analog to digital converters - adc 12-bit 100ksps 5.25v- precision adc
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | ROHS COMPLIANT, SOIC-24 |
| 针数 | 24 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 最大模拟输入电压 | 5 V |
| 最小模拟输入电压 | |
| 最长转换时间 | 10.4 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e3 |
| 长度 | 15.4 mm |
| 最大线性误差 (EL) | 0.024% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5,-12/-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |
| MAX172BEWG+ | MAX172AMRG/883B | MAX172AENG+ | MAX172AEWG+T | MAX172ACWG+ | MAX172BCWG+ | MAX172BCWG+T | MAX172ACWG+T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | analog to digital converters - adc 12-bit 100ksps 5.25v- precision adc | analog to digital converters - adc 12-bit 100ksps 5.25v- precision adc | analog to digital converters - adc 12-bit 100ksps 5.25v- precision adc | analog to digital converters - adc 12-bit 100ksps 5.25v- precision adc | analog to digital converters - adc 12-bit 100ksps 5.25v- precision adc | analog to digital converters - adc 12-bit 100ksps 5.25v- precision adc | analog to digital converters - adc 12-bit 100ksps 5.25v- precision adc | analog to digital converters - adc 12-bit 100ksps 5.25v- precision adc |
| 是否无铅 | 不含铅 | 含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | SOIC | DIP | DIP | - | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | ROHS COMPLIANT, SOIC-24 | CERDIP-24 | ROHS COMPLIANT, PLASTIC, DIP-24 | - | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 | SO-24 |
| 针数 | 24 | 24 | 24 | - | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compli | _compli | compli | - | compli | compli | compli | compliant |
| ECCN代码 | EAR99 | 3A001.A.2.C | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 最长转换时间 | 10.4 µs | 10.4 µs | 10.4 µs | - | 10.4 µs | 10.4 µs | 10.4 µs | 10.4 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDSO-G24 | R-GDIP-T24 | R-PDIP-T24 | - | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609代码 | e3 | e0 | e3 | - | e3 | e3 | e3 | e3 |
| 长度 | 15.4 mm | - | 30.545 mm | - | 15.4 mm | 15.4 mm | 15.4 mm | 15.4 mm |
| 最大线性误差 (EL) | 0.024% | 0.018% | 0.0122% | - | 0.012% | 0.024% | 0.024% | 0.012% |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 模拟输入通道数量 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | - | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | - | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 125 °C | 85 °C | - | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出位码 | BINARY | BINARY | BINARY | - | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP | - | SOP | SOP | SOP | SOP |
| 封装等效代码 | SOP24,.4 | - | DIP24,.3 | - | SOP24,.4 | SOP24,.4 | SOP24,.4 | SOP24,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 240 | 260 | - | 260 | 260 | 260 | 260 |
| 电源 | 5,-12/-15 V | - | 5,-12/-15 V | - | 5,-12/-15 V | 5,-12/-15 V | 5,-12/-15 V | 5,-12/-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 5.08 mm | 4.572 mm | - | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | - | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | INDUSTRIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | TIN LEAD | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 20 | 30 | - | 30 | 30 | 30 | NOT SPECIFIED |
| 宽度 | 7.5 mm | 7.62 mm | 7.62 mm | - | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm |
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