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72T3665L6-7BB

产品描述fifo 2.5V 4K X 36 fifo
产品类别半导体    其他集成电路(IC)   
文件大小365KB,共56页
制造商IDT(艾迪悌)
官网地址http://www.idt.com/
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72T3665L6-7BB概述

fifo 2.5V 4K X 36 fifo

72T3665L6-7BB规格参数

参数名称属性值
ManufactureIDT (Integrated Device Technology)
产品种类
Product Category
FIFO
RoHSN
电源电压-最大
Supply Voltage - Max
2.625 V
Supply Voltage - Mi2.375 V
封装 / 箱体
Package / Case
PBGA-208
系列
Packaging
Bulk

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2.5 VOLT HIGH-SPEED TeraSync
TM
FIFO 36-BIT CONFIGURATIONS
65,536 x 36
131,072 x 36
262,144 x 36
IDT72T36105
IDT72T36115
IDT72T36125
FEATURES:
Choose among the following memory organizations:
IDT72T36105
65,536 x 36
IDT72T36115
131,072 x 36
IDT72T36125
262,144 x 36
Up to 225 MHz Operation of Clocks
User selectable HSTL/LVTTL Input and/or Output
2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage
3.3V Input tolerant
Read Enable & Read Clock Echo outputs aid high speed operation
User selectable Asynchronous read and/or write port timing
Mark & Retransmit, resets read pointer to user marked position
Write Chip Select (WCS) input enables/disables Write operations
Read Chip Select (RCS) synchronous to RCLK
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Program programmable flags by either serial or parallel means
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Separate SCLK input for Serial programming of flag offsets
User selectable input and output port bus-sizing
- x36 in to x36 out
- x36 in to x18 out
- x36 in to x9 out
- x18 in to x36 out
- x9 in to x36 out
Big-Endian/Little-Endian user selectable byte representation
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function
Available in 240-pin (19mm x 19mm) Plastic Ball Grid Array (PBGA)
Easily expandable in depth and width
Independent Read and Write Clocks (permit reading and writing
simultaneously)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts are available, see ordering information
FUNCTIONAL BLOCK DIAGRAM
D
0
- D
n
(x36, x18 or x9)
WEN
WCL K/WR
WCS
LD
SEN
SCL K
INP UT REGISTER
OF F SET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
F WF T/SI
PF M
F SEL 0
F SEL 1
ASYW
WRITE CONTROL
L OGIC
RAM ARRAY
F L AG
L OGIC
WRITE P OINTER
BE
IP
BM
IW
OW
MRS
PRS
TCK
TRST
TMS
TDO
TDI
V ef
r
WHSTL
RHSTL
SHSTL
65,536 x 36
131,072 x36
262,144 x 36
READ P OINTER
CONTROL
L OGIC
BUS
CONF IGURATION
RESET
L OGIC
OUTP UT REGISTER
READ
CONTROL
L OGIC
RT
MARK
ASYR
J TAG CONTROL
(BOUNDARY SCAN)
RCL K/RD
REN
RCS
HSTL I/0
CONTROL
OE
EREN
5907 dr w01
Q
0
- Q
n
(x36, x18 or x9)
ERCL K
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The TeraSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©
2017 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
JUNE 2017
DSC-5907/21
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