analog switch ics 10ohm spst cmos analog switch
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
包装说明 | SON, SOLCC8,.12,25 |
Reach Compliance Code | compli |
Factory Lead Time | 6 weeks |
Is Samacsys | N |
模拟集成电路 - 其他类型 | SPST |
JESD-30 代码 | R-PDSO-N8 |
正常位置 | NO |
功能数量 | 1 |
端子数量 | 8 |
最大通态电阻 (Ron) | 33 Ω |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SON |
封装等效代码 | SOLCC8,.12,25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 12/+-15 V |
认证状态 | Not Qualified |
表面贴装 | YES |
最长接通时间 | 200 ns |
切换 | BREAK-BEFORE-MAKE |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | NO LEAD |
端子节距 | 0.635 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
MAX4656ETA+T | MAX4657EUA+ | MAX4658ESA+T | MAX4655EUA+T | MAX4656ESA+ | MAX4655ETA+ | MAX4657EUA+T | MAX4657ESA+T | MAX4656ESA+T | MAX4655ESA+ | |
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是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | compli | compli |
Factory Lead Time | 6 weeks | 6 weeks | 6 weeks | 1 week | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks |
Is Samacsys | N | N | N | N | N | N | N | N | N | N |
模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
包装说明 | SON, SOLCC8,.12,25 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | - | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | SOP, SOP8,.25 | HSOP, SOP8,.25 |
JESD-30 代码 | R-PDSO-N8 | S-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | - | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
正常位置 | NO | NC | NO | NC | NO | - | NC | NC | NO | NC |
功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 |
最大通态电阻 (Ron) | 33 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω | - | 10 Ω | 10 Ω | 10 Ω | 10 Ω |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SON | TSSOP | SOP | TSSOP | SOP | - | TSSOP | SOP | SOP | HSOP |
封装等效代码 | SOLCC8,.12,25 | TSSOP8,.19 | SOP8,.25 | TSSOP8,.19 | SOP8,.25 | - | TSSOP8,.19 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | - | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG |
电源 | 12/+-15 V | 12/+-15 V | 12/+-15 V | 12/+-15 V | 12/+-15 V | - | 12/+-15 V | 12/+-15 V | 12/+-15 V | 12/+-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | YES | - | YES | YES | YES | YES |
最长接通时间 | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | - | 200 ns | 200 ns | 200 ns | 200 ns |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.635 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | - | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
零件包装代码 | - | TSSOP | SOIC | TSSOP | SOIC | - | TSSOP | SOIC | SOIC | SOIC |
针数 | - | 8 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
JESD-609代码 | - | e3 | e3 | e3 | e3 | - | e3 | e3 | e3 | e3 |
长度 | - | 3 mm | 4.9 mm | 3 mm | 4.9 mm | - | 3 mm | 4.9 mm | 4.9 mm | 4.9 mm |
湿度敏感等级 | - | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
负电源电压最大值(Vsup) | - | -20 V | -20 V | -20 V | -20 V | - | -20 V | -20 V | -20 V | -20 V |
负电源电压最小值(Vsup) | - | -4.5 V | -4.5 V | -4.5 V | -4.5 V | - | -4.5 V | -4.5 V | -4.5 V | -4.5 V |
标称负供电电压 (Vsup) | - | -15 V | -15 V | -15 V | -15 V | - | -15 V | -15 V | -15 V | -15 V |
信道数量 | - | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
标称断态隔离度 | - | 77 dB | 77 dB | 77 dB | 77 dB | - | 77 dB | 77 dB | 77 dB | 77 dB |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 | 260 | NOT SPECIFIED | 260 | 260 | 260 | 260 |
座面最大高度 | - | 1.1 mm | 1.75 mm | 1.1 mm | 1.75 mm | - | 1.1 mm | 1.75 mm | 1.75 mm | 1.75 mm |
最大供电电压 (Vsup) | - | 20 V | 20 V | 20 V | 20 V | - | 20 V | 20 V | 20 V | 20 V |
最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | - | 15 V | 15 V | 15 V | 15 V | - | 15 V | 15 V | 15 V | 15 V |
最长断开时间 | - | 100 ns | 100 ns | 100 ns | 100 ns | - | 100 ns | 100 ns | 100 ns | 100 ns |
端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
处于峰值回流温度下的最长时间 | - | 30 | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 3 mm | 3.9 mm | 3 mm | 3.9 mm | - | 3 mm | 3.9 mm | 3.9 mm | 3.9 mm |
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