度 | 3 mm |
湿度敏感等级 | 1 |
端子数量 | 10 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
座面最大高度 | 1.1 mm |
最大供电电压 | 3.6 V |
最小供电电压 | 2.5 V |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 3 mm |
uPs/uCs/外围集成电路类型 | TIMER, REAL TIME CLOCK |
MCP79522T-I/MS | MCP79512T-I/MS | MCP79521T-I/MS | MCP79521T-I/MN | MCP79510T-I/MS | |
---|---|---|---|---|---|
描述 | real time clock spi GP rtcc 2kb EE 64b sram eui-64 | real time clock spi GP rtcc 1kb EE 64b sram eui-64 | real time clock spi GP rtcc 2kb EE 64b sram eui-48 | real time clock spi GP rtcc 2kb EE 64b sram eui-48 | real time clock spi GP rtcc 1kb EE 64b sram ID |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
包装说明 | 3 X 3 MM, PLASTIC, MSOP-10 | 3 X 3 MM, PLASTIC, MSOP-10 | 3 X 3 MM, PLASTIC, MSOP-10 | TDFN-10 | 3 X 3 MM, PLASTIC, MSOP-10 |
Reach Compliance Code | compli | compli | compli | compli | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Factory Lead Time | 13 weeks | 5 weeks | 13 weeks | 5 weeks | 13 weeks |
其他特性 | ALSO OPEARTES AT 1.8V MIN SUPPLY AT 3MHZ CLOCK FREQ | ALSO OPEARTES AT 1.8V MIN SUPPLY AT 3MHZ CLOCK FREQ | ALSO OPEARTES AT 1.8V MIN SUPPLY AT 3MHZ CLOCK FREQ | ALSO OPEARTES AT 1.8V MIN SUPPLY AT 3MHZ CLOCK FREQ | ALSO OPEARTES AT 1.8V MIN SUPPLY AT 3MHZ CLOCK FREQ |
最大时钟频率 | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz |
JESD-30 代码 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-N10 | S-PDSO-G10 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
端子数量 | 10 | 10 | 10 | 10 | 10 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | HVSON | TSSOP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | NOT SPECIFIED | 260 |
座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 0.8 mm | 1.1 mm |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
端子形式 | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | NOT SPECIFIED | 40 |
宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
uPs/uCs/外围集成电路类型 | TIMER, REAL TIME CLOCK | TIMER, REAL TIME CLOCK | TIMER, REAL TIME CLOCK | TIMER, REAL TIME CLOCK | TIMER, REAL TIME CLOCK |
湿度敏感等级 | 1 | 1 | 2 | - | 1 |
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