MAX9673
RELIABILITY REPORT
FOR
MAX9673ETI+T
PLASTIC ENCAPSULATED DEVICES
April 1, 2012
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Richard Aburano
Quality Assurance
Manager, Reliability Engineering
Maxim Integrated Products. All rights reserved.
Page 1
MAX9673
Conclusion
The MAX9673ETI+T successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
.....Attachments
I. Device Description
A. General
The MAX9672/MAX9673/MAX9674 output 12/14/16 voltage references for gamma correction in TFT LCDs and one voltage reference for VCOM. Each
gamma reference voltage has its own 10-bit DAC and buffer to ensure a stable voltage. The VCOM reference voltage has its own 10-bit DAC and an
amplifier to ensure a stable voltage when critical levels and patterns are displayed. The MAX9672/MAX9673 MAX9674 feature integrated multiple-time
programmable (MTP) memory to store gamma and VCOM values on the chip, eliminating the need for external EEPROM. The
MAX9672/MAX9673/MAX9674 support up to 300 write operations to the on-chip nonvolatile memory. The gamma outputs can drive 200mA peak
transient current and settle within 1µs. The VCOM output can provide 600mA peak transient current and also settles within 1µs. The analog supply
voltage range extends from 9V to 20V, and the digital supply voltage range extends from 2.7V to 3.6V. Gamma values and the VCOM value are
programmed into registers through the I²C interface.
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
IV. .......Die Information
Maxim Integrated Products. All rights reserved.
Page 2
MAX9673
II. Manufacturing Information
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
III. Packaging Information
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
J. Single Layer Theta Ja:
K. Single Layer Theta Jc:
L. Multi Layer Theta Ja:
M. Multi Layer Theta Jc:
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
SiO
2
Wafer Saw
99 X 101 mils
Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide)
Al/0.5%Cu with Ti/TiN Barrier
None
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
28-pin TQFN 5x5
Copper
100% matte Tin
Conductive
Au (1 mil dia.)
Epoxy with silica filler
#05-9000-3809
Class UL94-V0
Level 1
10-Bit, Programmable Gamma Reference Systems with MTP for TFT LCDs
S45
4548
USA
China, Taiwan and Thailand
July 25, 2009
47°C/W
2°C/W
29°C/W
2°C/W
Maxim Integrated Products. All rights reserved.
Page 3
MAX9673
V. Quality Assurance Information
A. Quality Assurance Contacts:
Richard Aburano (Manager, Reliability Engineering)
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
< 50 ppm
Mil-Std-105D
B. Outgoing Inspection Level:
C. Observed Outgoing Defect Rate:
D. Sampling Plan:
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate (
=
1
MTTF
=
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
) is calculated as follows:
= 22.9 x 10
= 22.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim's reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the S45 Process results in a FIT Rate of 0.06 @ 25C and 1.00 @ 55C (0.8 eV, 60% UCL)
B. E.S.D. and Latch-Up Testing
The DV26 die type has been found to have all pins able to withstand a transient pulse of:
ESD-HBM:
ESD-CDM:
ESD-MM:
+/- 2500V per JEDEC JESD22-A114 (lot TYXZAQ001E, D/C 0924)
+/- 750V per JEDEC JESD22-C101 (lot TYXZAQ001E, D/C 0924)
+/- 250V per JEDEC JESD22-A115 (lot TYXZAQ001B, D/C 0924)
Latch-Up testing has shown that this device withstands a current of +/- 250mA and overvoltage per JEDEC JESD78 (lot
TYXZAQ001D, D/C 0924).
Maxim Integrated Products. All rights reserved.
Page 4
MAX9673
Table 1
Reliability Evaluation Test Results
MAX9673ETI+T
TEST ITEM
TEST CONDITION
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
COMMENTS
Static Life Test
(Note 1)
Ta = 135C
Biased
Time = 192 hrs.
DC Parameters
& functionality
48
0
TYXZAQ001C, D/C 0923
Note 1: Life Test Data may represent plastic DIP qualification lots.
Maxim Integrated Products. All rights reserved.
Page 5
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
