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| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC28,.2SQ,20 |
| 针数 | 28 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 17 weeks |
| Is Samacsys | N |
| 最大模拟输入电压 | 2.65 V |
| 最小模拟输入电压 | -0.5 V |
| 转换器类型 | A/D CONVERTER |
| JESD-30 代码 | S-XQCC-N28 |
| JESD-609代码 | e3 |
| 长度 | 5 mm |
| 最大线性误差 (EL) | 0.0977% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 16 |
| 位数 | 10 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | 2'S COMPLEMENT BINARY |
| 输出格式 | SERIAL |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC28,.2SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 采样速率 | 0.3 MHz |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 0.8 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5 mm |
| Base Number Matches | 1 |
| MAX1030BCTI+ | MAX1030BEEG+T | MAX1028BEEP+T | MAX1030BETI+ | MAX1028BCEP+ | MAX1030BCEG+ | MAX1030BEEG+ | MAX1026BCEE+ | |
|---|---|---|---|---|---|---|---|---|
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| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QFN | SOIC | QSOP | QFN | SSOP | SSOP | SOIC | SSOP |
| 包装说明 | HVQCCN, LCC28,.2SQ,20 | SSOP, SSOP24,.24 | SSOP, SSOP20,.25 | HVQCCN, LCC28,.2SQ,20 | SSOP, SSOP20,.25 | SSOP, SSOP24,.24 | SSOP, SSOP24,.24 | SSOP, SSOP16,.25 |
| 针数 | 28 | 24 | 20 | 28 | 20 | 24 | 24 | 16 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 2.65 V | 2.084 V | 2.084 V | 2.65 V | 2.65 V | 2.65 V | 2.084 V | 2.65 V |
| 最小模拟输入电压 | -0.5 V | -2.084 V | -2.084 V | -0.5 V | -0.5 V | -0.5 V | -2.084 V | -0.5 V |
| 转换器类型 | A/D CONVERTER | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER | ADC, SUCCESSIVE APPROXIMATION | A/D CONVERTER |
| JESD-30 代码 | S-XQCC-N28 | R-PDSO-G24 | R-PDSO-G20 | S-XQCC-N28 | R-PDSO-G20 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G16 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 5 mm | 8.65 mm | 8.65 mm | 5 mm | 8.66 mm | 8.64 mm | 8.65 mm | 4.9 mm |
| 最大线性误差 (EL) | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 模拟输入通道数量 | 16 | 16 | 12 | 16 | 12 | 16 | 16 | 8 |
| 位数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 24 | 20 | 28 | 20 | 24 | 24 | 16 |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| 输出位码 | 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | 2'S COMPLEMENT BINARY | 2'S COMPLEMENT BINARY | 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | SSOP | SSOP | HVQCCN | SSOP | SSOP | SSOP | SSOP |
| 封装等效代码 | LCC28,.2SQ,20 | SSOP24,.24 | SSOP20,.25 | LCC28,.2SQ,20 | SSOP20,.25 | SSOP24,.24 | SSOP24,.24 | SSOP16,.25 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 0.3 MHz | 0.3 MHz | 0.3 MHz | 0.3 MHz | 0.3 MHz | 0.3 MHz | 0.3 MHz | 0.3 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 0.8 mm | 1.75 mm | 1.75 mm | 0.8 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN |
| 端子形式 | NO LEAD | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.635 mm | 0.635 mm | 0.5 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 5 mm | 3.9 mm | 3.9 mm | 5 mm | 3.89 mm | 3.89 mm | 3.9 mm | 3.89 mm |
| Factory Lead Time | 17 weeks | 17 weeks | 17 weeks | 17 weeks | 17 weeks | 18 weeks | 6 weeks | - |
| Is Samacsys | N | N | N | N | N | N | N | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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